JPS6217127U - - Google Patents
Info
- Publication number
- JPS6217127U JPS6217127U JP1985107730U JP10773085U JPS6217127U JP S6217127 U JPS6217127 U JP S6217127U JP 1985107730 U JP1985107730 U JP 1985107730U JP 10773085 U JP10773085 U JP 10773085U JP S6217127 U JPS6217127 U JP S6217127U
- Authority
- JP
- Japan
- Prior art keywords
- tip
- conical
- angle
- wire bonder
- curved surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985107730U JPH0219966Y2 (https=) | 1985-07-15 | 1985-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985107730U JPH0219966Y2 (https=) | 1985-07-15 | 1985-07-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6217127U true JPS6217127U (https=) | 1987-02-02 |
| JPH0219966Y2 JPH0219966Y2 (https=) | 1990-05-31 |
Family
ID=30984278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985107730U Expired JPH0219966Y2 (https=) | 1985-07-15 | 1985-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0219966Y2 (https=) |
-
1985
- 1985-07-15 JP JP1985107730U patent/JPH0219966Y2/ja not_active Expired
Non-Patent Citations (1)
| Title |
|---|
| GAISER TOOL COMPANYªfj|h´=1984 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0219966Y2 (https=) | 1990-05-31 |