JPS62177189A - Method for local reforming of solid surface by plasma - Google Patents
Method for local reforming of solid surface by plasmaInfo
- Publication number
- JPS62177189A JPS62177189A JP61019460A JP1946086A JPS62177189A JP S62177189 A JPS62177189 A JP S62177189A JP 61019460 A JP61019460 A JP 61019460A JP 1946086 A JP1946086 A JP 1946086A JP S62177189 A JPS62177189 A JP S62177189A
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- magnetic field
- gaseous pressure
- solid surface
- low gaseous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007787 solid Substances 0.000 title claims abstract description 8
- 238000000034 method Methods 0.000 title claims description 8
- 238000002407 reforming Methods 0.000 title 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 16
- 229910052799 carbon Inorganic materials 0.000 abstract description 16
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 238000003763 carbonization Methods 0.000 abstract description 2
- 230000004992 fission Effects 0.000 abstract 1
- 238000011328 necessary treatment Methods 0.000 abstract 1
- 230000002194 synthesizing effect Effects 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 8
- 230000004927 fusion Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910002090 carbon oxide Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010000 carbonizing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は固体表面の局部を改質(エツチング、デポジシ
ョン等)する方法に係わるものであり、半導体、プラス
チック、光学機械等工業の広範な分野に関係する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for locally modifying a solid surface (etching, deposition, etc.), and is applicable to a wide range of industries such as semiconductors, plastics, and optical machinery. related to the field.
(従来技術)
プラズマ・プロセッシングにおいては、マスク等を施す
ことなしには、局部的に特定の作業を行うことは一般に
困難である。例えば核融合装置の第1壁(プラズマに直
接面する壁面)に炭素膜を形成する場合、プラズマ観測
窓(石英、サファイヤ等)表面上への形成は避けたいが
、/ヤックー等を設ける以外にはさけられない。シャッ
ター等を設けずに形成した場合、これをプラズマ化学的
に(水素プラズマや酸素プラズマを用い)除去できるが
、窓部分の炭素膜を除去しようとすれば、他の必要な部
分の炭素膜も消失して了う。(Prior Art) In plasma processing, it is generally difficult to perform specific operations locally without applying a mask or the like. For example, when forming a carbon film on the first wall of a nuclear fusion device (the wall directly facing the plasma), it is desirable to avoid forming it on the surface of the plasma observation window (quartz, sapphire, etc.), but I can't avoid it. If the film is formed without a shutter, etc., it can be removed using plasma chemistry (using hydrogen plasma or oxygen plasma), but if you try to remove the carbon film on the window, it will also remove the carbon film on other necessary parts. It disappears and ends.
(本発明が解決しようとする問題点)
本発明においては、所要のプロセシング用プラズマを゛
[ν定の位置に発生させ、これを制御する事によって、
固体壁土で異なった場所に異なった処理を施こすことを
可能にしようとするものである。(Problems to be Solved by the Present Invention) In the present invention, by generating a required processing plasma at a fixed position and controlling it,
The idea is to make it possible to apply different treatments to different locations using solid wall soil.
これを核融合装置のカーボナインヨン(第1壁面上に炭
素11りを形成するプロセンングを言う)を例にとって
1;’)’e明する。核融合装置の第1壁は高温プラズ
マから出て来る高エネルギー粒子にさらされているから
、壁面の材料原子がスパッタされる。This will be explained by taking as an example a carbon oxide (a process in which carbon oxide is formed on the first wall surface) of a nuclear fusion device. Since the first wall of the fusion device is exposed to high-energy particles coming out of the high-temperature plasma, material atoms on the wall surface are sputtered.
長時間運転を行なうとスパッタ粒子としての酸累や金属
原子がプラズマに入り込みこれを放射冷却し、プラズマ
を崩壊さげる。従ってこれら不純物の減少が本質的に重
要である。When operated for a long time, acid particles and metal atoms in the form of sputtered particles enter the plasma and cool it radiatively, causing the plasma to collapse. Therefore, reduction of these impurities is of essential importance.
最近上記不純物の低減策の一つとして、高温プラズマ発
生に先立って、C11,等の炭化水素を導入し、グロー
放電等を行なってカーボナイシヨンを実施して、高温プ
ラズマ中の純度を著しく改善している。しかし、この手
法を行うと、炭素膜付ηが好ましくない観測窓、高圧碍
子表面、高周波導入窓もカーボナイズされるので、これ
を防ぐために複雑で高価なンヤソタが必要である。Recently, as one of the measures to reduce the above-mentioned impurities, hydrocarbons such as C11 are introduced prior to high-temperature plasma generation, and carbonization is performed by performing glow discharge, etc., and the purity in high-temperature plasma is significantly improved. are doing. However, when this method is carried out, the observation window, high-voltage insulator surface, and high-frequency introduction window, where carbon film η is not desirable, are also carbonized, so a complicated and expensive coating is required to prevent this.
本発明においては、例えばカーボナイ/ヨンを行なった
後、観測窓等の局部近傍に除去用プラズマ(水素あるい
は酸累プラズマ)を生成させ、この部分のみ炭素膜を除
去し、池の必要な部分:よ変化さけない様にしようとす
る方法を提供するものである。In the present invention, for example, after carbonation/ion is performed, a removal plasma (hydrogen or oxidized plasma) is generated in the local vicinity of an observation window, etc., and the carbon film is removed only in this part, and the necessary parts of the pond are: It provides a method to minimize changes.
(問題を解決するための手段)
本発明においてはプロセッシング・プラズマを電子サイ
クロトロン共鳴(ECR)法で発生させる。ECRプラ
ズマは放電空間にE CR6+’を界(マイクロ波周波
数fとr −c[lC/2πmの関係にある磁界flC
1こ5でeとmは電子の電荷と質1貰)が存在しない限
り発生しない。又プラズマの生成は[EC1’1面近傍
で行われ、又できたプラズマは磁力線に沿って運動する
から、プラズマの存在範囲はECR面と磁力線の形で決
まり局限される。例えば第1図の様に大気と低ガス圧部
が壁Wで仕切られていて、低ガス圧側にマイクロ波が入
射されているとする。大気圧側から所定の強さを持つ円
板状の永久磁石PM1をP、の位置に近づけて行くと、
低ガス圧部のこの附近の磁界の値は序々に上り、BCR
磁界に達すると低ガス圧部の気体分子は電1雄されプラ
ズマPLが発生ずる。PMの磁力線は略々図に示す(シ
ロな形をしているので、図中斜線で示した(・、′ρな
プラズマが現れる。(Means for Solving the Problem) In the present invention, processing plasma is generated by electron cyclotron resonance (ECR) method. ECR plasma produces an ECR6+' field in the discharge space (a magnetic field flC with a relationship between the microwave frequency f and r - c [lC/2πm).
In 1 ko 5, e and m do not occur unless the electron's charge and quality 1 ko exist. Furthermore, since plasma is generated near the [EC1'1 plane and the generated plasma moves along the lines of magnetic force, the range in which the plasma exists is determined and localized by the ECR plane and the lines of magnetic force. For example, as shown in FIG. 1, it is assumed that the atmosphere and the low gas pressure area are separated by a wall W, and the microwave is incident on the low gas pressure side. When a disk-shaped permanent magnet PM1 with a predetermined strength is brought closer to position P from the atmospheric pressure side,
The value of the magnetic field near this area of low gas pressure gradually increases, and the BCR
When the magnetic field is reached, the gas molecules in the low gas pressure section are electrically charged and plasma PL is generated. The magnetic field lines of PM are roughly shown in the figure (they have a white shape, so they are indicated by diagonal lines in the figure) (·, 'ρ plasma appears.
(作 用)
プラズマを局在化させることによって、固体表面はその
プラズマとの反応により、局部的な改質を受ける。例え
ば第1図のPl にPMを配置した時の供給ガスを[
11,とすればP、の近傍の表面には炭素膜が生成され
、次いで磁石をB2に移し02を供給すれば、B2 近
傍の表面に酸化層が出来る。(Function) By localizing the plasma, the solid surface undergoes local modification through reaction with the plasma. For example, the supply gas when PM is placed at Pl in Figure 1 is [
11, a carbon film will be generated on the surface near P, and if the magnet is then transferred to B2 and 02 is supplied, an oxide layer will be formed on the surface near B2.
(効 果)
この(羞に局部的なプラズマ反応を利用する事によって
、固体表面全体の機能を高める事ができる。(Effect) By using this local plasma reaction, the functionality of the entire solid surface can be enhanced.
核融合装置δの例で言えば、第1璧全体は炭素膜で蔽わ
れて不純物の減少に役立ち、計測等に必要な局部の炭素
)IQは除去し、全体として合理的な動作をする訳であ
る。Taking the example of the nuclear fusion device δ, the entire first wall is covered with a carbon film, which helps reduce impurities, and removes the local carbon (IQ) necessary for measurements, etc., so that it operates rationally as a whole. It is.
(実施例) 第2図は、本発明による炭素除去実験の説明図である。(Example) FIG. 2 is an explanatory diagram of a carbon removal experiment according to the present invention.
放電管DTには枝管BTがつけられ、真空ポンプで排気
しつ〜ガスが導入され、10−’Pa台の圧力に保たれ
た。マイクロ波は2−45Gllz の周波数のもので
あり、放電管DTには共鳴磁界B。A branch pipe BT was attached to the discharge tube DT, which was evacuated using a vacuum pump, and gas was introduced into the tube to maintain a pressure on the order of 10-'Pa. The microwave has a frequency of 2-45 Gllz, and a resonant magnetic field B is applied to the discharge tube DT.
がかけられる。サンプルは石英板CPで、先ず、光の透
過特性をとり、次に放電管内部の位置P3にこれを置き
、B5をかけCI+、とH2の混合ガスで放電を行ない
、石英板CP表面に炭素膜をつける。is applied. The sample is a quartz plate CP. First, the light transmission characteristics are measured, and then it is placed at position P3 inside the discharge tube. B5 is applied, and a discharge is performed with a mixed gas of CI+ and H2, and carbon is formed on the surface of the quartz plate CP. Apply a membrane.
再び光の透過特性をとり、次いでサンプルを枝管BTの
位置P、に設置し、これをはさむ様にフェライトlid
石PM2、PM2′を対向させて置き局F;13磁界を
かける。この場合枝管BT内部の磁界:ま0とする。純
粋のH2を供給してプラズマPLを局部的につけて炭素
膜を除去し、その後玉度目の光透過特性をとる。以上の
三回の光透過特性測定の結果を第3図に示す。炭素膜を
つけると紫外2jlSの吸収が大巾に増すが、これは水
素プラズマで除去され殆んど元に戻っているのが判る。The light transmission characteristics are measured again, and then the sample is placed at position P of the branch pipe BT, and a ferrite lid is placed between the samples.
Stones PM2 and PM2' are placed opposite each other and a magnetic field is applied to station F;13. In this case, the magnetic field inside the branch pipe BT is assumed to be 0. Pure H2 is supplied and plasma PL is applied locally to remove the carbon film, after which a smooth light transmission characteristic is obtained. The results of the above three measurements of the light transmission characteristics are shown in FIG. It can be seen that when a carbon film is attached, the absorption of ultraviolet 2JlS increases greatly, but this is removed by hydrogen plasma and almost returns to its original state.
この結果は局部に所ザのプロセッシングプラズマを作っ
て必要な処理を局部的に行えるという考え方の正しさを
証明している。This result proves the correctness of the idea that necessary processing can be performed locally by creating a local processing plasma.
上述の1悦明からすでに明白であるが、核融合゛装置の
第1壁にカーボニゼイションを施すことによって、観測
窓にも形成された炭素膜を除去すること以外に、本発明
は半導体製造装置の観測窓の清浄化、半導体基板自体の
清浄化にも同様にして有効である。半導体基板に対して
エツチングあるいは成膜を施す場合においては、基板の
みに対してエツチングあるいは成膜を施すことができる
ので、基板の真空室内壁物質による汚染あるいは真空室
内壁への成膜物質の堆積を極力さけることができる。更
には、同一反応室中に設置された複数の基板の各々に異
なった物質膜を形成することもできる。As is already clear from the above-mentioned example, in addition to removing the carbon film formed also on the observation window by carbonizing the first wall of the nuclear fusion device, the present invention also applies to semiconductors. It is similarly effective for cleaning observation windows of manufacturing equipment and for cleaning semiconductor substrates themselves. When etching or forming a film on a semiconductor substrate, it is possible to perform etching or film formation only on the substrate, so there is no possibility of contamination of the substrate by the vacuum chamber wall material or deposition of the film forming material on the vacuum chamber wall. can be avoided as much as possible. Furthermore, different material films can be formed on each of a plurality of substrates installed in the same reaction chamber.
第1図は局在化したプラズマをECR法で作る原理説明
図、
第2図は実施例の概略図、乃ち核融合装置の第1!’i
;に炭素膜をつけた場合、観σII+窓に汚れが生ずる
が局在化した水累プラズマでこれを除去しようという思
想で行われた実験の装置の概略図、第3図、実施例の結
果を示すクラ7てあり、炭素膜を石英板につけると紫外
部の吸収が増大し、これを局部プラズマで除くと回復す
る事を示している。
DT・・・・・・放電管、
py+、、P’vI2、PM2’ ・・・・・磁石、
BT・・・・・・枝管、PL・・・・・・プラズマ、W
・・・・・づ:1テ。Figure 1 is an explanatory diagram of the principle of creating localized plasma using the ECR method, and Figure 2 is a schematic diagram of an embodiment, or the first example of a nuclear fusion device. 'i
When a carbon film is applied to the σII+ window, stains will occur on the window, but this is a schematic diagram of the experimental equipment carried out with the idea of removing this using localized water plasma, Figure 3, and the results of the example Figure 7 shows that when a carbon film is attached to a quartz plate, the absorption of ultraviolet light increases, and when this is removed by local plasma, it is recovered. DT...Discharge tube, py+, P'vI2, PM2'...Magnet,
BT...Branch pipe, PL...Plasma, W
・・・・・・zu:1te.
Claims (1)
の磁界を与え、その近傍に電子サイクロトロン共鳴プラ
ズマを生成させ、その部分のみを改質する方法。A method of applying a required magnetic field from the atmospheric pressure side to a local part of the solid surface to be modified, generating electron cyclotron resonance plasma in the vicinity, and modifying only that part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61019460A JP2604134B2 (en) | 1986-01-31 | 1986-01-31 | Local modification method of inner wall of vacuum equipment by plasma |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61019460A JP2604134B2 (en) | 1986-01-31 | 1986-01-31 | Local modification method of inner wall of vacuum equipment by plasma |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62177189A true JPS62177189A (en) | 1987-08-04 |
JP2604134B2 JP2604134B2 (en) | 1997-04-30 |
Family
ID=11999931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61019460A Expired - Fee Related JP2604134B2 (en) | 1986-01-31 | 1986-01-31 | Local modification method of inner wall of vacuum equipment by plasma |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2604134B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0250985A (en) * | 1988-08-11 | 1990-02-20 | Semiconductor Energy Lab Co Ltd | Cleaning method of equipment for forming film made of carbon or material mainly composed of carbon |
US7804968B2 (en) | 2004-05-19 | 2010-09-28 | Kabushiki Kaisha Audio-Technica | Condenser microphone |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56123381A (en) * | 1980-01-24 | 1981-09-28 | Fujitsu Ltd | Method and device for plasma etching |
-
1986
- 1986-01-31 JP JP61019460A patent/JP2604134B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56123381A (en) * | 1980-01-24 | 1981-09-28 | Fujitsu Ltd | Method and device for plasma etching |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0250985A (en) * | 1988-08-11 | 1990-02-20 | Semiconductor Energy Lab Co Ltd | Cleaning method of equipment for forming film made of carbon or material mainly composed of carbon |
US7804968B2 (en) | 2004-05-19 | 2010-09-28 | Kabushiki Kaisha Audio-Technica | Condenser microphone |
Also Published As
Publication number | Publication date |
---|---|
JP2604134B2 (en) | 1997-04-30 |
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