JPS62151812A - Photosemiconductor element package - Google Patents

Abstract

PURPOSE:To improve the operability in package assembly greatly by providing an elastic member between an optical fiber holding part and a coupling part and holding the coupling part by a holding part through the elastic member. CONSTITUTION:The united part 2 where a photosemiconductor and a lens part 6 are mounted and the optical fiber holding part 3 which holds an optical fiber 7 are coupled together through the coupling part. Then the elastic member 8 is provided between the optical fiber holding part 3 and coupling part. Therefore, when a package is assembled, the united part 2 is fitted on an XY stage 11, the fiber holding part 3 which supports the coupling part through the elastic member 8 is fitted to a stage 13, and the both are adjusted to assemble the package. Consequently, the coupling part need not be supported independently and the assembling operation is improved greatly.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an optical semiconductor element package that is used in optical communication uH using optical fibers and houses an optical semiconductor element.

[Summary of the invention]

The present invention provides an optical semiconductor device package that has an integrated part on which an optical semiconductor element and a lens part are mounted, an optical fiber holding part that holds an optical fiber, and a connecting part that connects them. By providing the members, workability during assembly of the optical semiconductor element panogage is improved.

[Conventional technology]

The optical semiconductor element package is a laser diode (LD)
), a light emitting diode (LED) L132, or a light receiving element, and is connected to an optical fiber to form a transmission path for optical communication between the transmitting device and the receiving device.

Conventional optical semiconductor device packages, for example,
It consists of the configuration shown in the figure.

The optical semiconductor element package 101 shown in FIG.
02, an optical fiber holding section 103 that holds an optical fiber 107, and a connecting section 104 that connects these.

A brief explanation of the integral part 102, the optical fiber holding part 103, and the connecting part 104 will be as follows.
Reference numeral 2 is mounted with an optical semiconductor element 105 such as a laser diode, and is attached with a lens portion 106 whose optical axis is in the beam irradiation direction of the optical semiconductor element 105, that is, the two-axis direction in FIG.

An end surface 108 of this integral part 102 is formed into a substantially planar shape.

The optical fiber holding section 103 includes an optical fiber 107
This optical fiber holding part 103
An optical fiber 107 is passed through with its central axis, and a substantially cylindrical annular protrusion 109 is formed on the end 107a side of the optical fiber 107.

The connecting portion 104 is a member that connects the integrated portion 102 and the optical fiber holding portion 103.

A bonding surface 110 is formed to bond to the integral part 102 and is inserted into the optical fiber holding part 103, so the outer circumferential surface 104a is a circumferential surface.

When assembling the conventional optical semiconductor device pancage 101 having such a configuration, adjustment in three axes is required, so a predetermined jig is used.

As shown in FIG. 3, during assembly, the integral part 102 is attached to an XY stage 111 which is a jig and allows fine adjustment in the x-y plane, and the connecting part 1
04 is attached to an immovable fixed base 112, and the optical fiber holding section 103 is attached to a Z
It is attached to stage +13. When assembling the conventional optical semiconductor element package 101,
For example, the Z stage 113 to which the optical fiber holding section 103 is attached while performing predetermined monitoring.
The central axis of the connecting part 104 is made parallel to the moving direction of the optical fiber 107, the central axis of the connecting part 104 is aligned with the optical fiber 107 held at the center of the optical fiber holding part 103, and the integrated part 102 is work to make the moving surface of the XY stage ill, which is attached to the
An operation is performed to make the end surface 10B of the connecting portion 104 parallel to the joining surface 11O of the connecting portion 104.

[Problem that the invention seeks to solve]

However, the optical semiconductor element package 101 having the above-described structure lacks ease of assembly, and requires time and effort for adjustment, etc., which is a technical problem to be solved.

That is, by moving the optical fiber holding section 103 in the Z-axis direction using the Z stage 113, the inner peripheral surface 109 of the annular protrusion 109 of the optical fiber holding section 103 is moved.
a and the outer circumferential surface 104a of the connecting part 104, and fix it in a predetermined manner with adhesive or the like. However, if the position of the connecting part 104 with respect to the optical fiber holding part 103 is insufficiently adjusted, During movement, the optical fiber holding section 103 and the connecting section 104 come into contact with each other, necessitating fine adjustment again.

Furthermore, the moving surface of the XY stage 111 and the connecting portion 1
If the adjustment of the bonding surface 110 of 04 is not sufficient, the distance required for bonding may not be achieved, or contact may occur.

Furthermore, the end face 108 of the integral part 102 and the connecting part 10
If the work to make the bonding surfaces 110 of No. 4 parallel is insufficient, the end surfaces 108 and the bonding surfaces 110 will be bonded with an inclination, resulting in problems such as a lack of uniformity in bonding.

In order to prevent such adverse effects, it is necessary to make sufficient adjustments during assembly, and therefore, it has been desired to improve workability.

SUMMARY OF THE INVENTION In view of the above-mentioned problems, the present invention aims to provide an optical semiconductor element package having a structure that is easy to assemble.

[Means for solving problems]

The present invention provides an integral part comprising a lens part on which an optical semiconductor element is mounted and whose optical axis is in the direction of beam irradiation of the optical semiconductor element, and an end surface of the lens part on the side opposite to the element side is formed into a substantially planar shape. an optical fiber holding part that holds the optical fiber and has a substantially cylindrical protruding part through which the optical fiber is penetrated and protrudes in a substantially cylindrical shape on the end side of the optical fiber; a connecting part for connecting the integral part and the optical fiber holding part with an adhesive; the connecting part has a cylindrical shape and a substantially flat joint surface with the integral part, and the optical fiber holding part and the connecting part The problem of +fiiffi is solved by an optical semiconductor element package having an elastic member between the two.

[Effect]

Conventionally, during assembly, the connecting portion was supported independently of the optical fiber holding portion and the integrated portion. Therefore, in the optical semiconductor device package of the present invention, an elastic member is provided between the connecting portion and the optical fiber holding portion, and the elastic member supports the connecting portion in a hollow manner, thereby facilitating assembly work.

When the connecting part is joined to the integral part by support by this elastic member, the connecting part is pressed against the integral part by the urging force of the elastic part 4A,
Therefore, the adhesion between the bonding surface of the connecting part and the end face of the integral part depends on the position. h Al1 adjustment will be unnecessary.

Further, the elastic member causes the connecting portion to follow the optical fiber holding portion, so that the connecting portion can be easily inserted into the optical fiber holding portion by moving the optical fiber holding portion.

(Example〕 Preferred embodiments of the present invention will be described with reference to the drawings.

The optical semiconductor element package according to the embodiment of the present invention uses a coil spring as the elastic member disposed between the connecting part and the optical fiber holding part, and realizes excellent workability. In addition, air holes are formed in the optical fiber holding portion for convenience during adhesion.

As shown in FIGS. 1 and 2, the optical semiconductor device package l of this embodiment is equipped with an optical semiconductor device 5 such as a laser diode, a photodiode, or a light receiving element, and a lens section 6 consisting of a predetermined lens system. integrated part 2,
It has an optical fiber holding part 3 that holds a single-mode or multi-mode optical fiber 7, and a connecting part 4 that connects them, and furthermore, an elastic member 8 made of a coil spring is provided between the optical fiber holding part 3 and the connecting part 4. It is formed. Furthermore, air holes 9 are formed in the optical fiber holding section 3 so as to penetrate through the optical fiber holding section 3.

The integral part 2 has a substantially cylindrical shape with a space inside, and an optical semiconductor element 5 such as a laser diode is mounted on one side of the flat surfaces of the cylindrical shape, and a predetermined lens system is mounted on the other side. A lens portion 6 is attached whose optical axis is in the beam irradiation direction of the optical semiconductor element 5, that is, the two-axis direction in FIG.

The end surface 2a of the integral part 2 on the side 6a opposite to the element side of the lens part 6 is formed into a substantially planar shape, and when bonded to the connecting part 4, the end face 2a is formed in an X-y direction with the z-axis as the normal direction. In addition to enabling fine adjustment in a plane, the joint surface 10 of the connecting portion 4, which is biased by the action of the elastic member 8 as will be described later, comes into close contact during assembly to enable easy adhesion. Note that the optical semiconductor element 5 and the lens portion 6 are fixed to the integral portion 2 with their positional relationship adjusted in advance.

The optical fiber holding section 3 holds an optical fiber half, and has the shape of an axially symmetrical rotating body. An optical fiber half passes through the optical fiber holding section 3 at the central axis of the optical fiber holding section 3, and the optical fiber half has an end 7a on the side of the optical fiber holding section 3 that connects with the connecting section 4. For example, when a laser diode is used as the optical semiconductor element to transmit an optical signal, the laser beam from the optical semiconductor element 5 passes through the lens section 6 and enters from this end 7a. Become. The optical fiber holding section 3 has the above-mentioned end portion 7.
A substantially cylindrical annular protrusion 12 is formed on the a side. This annular protruding portion 12 is for connecting with the connecting portion 4, and the inner circumferential surface +Z of the annular protruding portion 12 is
a is 1 above! l! It is inserted into the cylindrical outer peripheral surface 4a of the connecting portion 4. The direction in which this annular protrusion 12 protrudes is the biaxial direction in FIG.
Insert and fix using adhesive. In this case, as will be described later, the width member 8 between the connecting member 4 and
Due to this ability, the connecting member 4 follows the optical fiber holding section 3. Therefore, key setting can be easily performed.

In addition, such an optical fiber holding part 3 has an air hole 9.
is formed. This air hole 9 is for allowing internal air to escape when the connecting part 4 is inserted into the optical fiber holding part 3. Therefore, since the air hole 9 is formed, when inserting the optical fiber, the optical fiber holding part 3 and the connecting part 4 are connected.
It is possible to maintain a constant air pressure in the hollow portion 14 which is formed by the above-described structure and in which the elastic member 8 is housed. Therefore, the adhesive 15 applied to the inner circumferential surface 12a of the annular protruding portion 12 and the outer circumferential surface 4a of the connecting portion 4 can be contained in a predetermined area.
Therefore, adverse effects such as extrusion of the adhesive 15 due to internal air are suppressed, and reliable adhesive fixation is possible.

The connecting portion 4 is a member that connects the integrated portion 2 and the optical fiber holding portion 3. The joint surface 10 that joins the integral part 2 is a plane parallel to the xy plane in FIG.

In addition, since the connecting portion 4 is inserted into the optical fiber holding portion 3, the cylindrical outer peripheral surface 4a of the connecting portion 4 is a circumferential surface, and its outer diameter has a sufficient margin for insertion with the inner diameter of the annular protruding portion 12. It is formed with. During assembly, a hollow part 14 is formed on the optical fiber holding part 3 side of the connecting part 4 and between the optical fiber holding part 3 and an elastic member 8 such as a coil spring is arranged in this hollow part. become.

The elastic member 8 is disposed between the connecting portion 4 and the optical fiber holding portion 3, and the elastic member 8 is arranged between the connecting portion 4 and the optical fiber holding portion 3 to adjust the position of the connecting portion 4 to the optical fiber holding portion 4.
can be made to follow the position of

Furthermore, in the case of adhering the connecting portion 4 and the integral portion 2, the joining surface 10 of the connecting portion 4 is attached to the end surface 2a of the integral portion.
It will be forced on. Therefore, a of this elastic member 8
Due to this function, when assembling the optical semiconductor element package l of this embodiment, the effort and time required for fine adjustment can be alleviated, and speedy work can be realized. The length of such elastic member 8 is such that the connecting portion 4 does not jump out from the optical fiber holding portion 3, and the length is such that the connecting portion 4 does not protrude from the optical fiber holding portion 3.
If the position of is a at which the amount of light detected by the monitor is maximum, then the above combination! ! ;Pull the part 4 against the integral part 2 with a force sufficient for surface adhesion. In addition to the above-mentioned coil springs, temporary springs or the like may be used, and the material may be an elastic metal or synthetic resin rod. In addition, when using a coil spring, the connecting part 4 and the optical fiber holding part 3
In order to force 4 evenly around the central axis, both 5a and
ls may be finished into a ring shape.

Although the optical semiconductor element package l having the above configuration requires delicate adjustment using a predetermined jig, its workability is significantly improved compared to conventional ones. .

Immediately, this example! When assembling the optical fiber, the integral part 2 is attached to an XY stage 11, which is a jig and allows fine adjustment within the x-y plane, as shown in FIG. 3 is attached to two stages 13 that enable fine adjustment in two axial directions. Conventionally, the connecting part 4 was also attached to a fixed stand for assembly work, but in this embodiment, the connecting part 4 is
It is not necessary to attach it to a fixed stand, and it is supported in the air by the elastic member 8 at the beginning of the assembly work. Therefore, the position of the connecting part 4 can be made to follow the position of the optical fiber holding part 3 by the action of the elastic member 8, and furthermore, in the case of adhering the connecting part 4 and the integral part 2, the position of the connecting part 4 can be made to follow the position of the optical fiber holding part 3. The joint surface (2)0 is pressed against the end surface 2a of the integral part.

To explain an example of the assembly work of the optical semiconductor element vano gauge I of this embodiment, first, the connecting part 4 is supported with respect to the optical fiber holding part 3 via the elastic member 8. At this time, the outer circumferential surface 4a of the connecting portion 4 is inserted so as to face the inner circumferential surface of the annular protrusion 12a. While monitoring the light intensity of the optical fiber half,
The Y stage 11 and Z stage 13 are operated to adjust their positions until the maximum amount of light is obtained. At this time, the position of the connecting part 4 can be made to follow the position of the optical fiber holding part 3 by the action of the elastic member 8, and the joint surface 10 of the connecting part 4 is pressed against the end surface 2a of the integral part,
Easy surface adhesion is possible.

After such triaxial adjustment, the integral part 2 is once separated, adhesive is applied to the end surface 2a and the joint surface, and the integral part 2 is returned to the original position where the triaxial adjustment was made and fixed. At this time, the effect of the elastic member 8 allows easy surface adhesion.

After the integral part 2 and the connecting part 4 are fixed together, the Z stage 13 is moved again, and the outer peripheral surface 4a of the connecting part 4 and the inner peripheral surface of the annular protruding part 12 of the optical fiber holding part 3 are fixed. 12a
Apply adhesive 15 to. After application, it is similarly returned to its optimal original position and fixed. At this time, an air hole 9 is formed in the optical fiber holding part 3 and extends through the hollow part 14 and the entire outside of the optical semiconductor element package l. Therefore, when the position is returned to the JHA position, the problem of pushing out the applied and uncured adhesive 15 by internal pressure is prevented, and furthermore, the problem of deviation from the optimum position does not occur.

The optical semiconductor element package l of this embodiment can be assembled through the operations described above, and the action of the elastic member 8 enables easy surface adhesion and adhesion between the inner and outer peripheries.

Here, another method for assembling the optical semiconductor element package l of this example will be explained. This is because the Z-axis direction, which is the rotational axis direction of the integral part 2, the connecting part 4, and the optical fiber holding part 3, is set vertically due to the relationship of gravity.
It is used for assembly work. In this way, when the two axes are the directions of gravity, it is effectively prevented that deviations occur in the x-y plane due to the influence of gravity, and gravity contributes uniformly on the plane normal to the rotation axis. . Therefore, position adjustment becomes easy, and assembly workability is improved.

In the above embodiment, the outer circumferential surface 4a of the connecting portion 4 and the inner circumferential surface 12a of the annular protrusion 12 of the optical fiber holding portion 3
Although it has been described that an annular protrusion is formed on the connecting part 4, the inner circumferential surface of the annular protruding part formed on the connecting part and the outer circumferential surface of the optical fiber holding part may be adhered.

〔Effect of the invention〕

The optical semiconductor device package of the present invention includes an elastic member between the connecting portion and the optical fiber holding portion.

Therefore, it is not necessary to independently support the connecting portion, the connecting portion can be adjusted to follow the optical fiber holding portion, and surface adhesion to the integral portion is also easy.

□ Therefore, by applying the optical semiconductor device package of the present invention to a production line, the workability is improved,
The effort and time will be significantly reduced.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of an optical semiconductor device package of the present invention, FIG. 2 is a sectional view thereof, and FIG. 3 is a sectional view showing an example of a conventional optical semiconductor device pathogage. l...Optical semiconductor element package 2...Integrated part 2a...End face 3...Optical fiber holding part 4...Connecting part 4a...Outer circumferential surface 5...Nine-half compliance element 6...Lens part 7...Optical fiber 8...Elastic member 9...Air hole IO...Joining surface 12...Annular protrusion 12a Inner peripheral surface 15...Adhesive patent Applicant Sony Corporation agent Patent attorney Small Section Viewing Sakae Tamura - Conventional fPl i-plane diagram Figure 3

Claims (1)

[Claims] An integrated part including a lens part on which an optical semiconductor element is mounted and whose optical axis is in the direction of beam irradiation of the optical semiconductor element, and an end surface of the lens part on the side opposite to the element side is formed into a substantially flat shape, and an optical fiber. an optical fiber holding part that holds the optical fiber and has an annular protrusion that extends through the optical fiber and protrudes in a substantially cylindrical shape on the end side of the optical fiber; and a connecting surface for connecting the integral part and the optical fiber holding part with an adhesive, the joining surface with the integral part being substantially flat, and an elastic bond between the optical fiber holding part and the connecting part. An optical semiconductor element package having members.