JPS62178575U - - Google Patents
Info
- Publication number
- JPS62178575U JPS62178575U JP6706186U JP6706186U JPS62178575U JP S62178575 U JPS62178575 U JP S62178575U JP 6706186 U JP6706186 U JP 6706186U JP 6706186 U JP6706186 U JP 6706186U JP S62178575 U JPS62178575 U JP S62178575U
- Authority
- JP
- Japan
- Prior art keywords
- component mounting
- electronic component
- soldering
- solder resist
- conductive foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6706186U JPS62178575U (ko) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6706186U JPS62178575U (ko) | 1986-04-30 | 1986-04-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62178575U true JPS62178575U (ko) | 1987-11-12 |
Family
ID=30905624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6706186U Pending JPS62178575U (ko) | 1986-04-30 | 1986-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62178575U (ko) |
-
1986
- 1986-04-30 JP JP6706186U patent/JPS62178575U/ja active Pending
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