JPS62175608A - Ultrasonic thickness measuring apparatus - Google Patents

Abstract

PURPOSE:To make it possible to measure the data relating to the thickness and flaw such as a crack of an object to be inspected, by processing the reflected waves from at least two vibrators irradiating the object to be inspected with ultrasonic waves at different incident angles. CONSTITUTION:Vibrators 11, 13 are provided in a probe 9 so as to be inclined with respect to the bottom surface of the housing 19 of said probe 9 and vibrators 15, 17 are provided in the probe 9 in parallel to the bottom surface of the housing 19. An object 35 to be inspected is contacted with the probe 9 and a transmitter is driven to vibrate the vibrators 11, 13, 15 to generate ultrasonic waves which are, in turn, allowed to irradiate the object 35 to be inspected. Whereupon, the vibrator 17 receives the ultrasonic wave A emitted from the vibrator 15 and reflected from the bottom surface of the object 35 to be inspected and the ultrasonic waves B emitted from the vibrators 15, 17 and reflected from a crack 37. A receiver receives the signal sent from the vibrator 17 to input the same to a processing circuit through a gate circuit and not only the thickness of the object 35 to be inspected but also the position and depth of the crack can be calculated on the basis of the count values of a counter by the processing circuit.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an ultrasonic thickness measuring device capable of detecting not only the thickness of an object but also defect positions, defect depths, and the like.

[Conventional technology]

Conventional ultrasonic thickness measuring devices are specialized machines for measuring the thickness of members used in plants, etc., using a split-type vertical probe.

[Problem that the invention seeks to solve]

However, recently, when measuring the thickness of piping in plants, etc., it is desirable to measure the depth of defects such as corrosion holes (pits) at the same time as the thickness, but as mentioned above, conventional ultrasonic thickness measurement The problem with this device is that it can only measure the thickness of the member.

The present invention has been made in view of the above-mentioned problems, and its purpose is to provide ultrasonic thickness that can also measure the thickness of a specimen and the position and depth of defects such as pit depth and crack depth. The objective is to provide a measuring device.

[Means and effects for solving the problems] In order to achieve the above object, the present invention includes a transmitter that emits a transmission signal, and a transmitter that vibrates according to the transmission signal and emits ultrasonic waves at different input angles to a subject. A first transducer consisting of at least two transducers that irradiates this ultrasound, a second transducer that receives the ultrasound reflected by the subject, and receives a signal sent from the second transducer. and a processing circuit that processes signals sent from the receiver to calculate data regarding the thickness of the object and defects that the object has.

〔Example〕

An embodiment of the present invention will be described in detail below based on the drawings. FIG. 1 is a block diagram of the configuration of an ultrasonic thickness measuring device according to this embodiment. A synchronization signal generation circuit 1 supplies a synchronization signal to a transmitter 3, a gate circuit 5, and a counter 7. Transmitter 3
sends a transmission signal to the transducers 11, 13, and 15 in the probe 9 in response to a synchronization signal sent from the synchronization signal generation circuit 1. FIG. 2 is an enlarged cross-sectional view of this probe 9. Four transducers 11, 13, and 15 degrees 17 are provided in this probe 9, and the transducers 11 and 13 are located in a housing 19. The vibrators 15 and 17 are installed parallel to the bottom surface of the C body. Vibrator 11, 13.1
5 is connected to the transmitter 3 via the connector 21 and the transmitter 3
When a transmission signal is sent from the device, it vibrates and emits ultrasonic waves, which are then irradiated onto the subject. The vibrator 17 is connected to the receiver 25 via the connector 23 and vibrates upon receiving the ultrasound reflected by the subject and sends a received signal to the receiver 25.

Returning to FIG. 1 again, the gate circuit 5 is opened by the synchronizing signal from the synchronizing signal generating circuit 1.

The receiver 25 receives the signal sent from the vibrator 17 and supplies it to the processing circuit 27 via the gate circuit 5 . Further, the counter 7 is reset in synchronization with the rise of the synchronization signal supplied from the synchronization signal generation circuit 1, and counts the clock pulses generated from the clock pulse oscillator 33. The counted value of this counter 7 is added to the processing circuit 27. The processing circuit 27 processes the signal sent from the receiver'ri 25 and the count value of the counter 7, and calculates the thickness of the object, the defect position, the defect depth, etc. The display 29 displays the thickness of the subject calculated by the processing circuit 27.

The display 31 displays information such as the defect position and defect depth of the object calculated by the processing circuit 27.

Next, the operation of this embodiment will be explained. FIG. 3 is an explanatory diagram when there is no defect in the object 35. As shown in the figure, the probe 9 is brought into contact with the object 35, the transmitter 3 is driven, and the transducers 11, 13° When the transducer 15 is vibrated to generate ultrasonic waves, which are irradiated onto the subject 35, the transducer 17 receives only the ultrasonic waves A emitted from the transducer 15 and reflected from the bottom surface of the subject 35. Then, the receiver 25 receives the signal sent from the vibrator 17, sends it to the processing circuit 27 via the gate circuit 5, and the processing circuit 27 performs arithmetic processing together with the count value of the counter 7 at this time. The thickness is calculated and displayed on the display 29.

FIG. 4 is an explanatory diagram when there is a crack 37 in the object 35. In this case, the transducer 17 emits ultrasonic waves A emitted from the object 35 and reflected from the bottom surface of the object 35, and
．． The ultrasonic wave B emitted from the crack 37 and reflected by the crack 37 is received. The receiver 25 receives these signals and sends them to the processing circuit 27 via the gate circuit 5.The processing circuit 27 calculates the thickness of the object 35 and the crack 3 based on the count value of the counter 7.
The position, depth, etc. of 7 are calculated. The thickness of the object 35 is displayed on the display 29, and information such as the position and depth of the crack 37 is displayed on the display 31.

In this way, in this embodiment, in addition to the thickness of the test object, information regarding defects in the test object can also be measured.

〔Effect of the invention〕

As described in detail above, according to the present invention, it is possible to measure not only the thickness of the object but also data such as the position and depth of defects such as cracks in the object.

[Brief explanation of drawings]

Figure 1 is a block diagram of the configuration of the ultrasonic thickness measuring device, Figure 2 is a cross-sectional view of the probe, Figure 3 is a diagram explaining the thickness measurement operation when there is no defect in the specimen, and Figure 4 is the diagram of the specimen. FIG. 6 is a diagram illustrating a thickness measurement operation when a specimen has a defect. 3... Transmitter, 11, 13, 15.17... Vibrator, 25... Receiver, 27... Processing circuit. Figure 2 Figure 3 Figure 4-1

Claims (1)

[Scope of claims] Consisting of a transmitter that generates a transmission signal, and at least two transducers that vibrate in response to the transmission signal to generate ultrasound and irradiate the ultrasound at different input angles to the subject. a first transducer; a second transducer that receives the ultrasound reflected by the wave sample; a receiver that receives the signal sent from the second transducer; and processes the signal sent from the receiver. 1. An ultrasonic thickness measuring device comprising: a processing circuit that calculates data regarding the thickness of an object to be examined and defects that the object has.