JPS62160540U - - Google Patents
Info
- Publication number
- JPS62160540U JPS62160540U JP1986048043U JP4804386U JPS62160540U JP S62160540 U JPS62160540 U JP S62160540U JP 1986048043 U JP1986048043 U JP 1986048043U JP 4804386 U JP4804386 U JP 4804386U JP S62160540 U JPS62160540 U JP S62160540U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- circuit board
- bumps
- mounting structure
- chip mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986048043U JPS62160540U (US06521211-20030218-C00004.png) | 1986-04-02 | 1986-04-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986048043U JPS62160540U (US06521211-20030218-C00004.png) | 1986-04-02 | 1986-04-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62160540U true JPS62160540U (US06521211-20030218-C00004.png) | 1987-10-13 |
Family
ID=30869209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986048043U Pending JPS62160540U (US06521211-20030218-C00004.png) | 1986-04-02 | 1986-04-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62160540U (US06521211-20030218-C00004.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08107164A (ja) * | 1994-10-06 | 1996-04-23 | Nec Corp | 半導体装置 |
WO2017038460A1 (ja) * | 2015-09-01 | 2017-03-09 | ローム株式会社 | パワーモジュール、パワーモジュールの放熱構造、およびパワーモジュールの接合方法 |
-
1986
- 1986-04-02 JP JP1986048043U patent/JPS62160540U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08107164A (ja) * | 1994-10-06 | 1996-04-23 | Nec Corp | 半導体装置 |
WO2017038460A1 (ja) * | 2015-09-01 | 2017-03-09 | ローム株式会社 | パワーモジュール、パワーモジュールの放熱構造、およびパワーモジュールの接合方法 |
US10485139B2 (en) | 2015-09-01 | 2019-11-19 | Rohm Co., Ltd. | Power module, thermal dissipation structure of the power module and contact method of the power module |