JPS62166010U - - Google Patents

Info

Publication number
JPS62166010U
JPS62166010U JP5459386U JP5459386U JPS62166010U JP S62166010 U JPS62166010 U JP S62166010U JP 5459386 U JP5459386 U JP 5459386U JP 5459386 U JP5459386 U JP 5459386U JP S62166010 U JPS62166010 U JP S62166010U
Authority
JP
Japan
Prior art keywords
mold
seal rubber
seal
gel
periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5459386U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5459386U priority Critical patent/JPS62166010U/ja
Publication of JPS62166010U publication Critical patent/JPS62166010U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP5459386U 1986-04-11 1986-04-11 Pending JPS62166010U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5459386U JPS62166010U (ko) 1986-04-11 1986-04-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5459386U JPS62166010U (ko) 1986-04-11 1986-04-11

Publications (1)

Publication Number Publication Date
JPS62166010U true JPS62166010U (ko) 1987-10-21

Family

ID=30881730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5459386U Pending JPS62166010U (ko) 1986-04-11 1986-04-11

Country Status (1)

Country Link
JP (1) JPS62166010U (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001129833A (ja) * 1999-11-05 2001-05-15 Miyagi Oki Electric Co Ltd 成形金型及び半導体装置の製造方法
WO2006128280A1 (en) 2005-05-31 2006-12-07 Woodbridge Foam Corporation Mold and method for manufacture thereof
JP2017013260A (ja) * 2015-06-29 2017-01-19 東レ株式会社 樹脂注入成形型、樹脂注入成形装置、およびそれを用いた繊維強化樹脂の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001129833A (ja) * 1999-11-05 2001-05-15 Miyagi Oki Electric Co Ltd 成形金型及び半導体装置の製造方法
WO2006128280A1 (en) 2005-05-31 2006-12-07 Woodbridge Foam Corporation Mold and method for manufacture thereof
JP2017013260A (ja) * 2015-06-29 2017-01-19 東レ株式会社 樹脂注入成形型、樹脂注入成形装置、およびそれを用いた繊維強化樹脂の製造方法

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