JPS62174117A - Manufacture of optical disc board - Google Patents
Manufacture of optical disc boardInfo
- Publication number
- JPS62174117A JPS62174117A JP1587086A JP1587086A JPS62174117A JP S62174117 A JPS62174117 A JP S62174117A JP 1587086 A JP1587086 A JP 1587086A JP 1587086 A JP1587086 A JP 1587086A JP S62174117 A JPS62174117 A JP S62174117A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- acid anhydride
- mgf2
- silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000005266 casting Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 21
- 101100273027 Dictyostelium discoideum cafA gene Proteins 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 abstract description 21
- 229920005989 resin Polymers 0.000 abstract description 20
- 239000011347 resin Substances 0.000 abstract description 20
- 239000011521 glass Substances 0.000 abstract description 11
- 239000003822 epoxy resin Substances 0.000 abstract description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 8
- 229920000647 polyepoxide Polymers 0.000 abstract description 8
- 125000003545 alkoxy group Chemical group 0.000 abstract description 7
- 229910001635 magnesium fluoride Inorganic materials 0.000 abstract description 7
- 239000011342 resin composition Substances 0.000 abstract description 7
- 150000008065 acid anhydrides Chemical class 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 abstract description 5
- 229910001634 calcium fluoride Inorganic materials 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプラスチック製光ディスク用基板の製造方法に
関するものである。更に詳しくは、エダキシ樹脂を用す
て光ディスク用基板を製造するに際し、注型成形におい
て金型との雛形性に優れておシ容易に脱型が可能であシ
且っ、基板上グループを形成させる為の紫外線硬化性樹
脂との密着性に優れた光ディスク用基板の製造方法に関
する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of manufacturing a plastic optical disk substrate. More specifically, when manufacturing optical disc substrates using edoxy resin, it has excellent patternability with the mold in cast molding, can be easily removed from the mold, and forms groups on the substrate. The present invention relates to a method for manufacturing an optical disk substrate that has excellent adhesion to an ultraviolet curable resin for the purpose of making the substrate more durable.
プラスチック製光ディスク基板はイリカーボネート、ポ
リメチルメタクリレート等の熱可塑性樹脂、工はキシ、
ゴリジアリルジグリコールカーボネ〜ト等の熱硬化性樹
脂を材料とするものが公知になっている。その中でもエ
ダキシ樹脂硬化物からなる光ディスク基板は耐熱性、複
屈折低吸水率などの点で高品位ディスク基板として信頼
性が最も高いものである（特開昭５９−２２２４８号公
報）。かかる光ディスク基板の製造方法の概略は対向さ
せた二枚のガラスにスに一す−を介したキャビティにニ
ーキシ樹脂を流し込み、加熱硬化せしめて脱型し、ディ
スク基板を得るというものである。ここで用いられるガ
ラスには離型性を付与させるため、例えば、特開昭５８
−１５３６０８号公報記載のＭｇＦ２．、ＣａＦ２等の
金属フッ素化合物をスノぞツタ法で薄膜を形成させる方
法がある。ところがビスフェノールＡ型エポキシ樹脂等
のガラスとの接着性に元来すぐれている樹脂系を用いた
場合、離形処理したキャビティでさえ硬化後の脱型が難
しくガラス、基板破損がしばしばおこることが現状であ
った。この問題を解決する方法として内部離型剤を添加
する方法があり、その例としては有機シリコーンをエポ
キシ樹脂−フェノールノボラック硬化剤系に用いること
が特開昭６０−１８５２０号公報に示されているが、こ
れはエピキシ樹脂−７エノールノボラツク硬化剤に限ら
れるものであり、エピキシ樹脂−酸無水物系では高温高
湿下で白化してしまうという欠点があることが述べられ
ている。また有機シリコーンの代シにシリコーン樹脂を
添加することも従来知られていることである。これらい
ずれの場合も硬化物の表面に離型剤が浮きでるいわゆる
ブリード現象をおこすため離型効果はあるが、表面にシ
リコーンが多く存在することによシ光ディスク基板上に
いわゆる２Ｐ（ｐｈｏｔｏ −ｐｏｌｙｍｅｒ ）法に
よシ、グループを形成する工程において用いる紫外線硬
化性樹脂との密着性が非常に劣るという欠点を有してい
る。Plastic optical disk substrates are made of thermoplastic resins such as iricarbonate and polymethyl methacrylate;
Those made of thermosetting resins such as golidiallyl diglycol carbonate are known. Among these, optical disk substrates made of cured edoxy resins are the most reliable as high-quality disk substrates in terms of heat resistance, birefringence, low water absorption, etc. (Japanese Patent Application Laid-Open No. 59-22248). The general method for manufacturing such an optical disk substrate is to pour nixy resin into a cavity between two glass sheets facing each other through a glass, heat and harden the resin, and then demold the resin to obtain a disk substrate. In order to impart mold releasability to the glass used here, for example,
MgF2.-153608. There is a method of forming a thin film using a metal fluorine compound such as , CaF2, etc. by a snow trickling method. However, when using resin systems such as bisphenol A epoxy resins that inherently have excellent adhesion to glass, it is difficult to remove the mold after curing, even with mold-release-treated cavities, which often results in damage to the glass or substrate. Met. One way to solve this problem is to add an internal mold release agent; an example of this is the use of organic silicone in an epoxy resin-phenol novolac curing agent system as shown in JP-A-60-18520. However, this is limited to the epixy resin-7enol novolak curing agent, and it is stated that the epixy resin-acid anhydride system has the disadvantage of whitening under high temperature and high humidity conditions. It is also conventionally known to add silicone resin as a substitute for organic silicone. In any of these cases, the mold release agent floats on the surface of the cured product, causing a so-called bleed phenomenon, so there is a mold release effect, but due to the presence of a large amount of silicone on the surface, so-called 2P (photo-polymer) ) method has the disadvantage of very poor adhesion to the ultraviolet curable resin used in the step of forming groups.
本発明はかかる製造法に関する問題点を解決せんとして
検討した結果、光ディスク基板用エゼキシ樹脂−酸アル
コキシ基もしくは水酸基を含む有機シリコーン化合物を
内部離形剤として添加した場合、離形性、透明性が良好
でかっ２Ｐ樹脂との密着性もすぐれた硬化物が得られる
事を見い出し、完成するに至ったものである。The present invention was developed as a result of studies aimed at solving the problems associated with such manufacturing methods.It was found that when an epoxy resin for optical disk substrates - an organic silicone compound containing an acid alkoxy group or a hydroxyl group is added as an internal mold release agent, mold release properties and transparency are improved. It was discovered that a cured product with good adhesion to the Ka2P resin could be obtained, and this was completed.
本発明はエポキシ樹脂、酸無水物、反応促進剤３重量−
以上のアルコキシもしくは水酸基を含む有機シリコーン
からなる樹脂組成物を硬化せしめて得られる光ディスク
基板に関するものである。The present invention consists of an epoxy resin, an acid anhydride, and a reaction accelerator.
The present invention relates to an optical disc substrate obtained by curing a resin composition made of the organic silicone containing an alkoxy or hydroxyl group.
本発明はかかるエピキシ樹脂−酸無水物系よシなる光デ
ィスク基板の製造方法に関する問題を解決せんと種々研
究した結果、特にアルコキシ基もしくは水酸基を含むシ
リコーンを用い、離型処理された型と併用することによ
って離型性に優れ、且つ得られた硬化物は透明性が良好
で、紫外線硬化性樹脂との密着性に優れていることを見
い出して完成するに至ったものである。The present invention was developed as a result of various researches to solve the problems related to the manufacturing method of optical disk substrates based on the epixyl resin-acid anhydride system. This led to the discovery that the resulting cured product has excellent mold releasability, good transparency, and excellent adhesion to the ultraviolet curable resin.
本発明はエポキシ樹脂、酸無水物、反応促進剤及び３重
量％以上のアルコキシもしくは水酸基を含む有機シリコ
ーンからなる樹脂組成物を外部離削としてＭｇＦ２ 、
ＣａＦ２を用いた注形用型に注形し硬化させてなる光デ
ィスク用基板の製造方法に関するものである。The present invention uses a resin composition consisting of an epoxy resin, an acid anhydride, a reaction accelerator, and an organic silicone containing 3% by weight or more of alkoxy or hydroxyl groups as an external abrasive, and uses MgF2,
The present invention relates to a method of manufacturing an optical disc substrate by casting it into a casting mold using CaF2 and curing it.
本発明においては特に有機シリコーン中に水酸基及びア
ルコキシ基を含むものがエピキシ樹脂−酸無水物系に効
果的であシ、他の基を含むものではこの様な効果は期待
できない。In the present invention, organic silicones containing hydroxyl groups and alkoxy groups are particularly effective in the epixy resin-acid anhydride system, whereas organic silicones containing other groups cannot be expected to have such effects.
本発明の内容を詳細に説明すると内部雛形剤として反応
性シリコーンを添加する事によシ組成物中の水酸基等と
縮合反応を生じせしめることにより、硬化物マトリック
ス中にシリコーンがとシ込まれ結果としてシリコーンが
表面にブリードする事もなく、相溶性が良いため硬化物
が白濁する事がないと考えられる。また表面に存在する
シリコーン濃度は非反応性シリコーンを添加した時に比
べ低いので紫外線硬化性樹脂との密着性もそこなうこと
なく基板製造時の離型性にすぐれた硬化物が得られる。To explain the contents of the present invention in detail, by adding reactive silicone as an internal template agent, a condensation reaction is caused with hydroxyl groups in the composition, and the silicone is injected into the matrix of the cured product. As a result, the silicone does not bleed onto the surface and the cured product does not become cloudy due to its good compatibility. Furthermore, since the concentration of silicone present on the surface is lower than when non-reactive silicone is added, a cured product with excellent mold releasability during substrate production can be obtained without impairing the adhesion with the ultraviolet curable resin.
またシリコーン樹脂を添加することにより耐光性、耐水
性等をさらに付与できるため、より信頼性にすぐれたデ
ィスク基板が得られる事も特筆できる事である。本発明
で用いられるエポキシ樹脂、酸無水物、反応促進剤はす
でに特開昭５９−２２２４８号等により例示されている
が、エピキシ樹脂について本件に関してはいわゆるビス
フェノールＡ型エダキシ樹脂、ビスフェノールＦ型エデ
キシ樹脂等のガラスとの密着性にすぐれた樹脂系に関し
てその効果をあげることができるがその他として脂環式
エピキシ樹脂等を必要に応じて添加することもできさら
には、シリコーンとの相溶性が良好である公知の材料に
対し反応性シリコーンを添加することが可能である。It is also worth mentioning that by adding silicone resin, light resistance, water resistance, etc. can be further imparted, so that a disk substrate with higher reliability can be obtained. The epoxy resin, acid anhydride, and reaction accelerator used in the present invention have already been exemplified in JP-A-59-22248, etc., but regarding the epixy resin in this case, so-called bisphenol A-type edoxy resin, bisphenol F-type edoxy resin, etc. This effect can be achieved with resin systems that have excellent adhesion to glass, such as resins, but alicyclic epixy resins and the like can also be added as necessary. It is possible to add reactive silicones to certain known materials.
有機シリコーンはアルコキシ基、水酸基を有し、樹脂と
の相溶性が良好であればすべて適用できるが離形効果を
示すためには少なくとも３重量％以上添加する。The organic silicone has an alkoxy group and a hydroxyl group, and any organic silicone can be used as long as it has good compatibility with the resin, but it should be added in an amount of at least 3% by weight or more in order to exhibit a mold release effect.
更に本発明によるディスク基板製造方法は以下の通シで
ある。ＭｇＦ２ 、ＣａＦ２をス、ｏツタした二枚の対
向したガラスの注形用型内にエポキシ樹脂、酸無水物、
反応促進剤、有機シリコーンからなる樹脂組成物を注形
し加熱硬化抜脱型してディスク基板を得る。Further, the method for manufacturing a disk substrate according to the present invention is as follows. Epoxy resin, acid anhydride,
A resin composition consisting of a reaction accelerator and an organic silicone is cast and then heated and cured to form a mold to obtain a disk substrate.
これらの樹脂組成物を上記ＭｇＦ２ 、ＣａＦ２処理し
た注形用型とを併用することにより、それぞれ単独の場
合に期待される離形性より数倍も優れた離形性を示すこ
とは驚くべきことである。It is surprising that when these resin compositions are used in combination with the above-mentioned MgF2 and CaF2 treated casting molds, they exhibit mold releasability that is several times better than that expected when each resin composition is used alone. It is.
実施例１
スフζツタ法でＭｇＦ２の薄膜を形成したガラス板を２
枚対向させ、厚み１．１７のロッド線スＲ−サーを介し
、シリコンチューブでシールしたキャビティ内に、第１
表に示す実施例１の処方のエポキシ樹脂組成物を注形し
１００℃、３時間、１２０℃、２時間硬化抜脱型を行っ
た。脱型性はナイフ等を硬化物ガラス界面に入れ、きっ
かけを作シ、エアーを吹きかけて容易に脱型できる場合
を離形性良好とし、それ以外の場合を離形性困難と表示
する。Example 1 A glass plate on which a thin film of MgF2 was formed by the Sufu ζ ivy method was
The first two sheets were placed facing each other, and the first
An epoxy resin composition having the formulation of Example 1 shown in the table was cast and cured and demolded at 100°C for 3 hours and at 120°C for 2 hours. For mold releasability, if the mold can be easily removed by inserting a knife or the like into the interface of the cured glass and creating a trigger and blowing air, the mold releasability is evaluated as good, and in other cases, the mold releasability is difficult.
その他の特性を第１表に示した。Other properties are shown in Table 1.
実施例２
実施例１と同様に第１表に示す処方を用い硬化せしめ、
脱型を行った。その結果を第１表に示す。Example 2 Curing was performed using the formulation shown in Table 1 in the same manner as in Example 1,
I removed the mold. The results are shown in Table 1.
比較例１
第１表に示す処方を用い硬化せしめ、実施例１と同様脱
型を行った。その結果を第１表に示す。Comparative Example 1 The formulation shown in Table 1 was cured, and the mold was demolded in the same manner as in Example 1. The results are shown in Table 1.
比較例２
第１表に示すシリコーンとしてフェニルメチルテリシロ
キサンを添加して実施例１と同様に硬化させ脱型を行っ
た。その結果を第１表に示す。Comparative Example 2 Phenylmethylterisiloxane was added as the silicone shown in Table 1, and cured and demolded in the same manner as in Example 1. The results are shown in Table 1.
比較例３
実施例１に示す処方でＭｇＦ２の薄膜を形成していない
ガラス板を用いて同様の条件で注型を行ったが、硬化後
の脱型においては非常に困難であり、ガラス板が破損し
てしまった。Comparative Example 3 Casting was carried out under the same conditions using a glass plate on which a thin MgF2 film was not formed using the recipe shown in Example 1, but it was extremely difficult to remove the mold after curing, and the glass plate It's damaged.
Claims (1)
のアルコキシ基もしくは水酸を含む有機シリコンからな
る樹脂組成物を外部離型剤としてＭｇＦ＿２、ＣａＦ＿
２で処理した注形用型に注形し硬化せしめた後離型して
得ることを特徴とする光ディスク用基板の製造方法。MgF_2, CaF_
1. A method for manufacturing an optical disk substrate, which is obtained by casting the substrate into a casting mold treated in step 2, curing it, and then releasing the mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1587086A JPS62174117A (en) | 1986-01-29 | 1986-01-29 | Manufacture of optical disc board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1587086A JPS62174117A (en) | 1986-01-29 | 1986-01-29 | Manufacture of optical disc board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62174117A true JPS62174117A (en) | 1987-07-30 |
Family
ID=11900830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1587086A Pending JPS62174117A (en) | 1986-01-29 | 1986-01-29 | Manufacture of optical disc board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62174117A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080085376A1 (en) * | 2006-06-07 | 2008-04-10 | Laude Lucien D | Polymer Layer Comprising Silicone and at Least One Metal Trace and a Process of Manufacturing the Same |
| WO2015025592A1 (en) * | 2013-08-22 | 2015-02-26 | 昭和電工株式会社 | Method for producing resin molded article |
-
1986
- 1986-01-29 JP JP1587086A patent/JPS62174117A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080085376A1 (en) * | 2006-06-07 | 2008-04-10 | Laude Lucien D | Polymer Layer Comprising Silicone and at Least One Metal Trace and a Process of Manufacturing the Same |
| US8603590B2 (en) * | 2006-06-07 | 2013-12-10 | Second Sight Medical Products, Inc. | Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same |
| WO2015025592A1 (en) * | 2013-08-22 | 2015-02-26 | 昭和電工株式会社 | Method for producing resin molded article |
| JPWO2015025592A1 (en) * | 2013-08-22 | 2017-03-02 | アイカＳｄｋフェノール株式会社 | Manufacturing method of resin molding |
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