JPS62160744U - - Google Patents
Info
- Publication number
- JPS62160744U JPS62160744U JP4861386U JP4861386U JPS62160744U JP S62160744 U JPS62160744 U JP S62160744U JP 4861386 U JP4861386 U JP 4861386U JP 4861386 U JP4861386 U JP 4861386U JP S62160744 U JPS62160744 U JP S62160744U
- Authority
- JP
- Japan
- Prior art keywords
- bypass
- throttle valve
- opened
- engine
- passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011144 upstream manufacturing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electrical Control Of Air Or Fuel Supplied To Internal-Combustion Engine (AREA)
Description
第１図は本考案の一実施例の要部の縦断面図、
第２図は本考案の一実施例の全体構成図、第３図
はそのコントローラにおいて実行されるバイパス
流量制御弁の制御シーケンスの流れを示すフロー
図である。
１はエンジン、２は吸気路、６はスロツトル弁
、２１はバイパス通路、２２はバイパス流量制御
弁、２４は開口部。
FIG. 1 is a vertical cross-sectional view of the main parts of an embodiment of the present invention.
FIG. 2 is an overall configuration diagram of an embodiment of the present invention, and FIG. 3 is a flowchart showing the control sequence of the bypass flow rate control valve executed by the controller. 1 is an engine, 2 is an intake passage, 6 is a throttle valve, 21 is a bypass passage, 22 is a bypass flow control valve, and 24 is an opening.
Claims (1)
ル弁を設ける一方、少なくとも全閉時にこのスロ
ツトル弁をバイパスするように上記吸気路に接続
されたバイパス通路と、このバイパス通路に介在
させたバイパス流量制御弁を設け、減速時にこの
バイパス流量制御弁を所定の期間にわたつて開弁
させるようにしたエンジンのバイパスエア制御装
置において、上記バイパス通路の吸気路下流側の
開口部を、スロツトル弁略全閉時、スロツトル弁
下流となり、スロツトル弁開弁時、スロツトル弁
上流となる位置に開口させたことを特徴とする、
エンジンのバイパスエア制御装置。 A throttle valve that is fully closed during idle operation is provided in the intake passage, and a bypass passage connected to the intake passage so as to bypass the throttle valve at least when fully closed, and a bypass flow control valve interposed in the bypass passage. In a bypass air control device for an engine, the bypass flow control valve is opened for a predetermined period during deceleration. , characterized in that it is opened at a position downstream of the throttle valve and upstream of the throttle valve when the throttle valve is opened.
Engine bypass air control device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4861386U JPS62160744U (en) | 1986-03-31 | 1986-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4861386U JPS62160744U (en) | 1986-03-31 | 1986-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62160744U true JPS62160744U (en) | 1987-10-13 |
Family
ID=30870307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4861386U Pending JPS62160744U (en) | 1986-03-31 | 1986-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62160744U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8901733B2 (en) | 2001-02-15 | 2014-12-02 | Qualcomm Incorporated | Reliable metal bumps on top of I/O pads after removal of test probe marks |
| US9369175B2 (en) | 2001-09-17 | 2016-06-14 | Qualcomm Incorporated | Low fabrication cost, high performance, high reliability chip scale package |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60164637A (en) * | 1984-02-03 | 1985-08-27 | Toyota Motor Corp | Idle rotational speed control device |
-
1986
- 1986-03-31 JP JP4861386U patent/JPS62160744U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60164637A (en) * | 1984-02-03 | 1985-08-27 | Toyota Motor Corp | Idle rotational speed control device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8901733B2 (en) | 2001-02-15 | 2014-12-02 | Qualcomm Incorporated | Reliable metal bumps on top of I/O pads after removal of test probe marks |
| US9369175B2 (en) | 2001-09-17 | 2016-06-14 | Qualcomm Incorporated | Low fabrication cost, high performance, high reliability chip scale package |