JPS62154752A - Wafer sucking device - Google Patents

Abstract

PURPOSE:To make it possible to prevent attachment of dust, which is sucked in a main body, to the upper surface of a wafer, by providing a wafer protecting plate, which covers the wafer, in the main body of a sucking device so that the plate can be moved up and down, in a wafer sucking device, in which the wafer is sucked to the opening edge of the main body of the sucking device with vacuum. CONSTITUTION:A wafer 2 is sucked to the opening edge of a main body 6 of a sucking device with vacuum. A wafer protecting plate 1, which covers the wafer 2, is provided in the main body 6 of the sucking device so that the plate can be moved up and down. For exemple, the upper part of the main body 6 of a funnel shaped sucking device is formed in a tubular shape. A sucking port 3 is provided at the upper end of a tube part 6a. Two stoppers 4 and 7 are arranged at the two upper and lower stages in the tube part 6a. The wafer protecting plate 1, which covers the upper surface of the wafer, is suspended by a disk 9 through a supporting rod 10. The disk 9 is arranged between the stoppers 4 and 7 at the two upper and lower stages so that the disk can be moved up and down. A small hole 8 with a filter is provided in the protecting plate 1, and a bypass hole 5 is provided in the upper stopper 4.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer suction device in a wafer conveying device.

[Conventional technology]

Conventionally, this type of wafer vacuum suction and transportation device has a funnel-shaped suction device main body 6, and the wafer is removed by closing the lower opening of the suction device main body 6 with the wafer 2 and evacuating the inside of the main body through the air inlet 3. 2 was vacuum-adsorbed.

[Problem that the invention seeks to solve]

By the way, when vacuum suctioning a wafer, outside air is sucked in until the edge of the wafer 2 comes into close contact with the opening edge of the main body 6, so dust contained in the outside air is sucked into the main body 6. There may be cases where When the edge of the wafer 2 comes into close contact with the opening edge of the main body 6, when the pressure inside the main body becomes constant and the air flow stops, the sucked in dust descends under its own weight and adheres to the wafer 2.

However, as is clear from FIG. 2, in the past, since the upper surface of the sucked wafer was exposed, there remained a problem that the sucked-in dust would adhere and contaminate the wafer.

The present invention provides a wafer suction device that prevents dust sucked into the main body from adhering to the upper surface of the wafer.

[Means for solving problems]

The present invention is a wafer suction device that vacuum suctions wafers to the opening edge of a suction device body, and is characterized in that a wafer retainer i1'rFx that covers the wafer is provided in the suction device body so as to be movable up and down. .

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, the upper part of the funnel-shaped adsorber body 6 is configured in a cylindrical shape, and the suction port 3 is provided at the upper end of the cylindrical part 6a, and two stoppers 4.7 are arranged in upper and lower stages in the cylindrical part 6a. do. Further, a wafer protection plate 1 covering the upper surface of the wafer is vertically suspended from the disk 9 via a support rod 10, and the disk 9 is disposed vertically movably between two upper and lower stoppers 4.7.

Further, a small hole 8 with a filter and a bypass hole 5 are provided in the protection plate 1 and the upper part 4, respectively.

In the embodiment, first, when the suction port is evacuated using a vacuum pump, the wafer surface protection plate 1 is pulled up to the position of the upper stopper 4, and the inside of the suction device main body 6 is evacuated through the bypass hole 5.

As a result, the wafer 2 is suctioned onto the suction device main body 6.

Then, the air flow stops, the pressure inside the adsorber main body 6 becomes constant, there is no force to pull up the wafer protection plate 1, and the protection plate 1 falls onto the wafer 2 due to its own weight and covers the wafer 2. Protect wafers from debris.

Conversely, when removing the wafer 2 from the suction device body 6, gas is blown through the suction port 3, and the wafer surface protection plate 1 also falls down at the same time as the wafer 2, is fixed to the lower stopper 7, and then is removed from the small hole 8 with a filter. Air enters,
No dust will adhere (the wafer 2 is separated).

〔Effect of the invention〕

As described above, the present invention has the effect of preventing dust from adhering to the wafer surface by providing a wafer protection plate on the wafer vacuum suction device of the wafer transport device.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing an embodiment of the present invention, and FIG. 2 is a block diagram showing a conventional example. 1...Wafer protection IL2...Wafer, 3...
・Suction port, 4... Upper stopper, 5... Bypass hole, 6... Adsorber body, 7... Lower stopper, 8
...Small hole with filter.

Claims (1)

[Claims] (1) A wafer suction device for vacuum suctioning wafers to the opening edge of a suction device body, characterized in that a wafer protection plate that covers the wafer is provided inside the suction device body so as to be movable up and down.