JPS62178543U - - Google Patents
Info
- Publication number
- JPS62178543U JPS62178543U JP1986066642U JP6664286U JPS62178543U JP S62178543 U JPS62178543 U JP S62178543U JP 1986066642 U JP1986066642 U JP 1986066642U JP 6664286 U JP6664286 U JP 6664286U JP S62178543 U JPS62178543 U JP S62178543U
- Authority
- JP
- Japan
- Prior art keywords
- island
- protrusion
- preform material
- semiconductor
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986066642U JPS62178543U (cg-RX-API-DMAC10.html) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986066642U JPS62178543U (cg-RX-API-DMAC10.html) | 1986-04-30 | 1986-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62178543U true JPS62178543U (cg-RX-API-DMAC10.html) | 1987-11-12 |
Family
ID=30904838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986066642U Pending JPS62178543U (cg-RX-API-DMAC10.html) | 1986-04-30 | 1986-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62178543U (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023166740A (ja) * | 2022-05-10 | 2023-11-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53115175A (en) * | 1977-03-18 | 1978-10-07 | Toshiba Corp | Semiconductor device |
| JPS5596666A (en) * | 1979-01-18 | 1980-07-23 | Mitsubishi Electric Corp | Method of fabricating semiconductor device substrate |
| JPS57128052A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Semiconductor device |
| JPS5910249A (ja) * | 1982-07-09 | 1984-01-19 | Nec Corp | 半導体装置用リ−ドフレ−ム |
-
1986
- 1986-04-30 JP JP1986066642U patent/JPS62178543U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53115175A (en) * | 1977-03-18 | 1978-10-07 | Toshiba Corp | Semiconductor device |
| JPS5596666A (en) * | 1979-01-18 | 1980-07-23 | Mitsubishi Electric Corp | Method of fabricating semiconductor device substrate |
| JPS57128052A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Semiconductor device |
| JPS5910249A (ja) * | 1982-07-09 | 1984-01-19 | Nec Corp | 半導体装置用リ−ドフレ−ム |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023166740A (ja) * | 2022-05-10 | 2023-11-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |