JPS62166629U - - Google Patents
Info
- Publication number
- JPS62166629U JPS62166629U JP5381086U JP5381086U JPS62166629U JP S62166629 U JPS62166629 U JP S62166629U JP 5381086 U JP5381086 U JP 5381086U JP 5381086 U JP5381086 U JP 5381086U JP S62166629 U JPS62166629 U JP S62166629U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- substrate
- heating jig
- attachment part
- substrate heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000008188 pellet Substances 0.000 claims description 6
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 claims 1
- 239000006023 eutectic alloy Substances 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5381086U JPS62166629U (zh) | 1986-04-09 | 1986-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5381086U JPS62166629U (zh) | 1986-04-09 | 1986-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62166629U true JPS62166629U (zh) | 1987-10-22 |
Family
ID=30880215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5381086U Pending JPS62166629U (zh) | 1986-04-09 | 1986-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62166629U (zh) |
-
1986
- 1986-04-09 JP JP5381086U patent/JPS62166629U/ja active Pending