JPS62169769U - - Google Patents
Info
- Publication number
- JPS62169769U JPS62169769U JP1986055333U JP5533386U JPS62169769U JP S62169769 U JPS62169769 U JP S62169769U JP 1986055333 U JP1986055333 U JP 1986055333U JP 5533386 U JP5533386 U JP 5533386U JP S62169769 U JPS62169769 U JP S62169769U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- laser
- point
- head
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986055333U JPH0231256Y2 (cs) | 1986-04-15 | 1986-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986055333U JPH0231256Y2 (cs) | 1986-04-15 | 1986-04-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62169769U true JPS62169769U (cs) | 1987-10-28 |
| JPH0231256Y2 JPH0231256Y2 (cs) | 1990-08-23 |
Family
ID=30883136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986055333U Expired JPH0231256Y2 (cs) | 1986-04-15 | 1986-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231256Y2 (cs) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010192570A (ja) * | 2009-02-17 | 2010-09-02 | Panasonic Corp | レーザはんだ付け装置 |
| JP2023163755A (ja) * | 2022-04-28 | 2023-11-10 | パック テック-パッケージング テクノロジーズ ゲーエムベーハー | 回路基板に電子部品をはんだ付けするための方法及び装置、コンピュータプログラム製品、並びにコンピュータ可読媒体 |
| JP2024161118A (ja) * | 2019-11-21 | 2024-11-15 | レーザーセル カンパニー リミテッド | レーザリフロー装置 |
-
1986
- 1986-04-15 JP JP1986055333U patent/JPH0231256Y2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010192570A (ja) * | 2009-02-17 | 2010-09-02 | Panasonic Corp | レーザはんだ付け装置 |
| US8525072B2 (en) | 2009-02-17 | 2013-09-03 | Panasonic Corporation | Laser soldering apparatus |
| JP2024161118A (ja) * | 2019-11-21 | 2024-11-15 | レーザーセル カンパニー リミテッド | レーザリフロー装置 |
| JP2023163755A (ja) * | 2022-04-28 | 2023-11-10 | パック テック-パッケージング テクノロジーズ ゲーエムベーハー | 回路基板に電子部品をはんだ付けするための方法及び装置、コンピュータプログラム製品、並びにコンピュータ可読媒体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231256Y2 (cs) | 1990-08-23 |
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