JPS62178544U - - Google Patents
Info
- Publication number
- JPS62178544U JPS62178544U JP1986066643U JP6664386U JPS62178544U JP S62178544 U JPS62178544 U JP S62178544U JP 1986066643 U JP1986066643 U JP 1986066643U JP 6664386 U JP6664386 U JP 6664386U JP S62178544 U JPS62178544 U JP S62178544U
- Authority
- JP
- Japan
- Prior art keywords
- island
- lead portions
- recess
- semiconductor
- outer periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986066643U JPS62178544U (enExample) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986066643U JPS62178544U (enExample) | 1986-04-30 | 1986-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62178544U true JPS62178544U (enExample) | 1987-11-12 |
Family
ID=30904840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986066643U Pending JPS62178544U (enExample) | 1986-04-30 | 1986-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62178544U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5596666A (en) * | 1979-01-18 | 1980-07-23 | Mitsubishi Electric Corp | Method of fabricating semiconductor device substrate |
| JPS5632459B2 (enExample) * | 1979-05-31 | 1981-07-28 |
-
1986
- 1986-04-30 JP JP1986066643U patent/JPS62178544U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5596666A (en) * | 1979-01-18 | 1980-07-23 | Mitsubishi Electric Corp | Method of fabricating semiconductor device substrate |
| JPS5632459B2 (enExample) * | 1979-05-31 | 1981-07-28 |