JPS62177048U - - Google Patents
Info
- Publication number
- JPS62177048U JPS62177048U JP1986064953U JP6495386U JPS62177048U JP S62177048 U JPS62177048 U JP S62177048U JP 1986064953 U JP1986064953 U JP 1986064953U JP 6495386 U JP6495386 U JP 6495386U JP S62177048 U JPS62177048 U JP S62177048U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor device
- bands
- band
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986064953U JPS62177048U (enExample) | 1986-04-28 | 1986-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986064953U JPS62177048U (enExample) | 1986-04-28 | 1986-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62177048U true JPS62177048U (enExample) | 1987-11-10 |
Family
ID=30901580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986064953U Pending JPS62177048U (enExample) | 1986-04-28 | 1986-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62177048U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015133363A (ja) * | 2014-01-09 | 2015-07-23 | 株式会社カネカ | 光半導体用リードフレーム、光半導体用樹脂成形体及びその製造方法、光半導体パッケージ並びに光半導体装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5517382B2 (enExample) * | 1975-03-03 | 1980-05-10 | ||
| JPS576252B2 (enExample) * | 1975-06-24 | 1982-02-04 | ||
| JPS5923534A (ja) * | 1982-07-30 | 1984-02-07 | Hitachi Ltd | 半導体装置の製造方法 |
| JPS5929442A (ja) * | 1982-08-10 | 1984-02-16 | Mitsubishi Electric Corp | 半導体装置用リ−ドフレ−ム |
-
1986
- 1986-04-28 JP JP1986064953U patent/JPS62177048U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5517382B2 (enExample) * | 1975-03-03 | 1980-05-10 | ||
| JPS576252B2 (enExample) * | 1975-06-24 | 1982-02-04 | ||
| JPS5923534A (ja) * | 1982-07-30 | 1984-02-07 | Hitachi Ltd | 半導体装置の製造方法 |
| JPS5929442A (ja) * | 1982-08-10 | 1984-02-16 | Mitsubishi Electric Corp | 半導体装置用リ−ドフレ−ム |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015133363A (ja) * | 2014-01-09 | 2015-07-23 | 株式会社カネカ | 光半導体用リードフレーム、光半導体用樹脂成形体及びその製造方法、光半導体パッケージ並びに光半導体装置 |