JPS62157143U - - Google Patents
Info
- Publication number
- JPS62157143U JPS62157143U JP4425286U JP4425286U JPS62157143U JP S62157143 U JPS62157143 U JP S62157143U JP 4425286 U JP4425286 U JP 4425286U JP 4425286 U JP4425286 U JP 4425286U JP S62157143 U JPS62157143 U JP S62157143U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pots
- mold
- resin sealing
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986044252U JPH0340579Y2 (US08080257-20111220-C00005.png) | 1986-03-26 | 1986-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986044252U JPH0340579Y2 (US08080257-20111220-C00005.png) | 1986-03-26 | 1986-03-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62157143U true JPS62157143U (US08080257-20111220-C00005.png) | 1987-10-06 |
| JPH0340579Y2 JPH0340579Y2 (US08080257-20111220-C00005.png) | 1991-08-27 |
Family
ID=30861883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986044252U Expired JPH0340579Y2 (US08080257-20111220-C00005.png) | 1986-03-26 | 1986-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0340579Y2 (US08080257-20111220-C00005.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01235340A (ja) * | 1988-03-16 | 1989-09-20 | Hitachi Ltd | 半導体樹脂封止装置 |
| JPH01257338A (ja) * | 1988-04-07 | 1989-10-13 | Hitachi Ltd | 半導体装置の製造方法 |
| CN114103017A (zh) * | 2020-08-28 | 2022-03-01 | 东和株式会社 | 树脂成形装置及树脂成形品的制造方法 |
| CN114102981A (zh) * | 2020-08-28 | 2022-03-01 | 东和株式会社 | 树脂成形装置及树脂成形品的制造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59225913A (ja) * | 1983-06-08 | 1984-12-19 | Y K C:Kk | 複数のプランジヤにて複数の成形型に同時に合成樹脂を注入成形する方法および装置 |
-
1986
- 1986-03-26 JP JP1986044252U patent/JPH0340579Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59225913A (ja) * | 1983-06-08 | 1984-12-19 | Y K C:Kk | 複数のプランジヤにて複数の成形型に同時に合成樹脂を注入成形する方法および装置 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01235340A (ja) * | 1988-03-16 | 1989-09-20 | Hitachi Ltd | 半導体樹脂封止装置 |
| JPH01257338A (ja) * | 1988-04-07 | 1989-10-13 | Hitachi Ltd | 半導体装置の製造方法 |
| CN114103017A (zh) * | 2020-08-28 | 2022-03-01 | 东和株式会社 | 树脂成形装置及树脂成形品的制造方法 |
| CN114102981A (zh) * | 2020-08-28 | 2022-03-01 | 东和株式会社 | 树脂成形装置及树脂成形品的制造方法 |
| JP2022039811A (ja) * | 2020-08-28 | 2022-03-10 | Ｔｏｗａ株式会社 | 樹脂成形装置、及び樹脂成形品の製造方法 |
| JP2022039709A (ja) * | 2020-08-28 | 2022-03-10 | Ｔｏｗａ株式会社 | 樹脂成形装置、及び樹脂成形品の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0340579Y2 (US08080257-20111220-C00005.png) | 1991-08-27 |
