JPH01166911A - Synthetic resin molding die - Google Patents
Synthetic resin molding dieInfo
- Publication number
- JPH01166911A JPH01166911A JP32551087A JP32551087A JPH01166911A JP H01166911 A JPH01166911 A JP H01166911A JP 32551087 A JP32551087 A JP 32551087A JP 32551087 A JP32551087 A JP 32551087A JP H01166911 A JPH01166911 A JP H01166911A
- Authority
- JP
- Japan
- Prior art keywords
- fluorine
- mold
- film
- synthetic resin
- molding die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 19
- 229920003002 synthetic resin Polymers 0.000 title claims abstract description 17
- 239000000057 synthetic resin Substances 0.000 title claims abstract description 17
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 30
- 239000011737 fluorine Substances 0.000 claims abstract description 30
- 238000004544 sputter deposition Methods 0.000 claims abstract description 11
- 239000012298 atmosphere Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 239000010409 thin film Substances 0.000 claims description 11
- 239000011521 glass Substances 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 abstract description 3
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 abstract description 3
- 239000002131 composite material Substances 0.000 abstract description 2
- 230000007812 deficiency Effects 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 17
- 239000010408 film Substances 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- 239000007789 gas Substances 0.000 description 11
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 9
- 229910001634 calcium fluoride Inorganic materials 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 238000005266 casting Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000006082 mold release agent Substances 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 3
- 229910001632 barium fluoride Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- MLSPENRYOBVDKN-UHFFFAOYSA-N 2,6-ditert-butyl-1-methylcyclohexa-2,4-dien-1-ol Chemical compound CC(C)(C)C1C=CC=C(C(C)(C)C)C1(C)O MLSPENRYOBVDKN-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、樹脂成形品との離形性が優れ、しかも鏡面性
の良い樹脂成形品を得ることができる合成樹脂成形用型
に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a mold for synthetic resin molding that has excellent mold release properties from resin molded products and is capable of producing resin molded products with good specularity. be.
合成樹脂の成形において、成形品を型から取り出す場合
、エポキシ樹脂、不飽和ポリエステル樹脂、フェノール
樹脂等のように強い接着性を有するものは型からの離型
性が悪い。このような場合、成形用型に離型剤を塗布す
る方法が一般的であるが、成形品に離型剤によるくもり
が発生したり、十分な鏡面が得られないことが多い。In molding synthetic resins, when removing a molded article from a mold, materials with strong adhesive properties such as epoxy resins, unsaturated polyester resins, and phenol resins have poor releasability from the mold. In such cases, a method of applying a mold release agent to the mold is common, but the molded product often becomes cloudy due to the mold release agent, or a sufficient mirror surface cannot be obtained.
そこで、特に合成樹脂よりなる光学部品を成形する場合
には、ガラス等の優れた鏡面性を有する型を用い、この
型のもつ鏡面性を成形品に転写ざ者の密着力が強いので
、エポキシ樹脂硬化後その成形品はガラス型から容易に
離型しない。また、エポキシ樹脂の成形収縮による応力
のため、ガラス型の方に割れが発生することが多い。か
かる合成樹脂成形品と成形用型との離型を良くするため
、前記のように型に離型剤を塗布する方法があるが、こ
の方法では離型剤が成形品に転写されることにより成形
品にくもりが発生するので、光学部品としては到底満足
しうるちのは得られない。Therefore, especially when molding optical parts made of synthetic resin, a mold with excellent specularity such as glass is used, and since the specularity of this mold is transferred to the molded product with strong adhesion, epoxy After the resin hardens, the molded product does not easily release from the glass mold. Furthermore, cracks often occur in the glass mold due to stress caused by molding shrinkage of the epoxy resin. In order to improve the mold release between the synthetic resin molded product and the molding mold, there is a method of applying a mold release agent to the mold as described above, but in this method, the mold release agent is transferred to the molded product. Since cloudiness occurs in the molded product, it is not possible to obtain a coating that is completely satisfactory as an optical component.
成形用型の型面の離型性を良する目的のために、弗化マ
グネシウム(Mi F2 > 、弗化カルシウム(Ca
F2)、弗化バリウム(Ba F2 >等のフッ素含有
金属の薄膜を型面に形成ざ゛せると効果のあることが、
最近知られるよやになった。しかしながら、キャリアガ
スとして、−殻内なArガスを用いて形成させた上記の
薄膜は、耐久性の点から70〜220回粉度が限度であ
った。この原因としては、ガラス等の型との密着力や離
型性に大きく寄与するフッ素の欠乏、更には膜の応力か
らくるクラック等が要因として考えられ、薄膜の形本発
明はかかる欠点を改良すべく鋭意検討してなされたもの
で、合成樹脂成形品と型との離型を容易にし、かつ型の
もつ鏡面性を成形品に転写できる離型膜を型に形成する
ことにより、くもり等のない優れた鏡面性を有する合成
樹脂成形品を′−得ることを第1の目的とし、更には、
離型膜の形成方法を改善し、離型膜の耐久性を向上させ
ることを第2の目的としたものである。In order to improve the mold releasability of the mold surface of the mold, magnesium fluoride (Mi F2 >, calcium fluoride (Ca
F2), it is effective to form a thin film of fluorine-containing metal such as barium fluoride (BaF2) on the mold surface.
Recently, it has become well known. However, in terms of durability, the above-mentioned thin film formed using in-shell Ar gas as a carrier gas had a limit of 70 to 220 cycles. The causes of this are thought to be a lack of fluorine, which greatly contributes to the adhesion to molds such as glass and mold releasability, as well as cracks caused by stress in the film. This was developed after careful consideration to prevent fogging, etc. by forming a release film on the mold that makes it easy to release the synthetic resin molded product from the mold and transfers the specularity of the mold to the molded product. The first objective is to obtain a synthetic resin molded product with excellent specularity without any scratches, and further,
The second purpose is to improve the method of forming a mold release film and improve the durability of the mold release film.
本発明は、成形用型の型面に、フッ素含有ガスを含む雰
囲気中でスパッタリング法によりフッ素含有金属の薄膜
を形成させたことを特徴とする合成樹脂成形用型である
。 2゜
本発明におけるフッ素含有ガス暑しでは、フッ素ガス(
F2>、4弗化炭素(CF4)、テトラフルオロエチレ
ン(02F4)、ヘキサフルオロF2)、弗化カルシウ
ム、(CaF2)、弗化バリウム(Ba F2 )等が
使用可能であるが、これらに限定されるものではない。The present invention is a synthetic resin molding die characterized in that a thin film of a fluorine-containing metal is formed on the mold surface of the molding die by sputtering in an atmosphere containing a fluorine-containing gas. 2゜In the fluorine-containing gas heater of the present invention, fluorine gas (
F2>, carbon tetrafluoride (CF4), tetrafluoroethylene (02F4), hexafluoroF2), calcium fluoride, (CaF2), barium fluoride (Ba F2), etc. can be used, but are not limited to these. It's not something you can do.
本発明では、スパッタリング法によってフッ素含有金属
の薄膜を形成させる際にキャリアガスとしてArだけで
なくフッ素含有ガスを混入させるが、−殻内な型材とし
て用゛いられるガラス表面の場合には、イオン化したフ
ッ素により数人〜数10人のオーダーでエツチングやク
リーニング出来るため、大巾な密着力の向上が計られ、
またこの他、成膜中にわずかに欠乏するフッ素を補い、
あるいは膜中にフッ素含有の重合膜を含むため低応力の
複合物が生成して、離型”性の優れたフッ素含有金属が
形成できるものである。 ・
ここで混入させるフッ素含有ガスとしてはAr量に対し
て1〜20%が好ましい。この理由としては、゛1%以
下では型表面のエッチングヤクリーニング効果、更には
欠乏フッ素を補う効果が少いためである。また、20%
以上の場合、成膜速度が遅くなり、生産上大きな問題と
なる。 ″かかる薄膜の厚さは、成形品の材質、用途
により異なるが、−殻内には500〜3000人、好ま
しくは1000〜1500人とするのが適当である。5
00Å以下では可使回数が少なく、3000Å以上で薄
膜の内部応力によりクラックが発生しやすいためである
。In the present invention, when forming a thin film of a fluorine-containing metal by sputtering, not only Ar but also a fluorine-containing gas is mixed as a carrier gas. Etching and cleaning can be done by several to several dozen people using fluorine, which greatly improves adhesion.
In addition, it supplements the slight fluorine deficiency during film formation,
Alternatively, since the film contains a fluorine-containing polymer film, a low-stress composite is generated, and a fluorine-containing metal with excellent mold release properties can be formed. - The fluorine-containing gas to be mixed here is Ar. The amount is preferably 1 to 20%.The reason for this is that if it is less than 1%, the etching and cleaning effect on the mold surface and the effect of compensating for the lack of fluorine are small.
In the above case, the film formation rate becomes slow, which causes a big problem in production. ``The thickness of this thin film varies depending on the material and purpose of the molded product, but it is appropriate that there be 500 to 3,000 people, preferably 1,000 to 1,500 people in the shell.5
This is because if the thickness is less than 00 Å, the number of times it can be used is small, and if it is more than 3000 Å, cracks are likely to occur due to the internal stress of the thin film.
本発明において、合成樹脂の成形方法は圧縮成形、移送
成形、射出成形、注型成形等いかなる方法でも良い。成
形に供される合成樹脂も特に制限されるものではないが
、型に使用される材料と密着性の大きいエポキシ樹脂、
フェノール樹脂、不飽和ポリエステル樹脂、ジアリルフ
タレート樹脂、紫外線硬化樹脂等を使用する場合に本発
明は効果的で、エポキシ樹脂、不飽和ポリエステル樹脂
等により光学部品を成形する場合において特に有効であ
る。In the present invention, the synthetic resin may be molded by any method such as compression molding, transfer molding, injection molding, or cast molding. The synthetic resin used for molding is not particularly limited, but epoxy resins that have high adhesion to the material used for the mold,
The present invention is effective when using phenol resins, unsaturated polyester resins, diallyl phthalate resins, ultraviolet curable resins, etc., and is particularly effective when molding optical parts from epoxy resins, unsaturated polyester resins, etc.
更に、本発明は特に離型性に問題のある、直径と厚みの
比が大ぎい(例えば100倍以上)成形品を得るための
成形用型の離型膜として好適である。Further, the present invention is particularly suitable as a mold release film for a mold for obtaining a molded product having a large ratio of diameter to thickness (for example, 100 times or more) and having a problem with mold release properties.
次に、実施例により本発明を具体的に説明する。Next, the present invention will be specifically explained with reference to Examples.
実施例1
鏡面を有するガラス板にスパッタリング法により厚さ2
000人のCa F2膜を形成した。スパッタリング条
件は、基板温度は120℃、フッ素ガス圧3 X 10
−5Torrとし、更にArを導入シテ3X10−3丁
Or「ニシタ。膜形成速度ハ250人/分で行なった。Example 1 A glass plate with a mirror surface was coated with a thickness of 2 by sputtering.
000 CaF2 films were formed. The sputtering conditions are: substrate temperature: 120°C, fluorine gas pressure: 3 x 10
The temperature was -5 Torr, and Ar was further introduced at a rate of 3 x 10 -3 Torr.The film formation rate was 250 people/min.
次に、以下の配合のエポキシ樹脂及び硬化剤から成る組
成物を調製した。Next, a composition consisting of an epoxy resin and a curing agent having the following formulation was prepared.
配合組成物A
ビスフェノールA型エポキシ樹脂
100 重量部
メチルへキサヒドロフタール酸無水物
90 〃
2.6−ジターシャリ−ブチル−1−ヒドロキシトルエ
ン
1、O〃
2−エチル−4−メチルイミダゾール
0.151/
配合組成物B
脂環式エポキシ樹脂
100 重量部
メチルへキサヒドロフタール酸無水物
125 〃
2.6−ジターシャリ−ブチル−1−ヒドロキシトルエ
ン
1.0 〃
2エチル−4メチルイミダゾール
2.5 〃
上記の配合組成物のAと8の比が1対1になるように混
合し注型用樹脂組成物とする。Blended composition A Bisphenol A type epoxy resin 100 Parts by weight Methylhexahydrophthalic anhydride 90 〃 2,6-ditertiary-butyl-1-hydroxytoluene 1, O 〃 2-ethyl-4-methylimidazole 0.151 / Compounded composition B Alicyclic epoxy resin 100 Parts by weight Methyl hexahydrophthalic anhydride 125 〃 2.6-ditertiary-butyl-1-hydroxytoluene 1.0 〃 2-ethyl-4-methylimidazole 2.5 〃 The above blended composition is mixed so that the ratio of A and 8 is 1:1 to obtain a casting resin composition.
Ca F2薄膜を形成したガラス型板により注型成形用
型を作製し、上記の酸無水物硬化系透明エポキシ樹脂を
注型し加熱硬化させた。注型品はガラスを破損すること
なく容易に離型し、Ca F2と接した面はガラスの鏡
面が正確に転写され、くもり等の欠陥は全くなかった。A cast molding mold was prepared using a glass template on which a CaF2 thin film was formed, and the above acid anhydride-curable transparent epoxy resin was poured into the mold and cured by heating. The cast product was easily released from the mold without damaging the glass, the mirror surface of the glass was accurately transferred to the surface in contact with CaF2, and there were no defects such as clouding.
また、フッ素ガス混入した雰囲気でスパッタリングした
CaF2離型膜はガラスとの密着性が強く、その使用回
数は300回以上の繰返しで良好な離型性を有していた
。実施例2
鏡面を有するガラス板にスパッタリング法により厚さ1
500人のCaF2を形成した。スパッタリング条件は
、基板温度は100℃、テトラフルオロエチレンのガス
圧6 X 10 ’Torrとし、更にArを導入して
3 X 10−3Torrにした。膜形成速度は300
0人/分で行った。In addition, the CaF2 mold release film sputtered in an atmosphere containing fluorine gas had strong adhesion to glass, and had good mold release properties even after repeated use of 300 times or more. Example 2 A glass plate with a mirror surface was coated with a thickness of 1 by sputtering.
500 people formed CaF2. The sputtering conditions were such that the substrate temperature was 100° C., the gas pressure of tetrafluoroethylene was 6×10′ Torr, and Ar was further introduced to increase the pressure to 3×10 −3 Torr. Film formation speed is 300
The rate was 0 people/minute.
次に実施例1と同様にして酸無水物硬化剤系透明エポキ
シ樹脂を注入型した結果、350回以上の繰返しで良好
な離型性を有していた。Next, as in Example 1, an acid anhydride curing agent-based transparent epoxy resin was cast into a mold, and as a result, it had good mold releasability even after repeating 350 times or more.
比較例1
フッ素含有ガスの混入をしないArのみの3×10−3
Torrの雰囲気中で、スパッタリングにより厚さ20
00人のCa F2薄膜を形成した注型用型を作製して
、実施1例1と同様に酸無水物硬化剤系透明エポキシ樹
脂を注型した結果、およそ80回までの離型は可能であ
ったが、これ以上の注型では離型効果がなくなり離型が
困難であった。Comparative Example 1 3×10-3 Ar only without mixing fluorine-containing gas
A thickness of 20 mm was formed by sputtering in an atmosphere of Torr.
A casting mold with a CaF2 thin film formed thereon was prepared, and an acid anhydride curing agent-based transparent epoxy resin was cast in the same manner as in Example 1. As a result, the mold could be released up to approximately 80 times. However, if the molding was continued beyond this point, the mold release effect would be lost and mold release would be difficult.
比較例2
ステアリン酸を塗布したガラス型板により注型用型を作
製して、実施例1と同様に酸無水物硬化剤系透明エポキ
シ樹脂を注型した結果、くもりの転写が認められ、また
2回目の注型では離型効果がなくなり離型が困難であっ
た。Comparative Example 2 A casting mold was prepared using a glass template coated with stearic acid, and an acid anhydride curing agent-based transparent epoxy resin was cast in the same manner as in Example 1. As a result, cloudy transfer was observed. In the second casting, the mold release effect disappeared and mold release was difficult.
比較例3
実施例1に示したCa F2の薄膜を形成していないガ
ラス板により注型用型を作り、これに実施例と同じ透明
エポキシ樹脂を注型し硬化させた。Comparative Example 3 A casting mold was made from the glass plate shown in Example 1 on which the Ca F2 thin film was not formed, and the same transparent epoxy resin as in Example was poured into the mold and cured.
注形量は離型が困難で無理に離をしようとしだためガラ
スが破損してしまった。The amount of cast material was difficult to release from the mold, and an attempt was made to forcefully release it, resulting in damage to the glass.
以上のように本発明においてはフッ素含有ガス雰囲気中
でのスパッタリング法によりフッ素含有金属の薄膜が形
成された成形用型を用いて合成樹脂を注型成形すれば合
成樹脂成形品は型から容易に離型することができ、しか
も優れた鏡面を有しているものが得られる。また、離型
膜の耐久性も優れており、特に合成樹脂製光記憶媒体用
基板のように成形品表面の鏡面が重要な光学部品では、
本発明の合成樹脂成形型を使用することによる効果はき
わめて大きい。As described above, in the present invention, if synthetic resin is cast and molded using a mold on which a thin film of fluorine-containing metal is formed by sputtering in a fluorine-containing gas atmosphere, the synthetic resin molded product can be easily removed from the mold. A product that can be released from the mold and has an excellent mirror surface can be obtained. In addition, the durability of the mold release film is excellent, especially for optical parts such as synthetic resin substrates for optical storage media where a mirror surface on the surface of the molded product is important.
The effects of using the synthetic resin mold of the present invention are extremely large.
Claims (1)
パッタリング法によるフッ素含有金属の薄膜を形成させ
たことを特徴とする合成樹脂成形用型。1. A synthetic resin molding mold, characterized in that a thin film of a fluorine-containing metal is formed on the mold surface by sputtering in an atmosphere containing a fluorine-containing gas.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32551087A JPH01166911A (en) | 1987-12-24 | 1987-12-24 | Synthetic resin molding die |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32551087A JPH01166911A (en) | 1987-12-24 | 1987-12-24 | Synthetic resin molding die |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01166911A true JPH01166911A (en) | 1989-06-30 |
Family
ID=18177679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32551087A Pending JPH01166911A (en) | 1987-12-24 | 1987-12-24 | Synthetic resin molding die |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01166911A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100483972B1 (en) * | 2002-02-26 | 2005-04-18 | (주)현대공업 | Face management method of car urethane pad mold and mold |
US7784764B2 (en) | 2004-11-02 | 2010-08-31 | Towa Corporation | Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material |
-
1987
- 1987-12-24 JP JP32551087A patent/JPH01166911A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100483972B1 (en) * | 2002-02-26 | 2005-04-18 | (주)현대공업 | Face management method of car urethane pad mold and mold |
US7784764B2 (en) | 2004-11-02 | 2010-08-31 | Towa Corporation | Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material |
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