JPS62154653U

JPS62154653U -

Info

Publication number: JPS62154653U
Application number: JP4335286U
Authority: JP
Priority date: 1986-03-24
Filing date: 1986-03-24
Publication date: 1987-10-01

Description

[Brief explanation of the drawing]

第１図、第２図および第３図はそれぞれこの考
案に係る半導体装置の一例を示す分解斜視図、概
略正面断面図および概略側面断面図、第４図は負
荷電流と周囲温度との関係図、第５図および第６
図は同装置の要部の変形構造を示す斜視図、第７
図は従来の半導体装置を示す正面断面図である。１……ケース、２……底壁部、３……対向側壁
部、４……放熱用フイン部、５……電気絶縁板、
６，６_１〜６_３……半導体素子、７，７_１〜７_３，９，９_１〜９_３……リード部、８，８_１〜８_３，１０，１０_１〜１０_３……外部端子、３０，３
１，３２……温度表示テープ。 1, 2, and 3 are an exploded perspective view, a schematic front sectional view, and a schematic side sectional view showing an example of the semiconductor device according to the invention, respectively, and FIG. 4 is a diagram showing the relationship between load current and ambient temperature. , Figures 5 and 6
The figure is a perspective view showing the deformed structure of the main part of the device.
The figure is a front sectional view showing a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1... Case, 2... Bottom wall part, 3... Opposing side wall part, 4... Heat radiation fin part, 5... Electrical insulating board,
6,6 ₁ to 6 ₃ ... semiconductor element, 7,7 ₁ to 7 ₃ , 9, _{9 1} to 9 ₃ ... Lead section, 8, 8 ₁ to 8 ₃ ,10,10 ₁ to 10 ₃ ...External terminal, 30,3
1,32...Temperature display tape.

Claims

[Scope of utility model registration request]

A semiconductor element having a case having a conductive bottom wall and an opposing side wall integrally formed with the bottom wall, a heat dissipating fin portion integrally formed on the outer surface of the bottom wall, and external terminals integrally formed on the lead portion. A semiconductor device characterized in that a temperature indicating tape which is fixed to the inner surface of the bottom wall via an electrically insulating plate and changes color at the rated temperature is attached to the outer surface of the case.