JPS62169124A - Liquid crystal display element provided with flexible distributing board - Google Patents
Liquid crystal display element provided with flexible distributing boardInfo
- Publication number
- JPS62169124A JPS62169124A JP1011586A JP1011586A JPS62169124A JP S62169124 A JPS62169124 A JP S62169124A JP 1011586 A JP1011586 A JP 1011586A JP 1011586 A JP1011586 A JP 1011586A JP S62169124 A JPS62169124 A JP S62169124A
- Authority
- JP
- Japan
- Prior art keywords
- material layer
- layer
- liquid crystal
- crystal display
- display element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 19
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 239000003566 sealing material Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 abstract description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052709 silver Inorganic materials 0.000 abstract description 8
- 239000004332 silver Substances 0.000 abstract description 8
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 229920001225 polyester resin Polymers 0.000 abstract description 2
- 239000004645 polyester resin Substances 0.000 abstract description 2
- 229920001721 polyimide Polymers 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000009719 polyimide resin Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 241000207961 Sesamum Species 0.000 description 1
- 235000003434 Sesamum indicum Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はフレキシブル配線板付き液晶表示素子に係り、
特にフレキシブル配線板と液晶表示素子との接続構造に
関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a liquid crystal display element with a flexible wiring board,
In particular, it relates to a connection structure between a flexible wiring board and a liquid crystal display element.
一般に液晶表示素子とプリント基板との接続には、導電
ゴム又はバネ製リン青銅よりなるビンコネクタが用いら
れている。しかし、近年、接続スペースの小型化、誤配
線の防止、配線の容易化を図るため、フレキシブル配線
板が注目されている。Generally, a bin connector made of conductive rubber or spring-made phosphor bronze is used to connect a liquid crystal display element and a printed circuit board. However, in recent years, flexible wiring boards have been attracting attention in order to reduce the size of the connection space, prevent incorrect wiring, and facilitate wiring.
従来、フレキシブル配線板を用いた場合、液晶表示素子
の端子部の透明導電膜とフレキシブル配線板の導体層間
に銀ペーストからなる導電材層を介在させている（例え
ば特開昭５５−２９８０９号）。Conventionally, when a flexible wiring board is used, a conductive material layer made of silver paste is interposed between the transparent conductive film of the terminal portion of the liquid crystal display element and the conductor layer of the flexible wiring board (for example, Japanese Patent Laid-Open No. 55-29809). .
従来は、液晶表示素子の透明導電膜とフレキシブル配線
板の導体層間に単に導電材層が介在されているのみであ
るので、特に高温高湿下での通電において、導電材層の
銀ペーストが電界方向に伸展し、短絡回路が生じるとい
う問題点があった。Conventionally, a conductive material layer is simply interposed between the transparent conductive film of the liquid crystal display element and the conductor layer of the flexible wiring board, so that the silver paste of the conductive material layer prevents the electric field, especially when conducting electricity under high temperature and high humidity. There was a problem in that it stretched in the direction, causing a short circuit.
本発明の目的は、高温高湿通電下でも安定し、高信頼度
を有するフレキシブル配線板付き液晶表示素子を提供す
ることにある。An object of the present invention is to provide a liquid crystal display element with a flexible wiring board that is stable even under high temperature, high humidity, and high reliability.
」；記問題点は、液晶表示素子の透明導電膜とフレキシ
ブル配線板の導体層間に介在された導電材層を包み込む
ようにシール材層を形成することにより解決される。The problem described above is solved by forming a sealing material layer so as to wrap around a conductive material layer interposed between a transparent conductive film of a liquid crystal display element and a conductive layer of a flexible wiring board.
隣接電極間の電位差により生じる導電材層の銀ペースト
の伸展はシール材層によって防止される。The sealing material layer prevents the silver paste of the conductive material layer from spreading due to the potential difference between adjacent electrodes.
以下、本発明の一実施例を第１図及び第２図により説明
する。１は液晶表示素子で、２，３は透明導電膜が形成
されたガラスからなる上、下基板。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. 1 is a liquid crystal display element, and 2 and 3 are upper and lower substrates made of glass on which transparent conductive films are formed.
４は下基板３上に形成された透明導電膜、５は液晶表示
索子１の端子部の透明導電膜４上に形成された銀ペース
トよりなる導電材層である。６はフレキシブル配線板で
、７．８は絶縁層、９は導体層、１０は前記導電材層５
を包み込むようにフレキシブル配線板６の端子部に形成
されたシール材層である。１１はフレキシブル配線板６
を液晶表示索子１に固定する固定樹脂である。4 is a transparent conductive film formed on the lower substrate 3, and 5 is a conductive material layer made of silver paste formed on the transparent conductive film 4 at the terminal portion of the liquid crystal display element 1. 6 is a flexible wiring board, 7.8 is an insulating layer, 9 is a conductive layer, and 10 is the conductive material layer 5.
This is a sealing material layer formed on the terminal portion of the flexible wiring board 6 so as to enclose the terminal portion of the flexible wiring board 6. 11 is a flexible wiring board 6
This is a fixing resin that fixes the liquid crystal display cable 1 to the liquid crystal display cable 1.
本実施例では、シール材層１０及び導電材層５として、
熱硬化型のエポキシ系の材料を用い、更に導電材層５と
してリンペン状及び球状の銀を３０体積％含有したもの
を用いた。またフレキシブル配線板６としては、絶縁層
７にポリイミド胡脂、絶縁層８にポリエステル系樹脂、
導体Ｍ９に鋼材から構成されているものを用いた。In this embodiment, as the sealing material layer 10 and the conductive material layer 5,
A thermosetting epoxy material was used, and the conductive material layer 5 contained 30% by volume of phosphorescent and spherical silver. In addition, the flexible wiring board 6 includes polyimide sesame for the insulating layer 7, polyester resin for the insulating layer 8,
The conductor M9 was made of steel.
このように、導電材層５はシール材層１０で包み込まれ
ているので、隣接電極間の電位差により生じる導電材層
５の銀ペーストの伸展を防止できる。In this way, since the conductive material layer 5 is surrounded by the sealing material layer 10, it is possible to prevent the silver paste of the conductive material layer 5 from spreading due to the potential difference between adjacent electrodes.
なお、上記実施例においては、導電材層５を液晶表示素
子１に形成し、シール材層１０をフレキシブル配線板６
に形成したが、導電材層５及びシール材層１０は逆に形
成しても、または液晶表示索子１及びフレキシブル配線
板６のいずれか一方に形成してもよい。しかし、印刷の
関係上、それぞれ別部材に形成した方が量産性が良い。In the above embodiment, the conductive material layer 5 is formed on the liquid crystal display element 1, and the sealing material layer 10 is formed on the flexible wiring board 6.
However, the conductive material layer 5 and the sealing material layer 10 may be formed in the opposite manner, or may be formed on either the liquid crystal display cable 1 or the flexible wiring board 6. However, due to printing considerations, mass production is better if each is formed as a separate member.
本発明によれば、導電材層の伸展はシール材層によって
防止されるので、高温高湿通電下でも安定し、高信頼性
を有する。According to the present invention, since the extension of the conductive material layer is prevented by the sealing material layer, it is stable even under high temperature, high humidity, and energization, and has high reliability.
第１図は本発明の一実施例を示す端子部の断面図、第２
図は第１図の平面図である。
１・・・液晶表示素子、４・・・透明導電膜、５・・・
導電材層、６・・・フレキシブル配線板、１・・・液晶
表示素子
４・・・透明導電膜
５・・・導電材層
６・・・フレキシブル配線板
９・・・導電層
１０・・・シール材層FIG. 1 is a sectional view of a terminal portion showing one embodiment of the present invention, and FIG.
The figure is a plan view of FIG. 1. 1... Liquid crystal display element, 4... Transparent conductive film, 5...
Conductive material layer, 6... Flexible wiring board, 1... Liquid crystal display element 4... Transparent conductive film 5... Conductive material layer 6... Flexible wiring board 9... Conductive layer 10... Seal material layer
Claims (1)
介してフレキシブル配線板の導体層を接続してなるフレ
キシブル配線板付き液晶表示素子において、前記導電材
層を包み込むようにシール材層を形成したことを特徴と
するフレキシブル配線板付き液晶表示素子。1. In a liquid crystal display element with a flexible wiring board in which a conductive layer of a flexible wiring board is connected to a transparent conductive film of a terminal portion of the liquid crystal display element via a conductive material layer, a sealing material is applied so as to wrap around the conductive material layer. A liquid crystal display element with a flexible wiring board characterized by forming a layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1011586A JPS62169124A (en) | 1986-01-22 | 1986-01-22 | Liquid crystal display element provided with flexible distributing board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1011586A JPS62169124A (en) | 1986-01-22 | 1986-01-22 | Liquid crystal display element provided with flexible distributing board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62169124A true JPS62169124A (en) | 1987-07-25 |
Family
ID=11741306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1011586A Pending JPS62169124A (en) | 1986-01-22 | 1986-01-22 | Liquid crystal display element provided with flexible distributing board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62169124A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08234222A (en) * | 1995-02-28 | 1996-09-13 | Nec Kagoshima Ltd | Method for connecting liquid crystal display device |
| JP2003005667A (en) * | 2001-06-21 | 2003-01-08 | Pioneer Electronic Corp | Display device |
-
1986
- 1986-01-22 JP JP1011586A patent/JPS62169124A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08234222A (en) * | 1995-02-28 | 1996-09-13 | Nec Kagoshima Ltd | Method for connecting liquid crystal display device |
| JP2003005667A (en) * | 2001-06-21 | 2003-01-08 | Pioneer Electronic Corp | Display device |
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