JPS62163938U - - Google Patents
Info
- Publication number
- JPS62163938U JPS62163938U JP5153886U JP5153886U JPS62163938U JP S62163938 U JPS62163938 U JP S62163938U JP 5153886 U JP5153886 U JP 5153886U JP 5153886 U JP5153886 U JP 5153886U JP S62163938 U JPS62163938 U JP S62163938U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- chip
- mounting board
- semiconductor device
- conductive spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5153886U JPS62163938U (enExample) | 1986-04-08 | 1986-04-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5153886U JPS62163938U (enExample) | 1986-04-08 | 1986-04-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62163938U true JPS62163938U (enExample) | 1987-10-17 |
Family
ID=30875892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5153886U Pending JPS62163938U (enExample) | 1986-04-08 | 1986-04-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62163938U (enExample) |
-
1986
- 1986-04-08 JP JP5153886U patent/JPS62163938U/ja active Pending
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