JPS62166515A - Processing cup for semiconductor manufacturing apparatus - Google Patents
Processing cup for semiconductor manufacturing apparatusInfo
- Publication number
- JPS62166515A JPS62166515A JP802986A JP802986A JPS62166515A JP S62166515 A JPS62166515 A JP S62166515A JP 802986 A JP802986 A JP 802986A JP 802986 A JP802986 A JP 802986A JP S62166515 A JPS62166515 A JP S62166515A
- Authority
- JP
- Japan
- Prior art keywords
- fluid
- hole
- bottom plate
- arrow
- boss
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 239000012530 fluid Substances 0.000 claims abstract description 26
- 230000002093 peripheral effect Effects 0.000 claims abstract description 9
- 230000000630 rising effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims 1
- 238000004140 cleaning Methods 0.000 description 14
- 239000007788 liquid Substances 0.000 description 11
- 238000001035 drying Methods 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、半導体製造用の現像装置や塗布装置等におい
てワークに対して洗浄や乾燥等の処理を施す処理カップ
に関し、特に部品点数を少なくして配管結合を簡素化で
きると共に取扱い調整が容易な半導体製造装置の処理カ
ップに関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a processing cup that performs processing such as cleaning and drying on a workpiece in a developing device, a coating device, etc. for semiconductor manufacturing, and particularly relates to a processing cup with a reduced number of parts. The present invention relates to a processing cup for semiconductor manufacturing equipment that can simplify piping connections and is easy to handle and adjust.
従来の技術
従来のこの種の処理カップは、第３図に示すように、底
板１の中心部にワーク２を保持するスピンチャック３の
回転軸４が嵌まるボス部５を有すると共に、この底板１
の外周縁には略垂直に立ち上がる側壁６を有している。2. Description of the Related Art As shown in FIG. 3, a conventional processing cup of this type has a boss portion 5 in the center of a bottom plate 1 into which a rotating shaft 4 of a spin chuck 3 for holding a workpiece 2 is fitted. 1
It has a side wall 6 that stands up substantially vertically on its outer peripheral edge.
そして、上記側壁６の下部に貫通孔を穿設してパルプヘ
ッド７を取り付け、このバルブヘッド７の内側部分から
ボス部５に向けて例えばステンレスチューブ８を延ばし
。Then, a through hole is bored in the lower part of the side wall 6 to attach the pulp head 7, and a stainless steel tube 8, for example, is extended from the inner side of the valve head 7 toward the boss portion 5.
その先端部を立ち上げてノズル９を上記スピンチャック
３に保持されたワーク２の裏面に向けてセットシていた
。上記バルブヘッド７の外側部分には継手１０によって
配管系１１が接続されており、この配管系１１から矢印
へのように洗浄液または純水あるいはブローガスを供給
することにより、上記ノズル９からワーク２の裏面に洗
浄液等を噴出して所要の処理を施していた。なお、第３
図において、符号１２は上記ステンレスチューブ８の押
え金具である。The tip thereof was raised and the nozzle 9 was set toward the back surface of the workpiece 2 held by the spin chuck 3. A piping system 11 is connected to the outer part of the valve head 7 by a joint 10, and by supplying cleaning liquid, pure water, or blow gas from the piping system 11 in the direction of the arrow, the workpiece 2 is removed from the nozzle 9. The required treatment was carried out by spraying cleaning liquid etc. on the back side. In addition, the third
In the figure, reference numeral 12 is a metal fitting for holding down the stainless steel tube 8.
また、他の従来例としては、第４図に示すように、ボス
部５の近傍の底板１に貫通孔を穿設してパルプヘッド７
を取り付け、このパルプヘッド７の内側部分から略垂直
にステンレスチューブ８を立ち上げ、その先端部のノズ
ル９をスピンチャック３に保持されたワーク２の裏面に
向けてセットしていた。上記パルプヘッド７の外側部分
には継手１０によって配管系１１が接続されており、こ
の配管系１１から矢印Ｂのように洗浄液又は純水あるい
はブローガスを供給することにより、ワーク２に対して
所要の処理を施していた。In addition, as another conventional example, as shown in FIG.
A stainless steel tube 8 was raised substantially vertically from the inside of the pulp head 7, and the nozzle 9 at the tip thereof was set toward the back surface of the workpiece 2 held by the spin chuck 3. A piping system 11 is connected to the outer part of the pulp head 7 by a joint 10, and by supplying cleaning liquid, pure water, or blow gas from this piping system 11 as shown by arrow B, the required amount of water is applied to the workpiece 2. It was being processed.
発明が解決しようとする問題点
しかし、このような従来の処理カップにおいては、次の
ような問題点があった。まず、第３図に示す第一の従来
例においては、洗浄や乾燥等の処理を施す系統が、パル
プヘッド７と、ステンレスチューブ８と、押え金具１２
等からなり、部品点数が多いものであった。また、上記
ステンレスチューブ８は、側壁６からボス部５に向けて
延ばすと共に略垂直に立ち上げているので、その組立て
時または調整時においてノズル９の位置や角度をその都
度セットしなければならず、面倒であった。Problems to be Solved by the Invention However, such conventional processing cups have the following problems. First, in the first conventional example shown in FIG. 3, the system that performs cleaning, drying, etc.
It consisted of a large number of parts. Further, since the stainless steel tube 8 extends from the side wall 6 toward the boss portion 5 and stands up almost vertically, the position and angle of the nozzle 9 must be set each time when assembling or adjusting the stainless steel tube 8. , it was a hassle.
さらに、処理カップ内を清掃するときなどに上記ノズル
９にされると、該ノズル９の位置や角度が変わることが
あり、再セットしなければならなかった。また、上記側
壁６は円筒状に湾曲しているので、パルプヘッド７の締
め付けが十分にできず、シールを完全に行わないと該パ
ルプヘッド７の部分から洗浄液やブローガスが洩れるこ
とがあった。Furthermore, when the nozzle 9 is used when cleaning the inside of the processing cup, the position and angle of the nozzle 9 may change, and it is necessary to reset the nozzle 9. Further, since the side wall 6 is curved into a cylindrical shape, the pulp head 7 cannot be sufficiently tightened, and cleaning liquid or blow gas may leak from the pulp head 7 unless the seal is completely sealed.
次に、第４図に示す第二の従来例においては、底板１の
上面に処理液や洗浄液などがたまるが、該底板１に取り
付けられたパルプヘッド７のシールが完全でないと、そ
のパルプヘッド７の部分から処理カップ内の処理液等が
外部に洩れることがあった。また、パルプヘッド７に対
して継手１０により配管系１１を接続する際、上記パル
プヘッド７が底板１の中心付近に位置しているため、奥
まで手を伸ばさなければならず配管作業がやり難いもの
であった。さらに、上記のように底板１の下方に継手１
０や配管系１１を接続しなければならないので、高さ方
向のスペースＨを多くとられるものであった。Next, in the second conventional example shown in FIG. 4, processing liquid, cleaning liquid, etc. accumulate on the upper surface of the bottom plate 1, but if the pulp head 7 attached to the bottom plate 1 is not completely sealed, the pulp head The processing liquid, etc. in the processing cup sometimes leaked to the outside from the part 7. Furthermore, when connecting the piping system 11 to the pulp head 7 using the joint 10, since the pulp head 7 is located near the center of the bottom plate 1, it is difficult to perform piping work since the pulp head 7 is located near the center of the bottom plate 1. It was something. Furthermore, as mentioned above, the joint 1 is placed below the bottom plate 1.
0 and piping system 11 must be connected, a large amount of space H in the height direction is required.
そこで、本発明はこのような問題点を解決することを目
的とする。Therefore, an object of the present invention is to solve such problems.
問題点を解決するための手段
上記の問題点を解決する本発明の手段は、底板の中心部
にワークを保持するスピンチャックの回転軸が嵌まるボ
ス部を有すると共に、この底板の外周縁には略垂直に立
ち上がる側壁を有し、上記スピンチャックに保持された
ワークに対して所要の処理を施す半導体製造装置の処理
カップにおいて、上記底板の厚み内にその外周端からボ
ス部に向けて流体の通る通し孔を穿設し、上記ボス部内
には略垂直に立ち上がる連通孔を設けると共に、該ボス
部の上端部には所定の角度でワーク裏面に流体を噴出す
るノズル口を穿設し、かつ上記底板に穿設された通し孔
の外側端には流体の配管系の接続口を設けたことによっ
てなされる。Means for Solving the Problems The means of the present invention for solving the above problems has a boss part in the center of the bottom plate into which the rotating shaft of the spin chuck that holds the workpiece is fitted, and a boss part on the outer periphery of the bottom plate. has a side wall that rises approximately vertically, and is a processing cup of semiconductor manufacturing equipment that performs required processing on a workpiece held by the spin chuck. A through hole through which the fluid passes is bored, and a communication hole rising approximately vertically is provided in the boss portion, and a nozzle opening for spouting fluid onto the back surface of the workpiece at a predetermined angle is provided in the upper end of the boss portion; This is achieved by providing a connection port for a fluid piping system at the outer end of the through hole bored in the bottom plate.
実施例
以下、本発明の実施例を添付図面に基づいて詳細に説明
する。Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
第１図は本発明による半導体製造装置の処理カップの実
施例を示す垂直面内の中央断面図である。FIG. 1 is a central sectional view in a vertical plane showing an embodiment of a processing cup for a semiconductor manufacturing apparatus according to the present invention.
この処理カップは、半導体製造用の現像装置や塗布装置
等においてワークに対して洗浄や乾燥等の処理を施すも
ので、底板１の中心部にウェハ等のワーク２を保持する
スピンチャック３の回転軸４が嵌まるボス部５を有する
と共に、この底板１の外周縁には略垂直に立ち上がる側
壁６を有している。This processing cup is used to perform processing such as cleaning and drying on a workpiece in a developing device or a coating device for semiconductor manufacturing, and rotates a spin chuck 3 that holds a workpiece 2 such as a wafer in the center of a bottom plate 1. It has a boss portion 5 into which the shaft 4 is fitted, and a side wall 6 rising approximately perpendicularly to the outer peripheral edge of the bottom plate 1.
ここで、本発明においては、上記底板１はやや厚手に形
成されており、この底板１の厚み内にはその外周端から
ボス部５に向けて通し孔１３が穿設されている。この通
し孔１３は、洗浄用の液体または乾燥用のガス等の流体
を供給するもので。Here, in the present invention, the bottom plate 1 is formed to be somewhat thick, and a through hole 13 is bored in the thickness of the bottom plate 1 from its outer peripheral end toward the boss portion 5. This through hole 13 is for supplying fluid such as cleaning liquid or drying gas.
その内側端は上記ボス部５の中央部外周面に円周方向に
切られた凹溝１４（第２図参照）と接続されている。そ
して、上記ボス部５の内部の適宜箇所には連通孔１５が
設けられると共に、該ボス部５の上端部にはノズル口１
６が穿設されている。The inner end thereof is connected to a groove 14 (see FIG. 2) cut in the circumferential direction on the outer peripheral surface of the central portion of the boss portion 5. Communication holes 15 are provided at appropriate locations inside the boss portion 5, and a nozzle port 1 is provided at the upper end of the boss portion 5.
6 is drilled.
上記連通孔１５は、上記円周方向の凹溝１４とノズル口
１６とを接続して流体を供給するもので、ボス部５内に
て略垂直に立ち上がるように形成されている。また、上
記ノズル口１６は、スピンチャック３に保持されたワー
ク２の裏面に向けて洗浄液またはブローガス等を噴出す
るもので、上記ワーク２の裏面に対して所定の噴出角度
となるように予め位置決めされると共に、所定の内径に
形成されている。さらに、上記底板１に穿設された通し
孔１３の外側端には、接続口１７が設けられている。こ
の接続口１７は、流体の配管系を接続する部分であり１
例えばテーパ雄ネジが切られており、テーパ雄ネジを有
する継手１８によって配管系１９が接続されるようにな
っている。なお、第１図において、符号２ｏは上記連通
孔１５の下端に嵌合されためくら栓であるが、このめく
ら栓２０は取り除いて上記連通孔１５の下端を溶接等に
より閉じてしまってもよい。The communication hole 15 connects the circumferential groove 14 and the nozzle port 16 to supply fluid, and is formed to stand up substantially vertically within the boss portion 5. Further, the nozzle port 16 is for spouting cleaning liquid or blow gas, etc. toward the back surface of the work 2 held on the spin chuck 3, and is positioned in advance so as to have a predetermined spray angle with respect to the back surface of the work 2. and is formed to have a predetermined inner diameter. Furthermore, a connection port 17 is provided at the outer end of the through hole 13 bored in the bottom plate 1. This connection port 17 is a part for connecting a fluid piping system.
For example, a tapered male thread is cut, and a piping system 19 is connected by a joint 18 having a tapered male thread. In FIG. 1, reference numeral 2o indicates a blind plug fitted to the lower end of the communication hole 15, but the blind plug 20 may be removed and the lower end of the communication hole 15 closed by welding or the like. .
このように構成された本発明の処理カップを使用するに
は、まず、底板１の外周端において上記通し孔１３の接
続口１７に、継手１８を利用して配管系１９を接続する
。次に、この配管系１９に設けられた図示外の流体供給
源から矢印Ｃのように洗浄液またはガス等の流体を供給
する。すると、上記流体は、第１図に矢印りで示すよう
に通し孔１３内を進み、ボス部５の外周面に切られた凹
溝１４に到達する。ここで、上記流体は、第２図に破線
矢印で示すように、両方に分れて円周方向の凹溝１４内
を進む。そして、第１図に示す連通孔１５の位置までく
ると、該連通孔１５内を矢印Ｅ方向に上昇する。その後
、上記連通孔１５と接続されたノズル口１６から、矢印
Ｆ方向に流体が噴出し、スピンチャック３に保持された
ワーク２の裏面に吹きかかり、該ワーク２を洗浄したり
、乾燥したりする。To use the processing cup of the present invention constructed in this way, first, the piping system 19 is connected to the connection port 17 of the through hole 13 at the outer peripheral end of the bottom plate 1 using the joint 18. Next, a fluid such as cleaning liquid or gas is supplied as indicated by arrow C from a fluid supply source (not shown) provided in this piping system 19 . Then, the fluid advances through the through hole 13 as shown by the arrow in FIG. 1, and reaches the groove 14 cut in the outer peripheral surface of the boss portion 5. Here, the fluid is divided into two parts and travels in the groove 14 in the circumferential direction, as shown by the broken line arrow in FIG. Then, when it reaches the position of the communication hole 15 shown in FIG. 1, it moves up inside the communication hole 15 in the direction of arrow E. Thereafter, fluid is ejected from the nozzle port 16 connected to the communication hole 15 in the direction of arrow F, and is sprayed onto the back surface of the workpiece 2 held by the spin chuck 3, thereby cleaning or drying the workpiece 2. do.
なお、第２図においては、上記連通孔１５及びノズル口
１６はボス部５に三箇所だけ設けたちのとして示したが
、本発明はこれに限らず、上記凹溝１４の円周上におい
て適宜の三箇所以上に設けてもよい。In FIG. 2, the communicating hole 15 and the nozzle port 16 are shown as being provided at only three locations on the boss portion 5, but the present invention is not limited to this, and the communicating hole 15 and the nozzle port 16 are provided at three locations on the circumference of the recessed groove 14 as appropriate. They may be provided in three or more locations.
発明の効果
本発明は以上説明したように、底板１の厚み内にその外
周端からボス部５に向けて流体の通る通し孔１３を穿設
し、上記ボス部５内には連通孔１５を設けると共に、該
ボス部５の上端部にはノズル口１６を穿設し、かつ上記
通し孔１３の外側端には流体の配管系１９の接続口１７
を設けたので、単に上記接続口１７に継手１８を利用し
て配管系１９を接続するだけで配管結合ができ、部品点
数を少なくして配管を簡素化できると共に、配管作業を
簡単に行うことができる。また、ボス部５の上端部に穿
設されたノズル［１１６は、予めワーク２の裏面に対し
て所定の噴出角度となるように位置決めされているので
、組立て時または調整時において上記ノズル口１６の位
置や角度をその都度セットする必要はない。さらに、処
理カップ内を清掃する場合においても、上記ノズル口１
６の位置や角度が変わることはなく、従来のように再セ
ットする必要はない。これらのことから、処理カップ全
体としてその取扱い調整が容易となる。また、底板１ま
たは側壁６には、従来のようなバルブヘッド７を取り付
けるための貫通孔は穿設されていないので、処理カップ
内の処理液等が外部に洩れるのをほぼ完全に防止できる
。Effects of the Invention As described above, the present invention has a through hole 13 through which a fluid passes from the outer circumferential end of the bottom plate 1 toward the boss portion 5 in the thickness thereof, and a communication hole 15 in the boss portion 5. In addition, a nozzle port 16 is provided at the upper end of the boss portion 5, and a connection port 17 for a fluid piping system 19 is provided at the outer end of the through hole 13.
Since this is provided, piping can be connected by simply connecting the piping system 19 to the connection port 17 using the joint 18, reducing the number of parts and simplifying the piping, and making piping work easier. I can do it. Further, since the nozzle [116 bored at the upper end of the boss portion 5 is positioned in advance so as to have a predetermined ejection angle with respect to the back surface of the workpiece 2, the nozzle opening 116 is There is no need to set the position and angle of each time. Furthermore, even when cleaning the inside of the processing cup, the nozzle port 1
The position and angle of 6 do not change, and there is no need to reset it like in the past. For these reasons, handling and adjustment of the processing cup as a whole becomes easy. Furthermore, since no through hole is provided in the bottom plate 1 or the side wall 6 for attaching the valve head 7 as in the conventional case, leakage of the processing liquid, etc. in the processing cup to the outside can be almost completely prevented.
第１図は本発明による半導体製造装置の処理カップの実
施例を示す垂直面内の中央断面図、第２図はその縮小し
た平面図、第３図及び第４図は従来の処理カップを示す
垂直面内の中央断面図である。
１・・・底 抜
２・・・ワーク
；３・・・スピンチャック
４・・・スピンチャックの回転軸
５・・・ボス部
６・・・側 壁
１３・・・通し孔
１４・・凹 溝
１５・・・連通孔
１６・・・ノズル口
１７・・・接続口
１８・・・継 手
１９・・・配管系
出願人 日立電子エンジニアリング株式会社１に３図
ツ
第４図FIG. 1 is a central sectional view in a vertical plane showing an embodiment of a processing cup for a semiconductor manufacturing apparatus according to the present invention, FIG. 2 is a reduced plan view thereof, and FIGS. 3 and 4 show conventional processing cups. FIG. 3 is a central sectional view in a vertical plane. 1...Bottom punching 2...Work; 3...Spin chuck 4...Rotating shaft of spin chuck 5...Boss portion 6...Side Wall 13...Through hole 14...Concave groove 15...Communication hole 16...Nozzle port 17...Connection port 18...Joint 19...Piping system Applicant Hitachi Electronic Engineering Co., Ltd. Figures 1 and 3 Figure 4
Claims (1)
転軸が嵌まるボス部を有すると共に、この底板の外周縁
には略垂直に立ち上がる側壁を有し、上記スピンチャッ
クに保持されたワークに対して所要の処理を施す半導体
製造装置の処理カップにおいて、上記底板の厚み内にそ
の外周端からボス部に向けて流体の通る通し孔を穿設し
、上記ボス部内には略垂直に立ち上がる連通孔を設ける
と共に、該ボス部の上端部には所定の角度でワーク裏面
に流体を噴出するノズル口を穿設し、かつ上記底板に穿
設された通し孔の外側端には流体の配管系の接続口を設
けたことを特徴とする半導体製造装置の処理カップ。The center of the bottom plate has a boss into which the rotating shaft of the spin chuck that holds the workpiece is fitted, and the bottom plate has a side wall that rises approximately perpendicularly to the outer periphery of the bottom plate. In a processing cup of a semiconductor manufacturing device that performs a required process, a through hole through which a fluid passes is bored in the thickness of the bottom plate from its outer peripheral edge toward a boss portion, and a communication hole rising approximately vertically is provided in the boss portion. In addition, a nozzle port for spouting fluid onto the back surface of the workpiece at a predetermined angle is provided at the upper end of the boss, and a fluid piping system is connected to the outer end of the through hole provided in the bottom plate. A processing cup for semiconductor manufacturing equipment characterized by having a mouth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP802986A JPS62166515A (en) | 1986-01-20 | 1986-01-20 | Processing cup for semiconductor manufacturing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP802986A JPS62166515A (en) | 1986-01-20 | 1986-01-20 | Processing cup for semiconductor manufacturing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62166515A true JPS62166515A (en) | 1987-07-23 |
Family
ID=11681913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP802986A Pending JPS62166515A (en) | 1986-01-20 | 1986-01-20 | Processing cup for semiconductor manufacturing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62166515A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5634231A (en) * | 1994-05-13 | 1997-06-03 | Nikon Corporation | Semiconductor manufacturing apparatus |
| WO1999046064A1 (en) * | 1998-03-13 | 1999-09-16 | Semitool, Inc. | Selective treatment of the surface of a microelectronic workpiece |
| US6264752B1 (en) | 1998-03-13 | 2001-07-24 | Gary L. Curtis | Reactor for processing a microelectronic workpiece |
| US6318385B1 (en) | 1998-03-13 | 2001-11-20 | Semitool, Inc. | Micro-environment chamber and system for rinsing and drying a semiconductor workpiece |
| US6350319B1 (en) | 1998-03-13 | 2002-02-26 | Semitool, Inc. | Micro-environment reactor for processing a workpiece |
| US6413436B1 (en) | 1999-01-27 | 2002-07-02 | Semitool, Inc. | Selective treatment of the surface of a microelectronic workpiece |
| US6423642B1 (en) | 1998-03-13 | 2002-07-23 | Semitool, Inc. | Reactor for processing a semiconductor wafer |
| US6492284B2 (en) | 1999-01-22 | 2002-12-10 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
| US6511914B2 (en) | 1999-01-22 | 2003-01-28 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
| US6543156B2 (en) | 2000-01-12 | 2003-04-08 | Semitool, Inc. | Method and apparatus for high-pressure wafer processing and drying |
| US6548411B2 (en) | 1999-01-22 | 2003-04-15 | Semitool, Inc. | Apparatus and methods for processing a workpiece |
| US6632292B1 (en) | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
| US6680253B2 (en) | 1999-01-22 | 2004-01-20 | Semitool, Inc. | Apparatus for processing a workpiece |
| US7217325B2 (en) | 1999-01-22 | 2007-05-15 | Semitool, Inc. | System for processing a workpiece |
-
1986
- 1986-01-20 JP JP802986A patent/JPS62166515A/en active Pending
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5634231A (en) * | 1994-05-13 | 1997-06-03 | Nikon Corporation | Semiconductor manufacturing apparatus |
| US6632292B1 (en) | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
| US6666922B2 (en) | 1998-03-13 | 2003-12-23 | Semitool, Inc. | System for processing a workpiece |
| US6997988B2 (en) | 1998-03-13 | 2006-02-14 | Semitool, Inc. | System for processing a workpiece |
| US6695914B2 (en) | 1998-03-13 | 2004-02-24 | Semitool, Inc. | System for processing a workpiece |
| US6264752B1 (en) | 1998-03-13 | 2001-07-24 | Gary L. Curtis | Reactor for processing a microelectronic workpiece |
| US6423642B1 (en) | 1998-03-13 | 2002-07-23 | Semitool, Inc. | Reactor for processing a semiconductor wafer |
| US6446643B2 (en) | 1998-03-13 | 2002-09-10 | Semitool, Inc. | Micro-environment chamber and system for rinsing and drying a semiconductor workpiece |
| US6447633B1 (en) | 1998-03-13 | 2002-09-10 | Semitdol, Inc. | Reactor for processing a semiconductor wafer |
| US6660098B2 (en) | 1998-03-13 | 2003-12-09 | Semitool, Inc. | System for processing a workpiece |
| US6494956B2 (en) | 1998-03-13 | 2002-12-17 | Semitool, Inc. | System for processing a workpiece |
| US6318385B1 (en) | 1998-03-13 | 2001-11-20 | Semitool, Inc. | Micro-environment chamber and system for rinsing and drying a semiconductor workpiece |
| WO1999046064A1 (en) * | 1998-03-13 | 1999-09-16 | Semitool, Inc. | Selective treatment of the surface of a microelectronic workpiece |
| US6350319B1 (en) | 1998-03-13 | 2002-02-26 | Semitool, Inc. | Micro-environment reactor for processing a workpiece |
| US6558470B2 (en) | 1998-03-13 | 2003-05-06 | Semitool, Inc. | Reactor for processing a microelectronic workpiece |
| US6492284B2 (en) | 1999-01-22 | 2002-12-10 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
| US6680253B2 (en) | 1999-01-22 | 2004-01-20 | Semitool, Inc. | Apparatus for processing a workpiece |
| US6548411B2 (en) | 1999-01-22 | 2003-04-15 | Semitool, Inc. | Apparatus and methods for processing a workpiece |
| US6511914B2 (en) | 1999-01-22 | 2003-01-28 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
| US7217325B2 (en) | 1999-01-22 | 2007-05-15 | Semitool, Inc. | System for processing a workpiece |
| US6413436B1 (en) | 1999-01-27 | 2002-07-02 | Semitool, Inc. | Selective treatment of the surface of a microelectronic workpiece |
| US6543156B2 (en) | 2000-01-12 | 2003-04-08 | Semitool, Inc. | Method and apparatus for high-pressure wafer processing and drying |
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