JPS62169436A - Device for positioning semiconductor chip - Google Patents

Abstract

PURPOSE:To make it possible to position a plurality of semiconductor chips at a time within a small space by providing a fixing guide having plural L- shaped positioning parts and a movable guide having plural positioning clicks for pressing semiconductor chips against the fixing guide from another side of the fixing guide to bring them into contact with the guide. CONSTITUTION:In a position B near a positioning point on a stage 50, semiconductor chips 10a-10c are mounted. Next, positioning clicks 30a-30c of a movable guide 20 are moved toward positioning parts of L-shaped fixing guides 401-40c and the positioning operation of the semiconductor chips 10a-10c to accurate positions is performed. Thus, the positioning operation of plural semiconductor chips can be effected at a time.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor chip positioning device that simultaneously positions a plurality of semiconductor chips when assembling semiconductor chips. 1 is a plan view showing an example of a conventional semiconductor chip positioning device. (1) is a square semiconductor chip, (
2a) = (2b) is a positioning claw that moves in the first axis direction;
(3m) and (3b) are positioning claws that move in the direction of the {circle around (2)} axis. (4) is a stage, and (4) is approximately at the center of stage (4).

In order to position the semiconductor chip (1) using this device, the semiconductor chip (1) is first placed on the stage (4) at approximately the center part (2). Next, four positioning claws (2a), (2) are used to correctly position the semiconductor chip (1).
b), (3a)-(3b)'fr, each axial direction (
The semiconductor chip (1) is accurately positioned by performing synchronized movements toward the center in the first axis direction and second axis direction.

[Problem that the invention seeks to solve]

According to the conventional semiconductor chip positioning device configured as described above, four positions (2a) and (2b) are performed.

(3g) and (3b) must perform all movements in synchronization, and two driving parts are required. Therefore, only one semiconductor chip can be positioned, and positioning a plurality of semiconductor chips at once requires a complicated mechanism and a large space.

The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a semiconductor chip positioning device which has a simple structure and can position a divisor of semiconductor chips at a time in a small space.

[Means for solving problems]

The present invention has been made to achieve the above objects,
A fixed guide having a plurality of L-shaped positioning parts, and a movable guide having a plurality of positioning claws that press and contact the semiconductor chip from the other side of the fixed guide with respect to the fixed guide, This is a semiconductor chip positioning device that positions all semiconductor chips at the same time. [Operation] A plurality of semiconductor chips are placed on the side of the stage near the positioning point, and the positioning part and movable part of the semiconductor chip all-fixed guide are installed. Position them at the same time using the positioning claws on the guide.

〔Example〕

FIGS. 1(a) and 1(b) are action explanatory diagrams showing a second embodiment of the present invention, respectively. (10a), (10b), (
10c) is a square-shaped semiconductor chip, (4) is a movable guide, and (50a), (30b), (31]c) are semiconductor chips provided at regular intervals on the movable guide ω (10a).
, (10b)-(10c).

The positioning claws (30a), (30b), and (3Qc) each have two claw portions that intersect at right angles.

On the other hand, (40a), (40b), and (40c) are L-shaped semiconductor chips (10a), (10b)-(
10c) is a fixed guide having a positioning member for positioning. The button is a stage, and fixed guides (40a), (40b), and (40c) are fixed on the stage wall, and a movable guide (a) moves in the arrow ■ or @ direction.

A complete explanation of the operation of this embodiment configured as described above is as follows. First, place the semiconductor chip (J, near the positioning point FB on the stage wheel) shown in Figure 1(a).
10a), (10b), (10c)'fr: Place.

Next, positioning claws (30a) - (30
b).

(30e), L-shaped fixed guide (40a), (4Qb)
) - (40c) in the direction of the positioning part (arrow ■ direction), and the semiconductor chips (10a) - (10b), (10c
) to the correct position. Figure 1 (
In b), the movable guide (20) stops and the semiconductor chip (10)
a).

(1o, b) and (10c) are shown in position, and the arrow @ indicates the return direction when the movable guide ■ returns to its original position.

By attaching 3 (or 9) pre-positioned claws to the movable guide as described above and correspondingly attaching 6 (or more) L-shaped fixed guides, multiple pieces can be produced at once. The positioning operation 1a of the semiconductor chip can be performed.

FIGS. 2(a) and 2(b) are operation explanatory diagrams showing another embodiment of the present invention. In FIGS. 1(a) and 1(b), the semiconductor chip positioning claws (30a) and (30
b) and (30c) are attached to one movable guide (21) and are configured to move integrally in the first axis direction and the second axis direction.In contrast, the positioning guide according to this embodiment The device is provided with a movable guide (positioning pawl) that moves separately in the first and second axial directions.

In addition, the parts with the same functions as in Figures 1 (a) and (b):
Is it the same symbol? The attached explanation will be omitted. (200a) is iK I = 11 provided in the upper direction in the figure of the stage area]
The movable guide υ moves in the direction e, and (200b) indicates a movable guide that moves in the direction O of the 2-th axis provided downward in the figure. Also (300a), (300b).

(300c) is the end of the movable guide (2001L) and positioning claws that are provided at regular intervals therefrom and protrude in the axial direction of the solid layer 11. Furthermore, (,300d), (3000
).

(300f)&engineer movement guide C2oob) and an inverted-shaped positioning pawl that protrudes in the first axis direction and is provided at regular intervals therefrom.

The operation of the present embodiment configured as described above (!l) will be explained as follows.As shown in FIG. 2(a), 2 , the movable guide (200a)-(200b) Wr are moved separately in the direction of the arrow to perform positioning. Fig. 2(b)
indicates a positioned state, and arrow 6 indicates the return direction when the b1 movement guides (20a) and (200b) return to their original positions.

As in this embodiment, the guide (200a) is 11.

(200b) has separate positioning claws dedicated to the ■th axis direction and the 11th axis direction, the semiconductor chip (10
Even if a) etc. are elongated, good accuracy can be maintained unlike the positioning claw shown in FIG.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, the first @
Since one of the positioning nails facing each other in the direction and the second axis direction is fixed, and the other positioning nail is used to position the entire semiconductor chip, the structure of the device is simple, and
It has the remarkable effect of being able to position a large number of semiconductor chips at once in a small space.

[Brief explanation of drawings]

Figures 1 (a) and (b) are action explanatory diagrams showing an embodiment of the present invention, Figures 2 (a) and (b) are action explanatory diagrams showing another embodiment of the present invention, and Figure 83 is a conventional diagram. 1 is a plan view showing an example of a semiconductor chip positioning device of FIG. (10a), (10b), (10c: L” semiconductor chip, C'G, (200a), (200b) = movable guide, (30a). (30b), (30c), (300a) , (300
b). (300c), (300d), (300e), (300
f) - Positioning claws (40a, ), (40b), (40c
)--Fixed guide, Fi)--Stage. In each figure, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] (1) A semiconductor chip positioning device that positions a semiconductor chip on a stage includes a fixed guide having a plurality of L-shaped positioning parts, and a semiconductor chip pressed against the fixed guide by the other fixed guide. 1. A semiconductor chip positioning device, comprising: a movable guide having a plurality of positioning claws; and the semiconductor chip positioning device positions the plurality of semiconductor chips simultaneously.