JPS62151091U - - Google Patents

Info

Publication number
JPS62151091U
JPS62151091U JP1986038738U JP3873886U JPS62151091U JP S62151091 U JPS62151091 U JP S62151091U JP 1986038738 U JP1986038738 U JP 1986038738U JP 3873886 U JP3873886 U JP 3873886U JP S62151091 U JPS62151091 U JP S62151091U
Authority
JP
Japan
Prior art keywords
nozzle
assist gas
processing device
laser
laser processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986038738U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986038738U priority Critical patent/JPS62151091U/ja
Publication of JPS62151091U publication Critical patent/JPS62151091U/ja
Pending legal-status Critical Current

Links

JP1986038738U 1986-03-17 1986-03-17 Pending JPS62151091U (US06342305-20020129-C00040.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986038738U JPS62151091U (US06342305-20020129-C00040.png) 1986-03-17 1986-03-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986038738U JPS62151091U (US06342305-20020129-C00040.png) 1986-03-17 1986-03-17

Publications (1)

Publication Number Publication Date
JPS62151091U true JPS62151091U (US06342305-20020129-C00040.png) 1987-09-25

Family

ID=30851260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986038738U Pending JPS62151091U (US06342305-20020129-C00040.png) 1986-03-17 1986-03-17

Country Status (1)

Country Link
JP (1) JPS62151091U (US06342305-20020129-C00040.png)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100249702B1 (ko) * 1996-12-30 2000-04-01 정몽규 레이저 용접부 보호를 위해 레이저 용접 헤드에 장착되는 보호가스분사장치
JP2001212688A (ja) * 2000-01-31 2001-08-07 Honda Motor Co Ltd レーザ溶接方法および装置
JP2002254185A (ja) * 2001-02-28 2002-09-10 Honda Motor Co Ltd エアーバッグ用脆弱部の形成方法および装置
JP2011230153A (ja) * 2010-04-27 2011-11-17 Fuji Electric Co Ltd ウェハ加工方法およびウェハ加工装置
WO2014077066A1 (ja) * 2012-11-13 2014-05-22 日本電気硝子株式会社 板ガラスのレーザー溶断方法
US20160001401A1 (en) * 2013-02-14 2016-01-07 Renishaw Plc Selective laser solidification apparatus and method
CN105817621A (zh) * 2015-01-27 2016-08-03 通用电器技术有限公司 用于加工材料的方法
JP6636213B1 (ja) * 2018-12-03 2020-01-29 三菱電機株式会社 レーザ加工装置およびレーザ加工方法
US10639879B2 (en) 2013-03-15 2020-05-05 Renishaw Plc Selective laser solidification apparatus and method

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100249702B1 (ko) * 1996-12-30 2000-04-01 정몽규 레이저 용접부 보호를 위해 레이저 용접 헤드에 장착되는 보호가스분사장치
JP2001212688A (ja) * 2000-01-31 2001-08-07 Honda Motor Co Ltd レーザ溶接方法および装置
JP4583535B2 (ja) * 2000-01-31 2010-11-17 本田技研工業株式会社 レーザ溶接方法および装置
JP2002254185A (ja) * 2001-02-28 2002-09-10 Honda Motor Co Ltd エアーバッグ用脆弱部の形成方法および装置
JP2011230153A (ja) * 2010-04-27 2011-11-17 Fuji Electric Co Ltd ウェハ加工方法およびウェハ加工装置
WO2014077066A1 (ja) * 2012-11-13 2014-05-22 日本電気硝子株式会社 板ガラスのレーザー溶断方法
JP2014097906A (ja) * 2012-11-13 2014-05-29 Nippon Electric Glass Co Ltd 板ガラスのレーザー溶断方法
EP2956262B1 (en) 2013-02-14 2018-04-04 Renishaw PLC Selective laser solidification apparatus and method
US20160001401A1 (en) * 2013-02-14 2016-01-07 Renishaw Plc Selective laser solidification apparatus and method
US10493562B2 (en) * 2013-02-14 2019-12-03 Renishaw Plc Selective laser solidification apparatus and method
US11565346B2 (en) 2013-02-14 2023-01-31 Renishaw Plc Selective laser solidification apparatus and method
US12030245B2 (en) 2013-02-14 2024-07-09 Renishaw Plc Method of selective laser solidification
US10639879B2 (en) 2013-03-15 2020-05-05 Renishaw Plc Selective laser solidification apparatus and method
US11104121B2 (en) 2013-03-15 2021-08-31 Renishaw Plc Selective laser solidification apparatus and method
US11752694B2 (en) 2013-03-15 2023-09-12 Renishaw Plc Selective laser solidification apparatus and method
CN105817621A (zh) * 2015-01-27 2016-08-03 通用电器技术有限公司 用于加工材料的方法
EP3050666A1 (en) * 2015-01-27 2016-08-03 Alstom Technology Ltd Method of processing materials by applying a laser beam with adaptive shielding gas flow
JP6636213B1 (ja) * 2018-12-03 2020-01-29 三菱電機株式会社 レーザ加工装置およびレーザ加工方法
WO2020115798A1 (ja) * 2018-12-03 2020-06-11 三菱電機株式会社 レーザ加工装置およびレーザ加工方法
US11389907B2 (en) 2018-12-03 2022-07-19 Mitsubishi Electric Corporation Laser machining apparatus and laser machining method

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