JPS6217140U - - Google Patents
Info
- Publication number
- JPS6217140U JPS6217140U JP1985107901U JP10790185U JPS6217140U JP S6217140 U JPS6217140 U JP S6217140U JP 1985107901 U JP1985107901 U JP 1985107901U JP 10790185 U JP10790185 U JP 10790185U JP S6217140 U JPS6217140 U JP S6217140U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive plate
- solder
- good thermal
- cap body
- sealing cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000002470 thermal conductor Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985107901U JPS6217140U (US06229276-20010508-P00022.png) | 1985-07-15 | 1985-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985107901U JPS6217140U (US06229276-20010508-P00022.png) | 1985-07-15 | 1985-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6217140U true JPS6217140U (US06229276-20010508-P00022.png) | 1987-02-02 |
Family
ID=30984603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985107901U Pending JPS6217140U (US06229276-20010508-P00022.png) | 1985-07-15 | 1985-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6217140U (US06229276-20010508-P00022.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63315361A (ja) * | 1987-06-17 | 1988-12-23 | Mitsubishi Electric Corp | 電気車用ブレ−キ制御装置 |
-
1985
- 1985-07-15 JP JP1985107901U patent/JPS6217140U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63315361A (ja) * | 1987-06-17 | 1988-12-23 | Mitsubishi Electric Corp | 電気車用ブレ−キ制御装置 |
