JPS62162837U - - Google Patents
Info
- Publication number
- JPS62162837U JPS62162837U JP1986051103U JP5110386U JPS62162837U JP S62162837 U JPS62162837 U JP S62162837U JP 1986051103 U JP1986051103 U JP 1986051103U JP 5110386 U JP5110386 U JP 5110386U JP S62162837 U JPS62162837 U JP S62162837U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- mounting part
- outer frame
- plane
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000725 suspension Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986051103U JPS62162837U (en, 2012) | 1986-04-04 | 1986-04-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986051103U JPS62162837U (en, 2012) | 1986-04-04 | 1986-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62162837U true JPS62162837U (en, 2012) | 1987-10-16 |
Family
ID=30875067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986051103U Pending JPS62162837U (en, 2012) | 1986-04-04 | 1986-04-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62162837U (en, 2012) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02305456A (ja) * | 1989-05-19 | 1990-12-19 | Sanyo Electric Co Ltd | リードフレームとその加工方法、および半導体装置の製法 |
| JPH04750A (ja) * | 1990-04-18 | 1992-01-06 | Toshiba Corp | 半導体装置用リードフレーム |
| JP2007234737A (ja) * | 2006-02-28 | 2007-09-13 | Denso Corp | 電子部品の接続構造 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60195958A (ja) * | 1984-03-19 | 1985-10-04 | Hitachi Ltd | リ−ドフレ−ム |
-
1986
- 1986-04-04 JP JP1986051103U patent/JPS62162837U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60195958A (ja) * | 1984-03-19 | 1985-10-04 | Hitachi Ltd | リ−ドフレ−ム |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02305456A (ja) * | 1989-05-19 | 1990-12-19 | Sanyo Electric Co Ltd | リードフレームとその加工方法、および半導体装置の製法 |
| JPH04750A (ja) * | 1990-04-18 | 1992-01-06 | Toshiba Corp | 半導体装置用リードフレーム |
| JP2007234737A (ja) * | 2006-02-28 | 2007-09-13 | Denso Corp | 電子部品の接続構造 |