JPS62151729U - - Google Patents

Info

Publication number
JPS62151729U
JPS62151729U JP3997586U JP3997586U JPS62151729U JP S62151729 U JPS62151729 U JP S62151729U JP 3997586 U JP3997586 U JP 3997586U JP 3997586 U JP3997586 U JP 3997586U JP S62151729 U JPS62151729 U JP S62151729U
Authority
JP
Japan
Prior art keywords
sided adhesive
wafer support
frame
transport frame
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3997586U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3997586U priority Critical patent/JPS62151729U/ja
Publication of JPS62151729U publication Critical patent/JPS62151729U/ja
Pending legal-status Critical Current

Links

JP3997586U 1986-03-17 1986-03-17 Pending JPS62151729U (xx)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3997586U JPS62151729U (xx) 1986-03-17 1986-03-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3997586U JPS62151729U (xx) 1986-03-17 1986-03-17

Publications (1)

Publication Number Publication Date
JPS62151729U true JPS62151729U (xx) 1987-09-26

Family

ID=30853644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3997586U Pending JPS62151729U (xx) 1986-03-17 1986-03-17

Country Status (1)

Country Link
JP (1) JPS62151729U (xx)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230246A (ja) * 1987-11-06 1989-09-13 Tel Sagami Ltd 半導体ウェハの移し換え方法及び半導体ウェハの移し換え装置並びに半導体ウェハの熱処理ボート
JP2018114575A (ja) * 2017-01-17 2018-07-26 株式会社ディスコ ドレッシングボード、切削ブレードのドレッシング方法及び切削装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194351A (ja) * 1982-02-19 1983-11-12 プレシジョン・モノリシックス・インコ−ポレ−テッド 集積回路デバイスを探知する装置並びに方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194351A (ja) * 1982-02-19 1983-11-12 プレシジョン・モノリシックス・インコ−ポレ−テッド 集積回路デバイスを探知する装置並びに方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230246A (ja) * 1987-11-06 1989-09-13 Tel Sagami Ltd 半導体ウェハの移し換え方法及び半導体ウェハの移し換え装置並びに半導体ウェハの熱処理ボート
JP2018114575A (ja) * 2017-01-17 2018-07-26 株式会社ディスコ ドレッシングボード、切削ブレードのドレッシング方法及び切削装置

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