JPS62158840U - - Google Patents
Info
- Publication number
- JPS62158840U JPS62158840U JP4629186U JP4629186U JPS62158840U JP S62158840 U JPS62158840 U JP S62158840U JP 4629186 U JP4629186 U JP 4629186U JP 4629186 U JP4629186 U JP 4629186U JP S62158840 U JPS62158840 U JP S62158840U
- Authority
- JP
- Japan
- Prior art keywords
- package
- pads
- utility
- model registration
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
- H01L2224/48147—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked with an intermediate bond, e.g. continuous wire daisy chain
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の１実施例を説明する図、第２
図は従来素子を説明する図である。 １０……セラミツク・パツケージ、２０……チ
ツプ、３０……パツド、４０……リード線、５０
……導体端子。
図は従来素子を説明する図である。 １０……セラミツク・パツケージ、２０……チ
ツプ、３０……パツド、４０……リード線、５０
……導体端子。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 必要に応じて所定パツド間が接続された複
数個のチツプが順次積層されて１パツケージ内に
塔載されていることを特徴とする半導体素子。 (2) 所定パツド間及びパツドとパツケージの導
体端子間がワイヤ・ボンデイングされていること
を特徴とする実用新案登録請求の範囲第１項記載
の素子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4629186U JPS62158840U (ja) | 1986-03-31 | 1986-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4629186U JPS62158840U (ja) | 1986-03-31 | 1986-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62158840U true JPS62158840U (ja) | 1987-10-08 |
Family
ID=30865818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4629186U Pending JPS62158840U (ja) | 1986-03-31 | 1986-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62158840U (ja) |
-
1986
- 1986-03-31 JP JP4629186U patent/JPS62158840U/ja active Pending