JPS62176856A - Recording head - Google Patents

Recording head

Info

Publication number
JPS62176856A
JPS62176856A JP1989586A JP1989586A JPS62176856A JP S62176856 A JPS62176856 A JP S62176856A JP 1989586 A JP1989586 A JP 1989586A JP 1989586 A JP1989586 A JP 1989586A JP S62176856 A JPS62176856 A JP S62176856A
Authority
JP
Japan
Prior art keywords
electrode
recording
film
layer
recording head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989586A
Other languages
Japanese (ja)
Inventor
Kazuhiro Kimura
和博 木村
Toshiichi Nagaura
長浦 歳一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989586A priority Critical patent/JPS62176856A/en
Publication of JPS62176856A publication Critical patent/JPS62176856A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335Structure of thermal heads

Landscapes

  • Electronic Switches (AREA)

Abstract

PURPOSE:To prevent the deterioration in printing grade caused by the abrasion of the leading end part of a head due to printing, by forming a film, wherein high hardness fine particles are uniformly dispersed in an Ni-P alloy, on an insulating substrate material to use the same as an electrode. CONSTITUTION:A composite plating layer, wherein a fine particulate powder of tungsten carbide are uniformly coprecipitated and dispersed in a plating film by growing electroless nickel plating while the fine particulate powder of tungsten carbide is stirred in an electroless nickel plating bath containing a phosphorus component, is formed on an alumina ceramics substrate 8 and photoetching or laser processing is applied to said plating layer to remove unnecessary parts to form a plurality of electrode patterns which are, in turn, heat-treated, for example, at 250-550 deg.C for 20min-1.5hr. Thus formed electrode is excellent in abrasion resistance because of its extremely high hardness, for example, H1=1,000-1,400.

Description

【発明の詳細な説明】 く技術分野〉 本発明は特に抵抗層、導電層、インク層を層設してなる
フィルムの抵抗層に電極を接触し、通電して上記フィル
ムのインク層からインクを普通紙へ転写する通電転写記
録方式のプリンターの記録ヘッド、若しくは抵抗層、導
電層を層設してなるフィルムの抵抗層に電極を接触し、
通電して上記フィルムの導電層に密着させた感熱紙を発
色せしめる感熱記録方式のプリンターの記録ヘッド、若
しくは放電記録方式のプリンターの記録ヘッドとして用
いて好適な記録ヘッドに関する。
[Detailed Description of the Invention] Technical Field> The present invention is particularly concerned with contacting an electrode with a resistive layer of a film formed by layering a resistive layer, a conductive layer, and an ink layer, and applying electricity to remove ink from the ink layer of the film. An electrode is brought into contact with the recording head of a printer using an electric transfer recording method that transfers onto plain paper, or the resistive layer of a film formed by layering a resistive layer and a conductive layer,
The present invention relates to a recording head that is suitable for use as a recording head for a thermal recording type printer or a discharge recording type printer that colors thermal paper that is brought into close contact with the conductive layer of the film by applying electricity.

〈従来技術〉 近年、ドツトマトリックス形式の印字装置において、印
字品位の向上要求から記録ヘッドの記録針の高密度配置
化が必要になっている。具体的には8〜10本/一本土
−必要と言われている。
<Prior Art> In recent years, in dot matrix printing devices, it has become necessary to arrange the recording needles of the recording head at a higher density due to the demand for improved printing quality. Specifically, it is said that 8 to 10 trees per mainland are required.

そのため抵抗層、導電層、インク層等を層設してなる通
電転写フィルムの上記抵抗層に対し記録電極を接触せし
め、該記録電極への通電によって上記抵抗層を発熱させ
、上記通電転写フィルムのインクを熔融して記録紙に転
写して記録を行う通電転写記録装置においても、上記記
録針の高密度配置化に伴い、記録針の微細化が課題とな
っている。しかし、この記録針の微細化に際し、微細加
工技術、記録針保持構造1強度、寿命等の解決すべき問
題点は多い。
For this purpose, a recording electrode is brought into contact with the resistance layer of the current transfer film, which is formed by layering a resistance layer, a conductive layer, an ink layer, etc., and the resistance layer is made to generate heat by applying current to the recording electrode. Even in electrical transfer recording apparatuses that perform recording by melting ink and transferring it to recording paper, miniaturization of the recording needles has become an issue as the recording needles are arranged in a higher density. However, when miniaturizing the recording stylus, there are many problems that need to be solved, such as microfabrication technology, strength of the recording stylus holding structure 1, and life span.

既に、上記通電転写記録装置の記録ヘッドの高密度化を
実現したものとして、ポリイミド可撓性基板上にタング
ステン箔層を接着剤により貼付け、次にエツチング加工
して記録電極を形成したものがある。しかし、このよう
にして作成した記録へラドは、記録電極の保持が接着剤
によって行なわれていること、及びその接着面積も電極
幅が0.05上m程度の為に、保持強度が極めて弱いと
いう欠点があり、よってプリント時やクリーニング時に
記録電極が脱落するという問題があった0 本発明者等はこのような問題点を解決し、記録電極の強
度を向上させるべく以下の構成の記録ヘッドを提案して
いる(特願昭60−250243号)。
There is already a device that has achieved high density recording heads in the above-mentioned current transfer recording devices, in which a tungsten foil layer is pasted with an adhesive onto a flexible polyimide substrate, and then etched to form recording electrodes. . However, the recording electrode created in this way has extremely weak holding strength because the recording electrode is held by adhesive and the adhesive area is about 0.05 m above the electrode width. As a result, there was a problem that the recording electrodes would fall off during printing or cleaning.The inventors of the present invention have developed a recording head with the following configuration in order to solve these problems and improve the strength of the recording electrodes. (Japanese Patent Application No. 60-250243).

第2図はその記録ヘッドの構造を示す平面図である。同
図において1はアルミナセラミックス層であり、2はタ
ングステンの電極である。
FIG. 2 is a plan view showing the structure of the recording head. In the figure, 1 is an alumina ceramic layer, and 2 is a tungsten electrode.

この記録ヘッドの製造は、まず、未焼成のセラミック層
1上に、タングステン等の電極材粉末。
To manufacture this recording head, first, powder of an electrode material such as tungsten is placed on an unfired ceramic layer 1.

バインダー及び溶剤等からなる電極層2を、印刷等の手
法で所定の厚さに被覆したものを、還元雰囲気中で高温
焼成する。
An electrode layer 2 made of a binder, a solvent, etc. is coated to a predetermined thickness by a method such as printing, and then fired at a high temperature in a reducing atmosphere.

このように、セラミックス焼結とタングステン等の電極
材料の焼き付けを同時に行うことにより、セラミックス
層と電極材料層との間に拡散中間層が形成されるため、
強固な結合がなされ、その結果、強度の優れた基板を得
る事が出来る。
In this way, by simultaneously sintering the ceramic and baking the electrode material such as tungsten, a diffusion intermediate layer is formed between the ceramic layer and the electrode material layer.
A strong bond is formed, and as a result, a substrate with excellent strength can be obtained.

上記の処理によって焼き付けが為された電極層2に対し
、公知のフォトエツチング加工あるいはレーザ加工を施
す事により、不要部分を除去して記録電極パターンを形
成し、記録ヘッドとした。
The electrode layer 2 baked by the above process was subjected to known photoetching or laser processing to remove unnecessary portions and form a recording electrode pattern, thereby forming a recording head.

以上の構造の記録ヘッドは確かに電極脱落の問題がなく
、信頼性を大巾に向上できるものであった。しかし、電
極材料の硬度が今一つ充分なものでない為、例えば第3
図に示す様に記録紙3に通電転写フィルム4を記録ヘッ
ド6により圧接した状態で記録ヘッド6に通電しインク
5を記録紙3に印字すると、記録ヘッド6は常時圧接状
態で移動して印字を行う為記録ヘッド6の先端部は常に
摩擦状態であり、よって先端部の電極材のみが摩耗して
行き、長い間使用していると電極部分が第4図(a)の
状態から第4図(b)の状態に変化し、アルミナセラミ
ックス層1と電極層2との間に段差が生じ、その結果と
してヘッドタッチが悪くなり、印字状態が劣化するとい
う問題が生じた。更にヘッドの寿命も短いものであった
The recording head with the above structure certainly did not have the problem of electrodes falling off, and its reliability could be greatly improved. However, because the hardness of the electrode material is not quite sufficient, for example,
As shown in the figure, when the recording head 6 is energized and the ink 5 is printed on the recording paper 3 with the recording head 6 pressing the energized transfer film 4 against the recording paper 3, the recording head 6 always moves in the pressure contact state and prints. Because of this, the tip of the recording head 6 is always in a state of friction, and therefore only the electrode material at the tip wears out, and if used for a long time, the electrode will change from the state shown in Figure 4(a) to the The state changed to that shown in FIG. 2B, and a step was created between the alumina ceramic layer 1 and the electrode layer 2, resulting in a problem of poor head touch and deterioration of the printing condition. Furthermore, the life of the head was also short.

く目 的〉 本発明は以上の問題点を解消すべくなされたものであり
、印字によるヘッドの先端部の摩耗に起因する印字品位
の劣化を防止することをその目的とする。
Purpose The present invention has been made to solve the above-mentioned problems, and its purpose is to prevent deterioration in print quality due to wear of the tip of the head due to printing.

〈実施例〉 以下、本発明に係る記録ヘッドの一実施例につき図面を
用いて詳細に説明を行なう。
<Embodiment> Hereinafter, one embodiment of the recording head according to the present invention will be described in detail with reference to the drawings.

第1図(a)に本発明に係る記録ヘッドの一実施例の一
部平面図を示し、第1図(b)にそのA−A’線での断
面図を示す。同図で7はアルミナセラミックス基板8上
に被覆された複数本の電極膜である。
FIG. 1(a) shows a partial plan view of an embodiment of a recording head according to the present invention, and FIG. 1(b) shows a cross-sectional view thereof taken along line AA'. In the figure, reference numeral 7 denotes a plurality of electrode films coated on the alumina ceramic substrate 8.

該電極膜7はニッケル及びリンを主成分とする合金膜で
ある。
The electrode film 7 is an alloy film containing nickel and phosphorus as main components.

この記録ヘッドの製法は、アルミナセラミックス基板8
上にリン成分を含む無電解ニッケルメッキ浴中に炭化タ
ングステンの微粒粉末を攪拌しながら無電解ニッケルメ
ッキを成長させることでメッキ皮膜中に炭化タングステ
ンの微粒粉末を均一に共析、分散させた複合メッキ層を
形成し、その後そのメッキ層に対してフォトエツチング
加工あるいはレーザ加工を施すことにより、不要部分を
除去して複数本の電極バタ、−ンを形成してなる0尚、
上記リン成分を含む無電解ニッケルメッキは概ね次の様
にして行なう。
This recording head is manufactured using an alumina ceramic substrate 8
A composite in which fine tungsten carbide powder is uniformly eutectoid and dispersed in the plating film by growing electroless nickel plating while stirring fine tungsten carbide powder in an electroless nickel plating bath containing a phosphorus component. A plated layer is formed, and then the plated layer is subjected to photoetching or laser processing to remove unnecessary parts and form a plurality of electrode batters.
The electroless nickel plating containing the phosphorus component is generally carried out as follows.

まず酸性の次亜燐酸ソーダの水溶液にニッケルを漬ける
ことで、ニッケル表面が触媒となって次亜燐酸陰イオン
を分解して次の(1)式の如く脱水素反応が生ずる。
First, by soaking nickel in an acidic aqueous solution of sodium hypophosphite, the nickel surface acts as a catalyst to decompose hypophosphite anions and a dehydrogenation reaction occurs as shown in equation (1) below.

(H2PO2〕  →(PO2:]  +2H・・・・
・・・・・・・・・・・(1)この(1)式の反応によ
って生じた原子水素は次の(2)式の如く水溶液中のニ
ッケル陽イオンを還元して金属ニッケルを破着する。
(H2PO2] → (PO2:] +2H...
・・・・・・・・・・・・(1) The atomic hydrogen generated by the reaction of equation (1) reduces the nickel cation in the aqueous solution and destroys the metal nickel, as shown in the following equation (2). do.

Ni  +2H→Ni ’ + 2H+    ・・・
・・・・・・・・・・・・(2)一方、上記次亜燐酸陰
イオンは活性化水素により次の(3)式の如く活性のリ
ンを還元する。これが破着ニッケルと結合してN1−P
合金膜が形成される0 CH2PO2)−+H→H20+OH−+P0  ・1
1°°°・・(3)この手法によれば28%、 Ni 
92%程度の合金膜が作成できる。
Ni +2H→Ni '+2H+...
(2) On the other hand, the hypophosphite anion reduces active phosphorus with activated hydrogen as shown in the following formula (3). This combines with the fractured nickel and N1-P
Alloy film is formed0 CH2PO2)-+H→H20+OH-+P0 ・1
1°°°...(3) According to this method, 28%, Ni
An alloy film of about 92% can be created.

上記製法手順により形成した複数本の電極パターンに対
し、400℃の温度で1時間の熱処理を施こしたところ
硬度の高い膜を形成できた。尚、250℃〜550℃の
範囲内で20分以上1.5時間以下の期間で熱処理すれ
ば、メッキ層の硬度を増すことができるものである。こ
のようにして製造された電極は硬度が非常に高いため(
Hv=1000〜1400 )、耐摩耗性に優れ、その
結果、寿命の長い記録ヘッドを得ることができる。父上
配電極膜形成に際し、高温度焼成する必要が無いので省
エネルギーあるいd装置コスト等の面で製造装置の構成
上有利なものである。
When a plurality of electrode patterns formed by the above manufacturing procedure were heat-treated at a temperature of 400° C. for 1 hour, a highly hard film could be formed. Note that the hardness of the plating layer can be increased by heat treatment within the range of 250° C. to 550° C. for a period of 20 minutes or more and 1.5 hours or less. Electrodes manufactured in this way have very high hardness (
Hv=1000 to 1400), excellent wear resistance, and as a result, a recording head with a long life can be obtained. Since there is no need for high-temperature firing when forming the father distribution electrode film, this method is advantageous in terms of energy saving, equipment cost, etc. in terms of the construction of the manufacturing equipment.

ここで、以上の実施例において基板としてビッカース硬
度の非常に大きい(1700)アルミナセラミックス基
板を用いたが、上記N1−P合金膜のビッカース硬度が
650程度であることに鑑みれば、それに近い硬度のフ
ォルステライ)(2MgO・5i02 )、ムライト(
3At203・2SiO3)、マイカセラミックス(成
分はS i02 、 At203 、MgO,に20 
、 B2O3、F)等を用いた方が硬度のバランス上よ
り好ましい。
Here, in the above embodiment, an alumina ceramic substrate with a very high Vickers hardness (1700) was used as the substrate, but considering that the Vickers hardness of the N1-P alloy film is about 650, a hardness close to that forsterei) (2MgO・5i02), mullite (
3At203・2SiO3), mica ceramics (components are Si02, At203, MgO, and 20
, B2O3, F), etc. are more preferable in terms of hardness balance.

ここでフォルステライトのビッカース硬度は800、ム
ライトのビッカース硬度は700、マイカセラミックス
のビッカース硬度は650である。因にアルミナのビッ
カース硬度は1700と非常に太きい。
Here, the Vickers hardness of forsterite is 800, the Vickers hardness of mullite is 700, and the Vickers hardness of mica ceramics is 650. Incidentally, the Vickers hardness of alumina is 1700, which is extremely high.

尚、以上の実施例においては、まず全面にわたる複合メ
ッキ層を形成した後にエツチング加工等の除去加工で記
録電極パターンを形成したが、基板上にまず直接フォト
レジストを塗布し、記録電極パターンの反転パターンを
形成した後に複合メッキ層を形成し、フォトレジストと
同時に不要部分である反転パターンを除去して記録電極
パターンを形成しても構わない。
In the above examples, a composite plating layer was first formed over the entire surface, and then a recording electrode pattern was formed by removal processing such as etching. After forming the pattern, a composite plating layer may be formed, and the recording electrode pattern may be formed by removing the inverted pattern, which is an unnecessary portion, at the same time as the photoresist.

ここで、上記実施例においては炭化タングステンの微粒
粉末をメッキ皮膜中に分散させたが、この粉末は高硬度
の微粒子であればよく、At203等の酸化物、B4C
、Tic 、 Cr3C2、SiC、Mo2C等の炭化
物、亜硝酸硼素、MoB等の硼化物、WSi2等の微粒
子であっても構わない。
Here, in the above example, fine powder of tungsten carbide was dispersed in the plating film, but this powder may be fine particles of high hardness, such as oxides such as At203, B4C, etc.
, Tic, carbides such as Cr3C2, SiC, and Mo2C, borides such as boron nitrite and MoB, and fine particles such as WSi2.

く効 果〉 以上の本発明によれば、電極の硬度が向上したことで電
極磨耗の問題が改善され、信頼性が大幅に向上した。更
に加工コストを低減化できた。
Effects> According to the present invention as described above, the problem of electrode wear is alleviated by improving the hardness of the electrode, and reliability is significantly improved. Furthermore, processing costs were reduced.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(a)は本発明に係る記録ヘッドの一実施例の一
部平面図、同図(b)はそのA−A’線での断面図、第
2図は従来のi己録ヘッドの平面図、第3図はその側面
図、第4図はその先端部の断面図を示す。 図中、 1:アルミナセラミソクス層 2:タングステン電極層
3:記録紙        4:通電転写フィルム5:
イyり       6:記録ヘッド7:電極膜   
     8:セラミックス基板代理人 弁理士 杉 
山 毅 至(他1名)第1図 第2図
FIG. 1(a) is a partial plan view of an embodiment of the recording head according to the present invention, FIG. 1(b) is a cross-sectional view taken along the line A-A', and FIG. 3 is a plan view thereof, FIG. 3 is a side view thereof, and FIG. 4 is a sectional view of its tip. In the figure, 1: Alumina ceramic layer 2: Tungsten electrode layer 3: Recording paper 4: Current transfer film 5:
6: Recording head 7: Electrode film
8: Ceramic substrate agent patent attorney Sugi
Takeshi Yama (and 1 other person) Figure 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims] 1、絶縁性の基板材料上にNi及びPの合金中に高硬度
の微粒子を均一に分散してなる膜を形成し、該膜を電極
としたことを特徴とする記録ヘッド。
1. A recording head characterized in that a film formed by uniformly dispersing fine particles of high hardness in an alloy of Ni and P is formed on an insulating substrate material, and the film is used as an electrode.
JP1989586A 1986-01-30 1986-01-30 Recording head Pending JPS62176856A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989586A JPS62176856A (en) 1986-01-30 1986-01-30 Recording head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989586A JPS62176856A (en) 1986-01-30 1986-01-30 Recording head

Publications (1)

Publication Number Publication Date
JPS62176856A true JPS62176856A (en) 1987-08-03

Family

ID=12011930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989586A Pending JPS62176856A (en) 1986-01-30 1986-01-30 Recording head

Country Status (1)

Country Link
JP (1) JPS62176856A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH022020A (en) * 1988-06-13 1990-01-08 Fuji Xerox Co Ltd Printing recording head

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH022020A (en) * 1988-06-13 1990-01-08 Fuji Xerox Co Ltd Printing recording head

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