JPS62166636U - - Google Patents
Info
- Publication number
- JPS62166636U JPS62166636U JP5431986U JP5431986U JPS62166636U JP S62166636 U JPS62166636 U JP S62166636U JP 5431986 U JP5431986 U JP 5431986U JP 5431986 U JP5431986 U JP 5431986U JP S62166636 U JPS62166636 U JP S62166636U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- bare chip
- semiconductor bare
- electrode
- bonding pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
-
- H10W72/5449—
-
- H10W90/754—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5431986U JPS62166636U (enExample) | 1986-04-11 | 1986-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5431986U JPS62166636U (enExample) | 1986-04-11 | 1986-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62166636U true JPS62166636U (enExample) | 1987-10-22 |
Family
ID=30881199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5431986U Pending JPS62166636U (enExample) | 1986-04-11 | 1986-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62166636U (enExample) |
-
1986
- 1986-04-11 JP JP5431986U patent/JPS62166636U/ja active Pending