JPS62147358U - - Google Patents
Info
- Publication number
- JPS62147358U JPS62147358U JP3593686U JP3593686U JPS62147358U JP S62147358 U JPS62147358 U JP S62147358U JP 3593686 U JP3593686 U JP 3593686U JP 3593686 U JP3593686 U JP 3593686U JP S62147358 U JPS62147358 U JP S62147358U
- Authority
- JP
- Japan
- Prior art keywords
- tie bar
- resin sealing
- lead frame
- electronic components
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986035936U JPH0319229Y2 (enrdf_load_stackoverflow) | 1986-03-12 | 1986-03-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986035936U JPH0319229Y2 (enrdf_load_stackoverflow) | 1986-03-12 | 1986-03-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62147358U true JPS62147358U (enrdf_load_stackoverflow) | 1987-09-17 |
| JPH0319229Y2 JPH0319229Y2 (enrdf_load_stackoverflow) | 1991-04-23 |
Family
ID=30845883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986035936U Expired JPH0319229Y2 (enrdf_load_stackoverflow) | 1986-03-12 | 1986-03-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0319229Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01321665A (ja) * | 1988-06-24 | 1989-12-27 | Toshiba Corp | 樹脂封止型半導体装置の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58124255A (ja) * | 1982-01-21 | 1983-07-23 | Toshiba Corp | 半導体装置のリ−ドフレ−ム |
| JPS5936955A (ja) * | 1982-08-25 | 1984-02-29 | Shinko Electric Ind Co Ltd | リ−ドフレ−ム |
| JPS6084850A (ja) * | 1983-10-17 | 1985-05-14 | Hitachi Ltd | リ−ドフレ−ム |
-
1986
- 1986-03-12 JP JP1986035936U patent/JPH0319229Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58124255A (ja) * | 1982-01-21 | 1983-07-23 | Toshiba Corp | 半導体装置のリ−ドフレ−ム |
| JPS5936955A (ja) * | 1982-08-25 | 1984-02-29 | Shinko Electric Ind Co Ltd | リ−ドフレ−ム |
| JPS6084850A (ja) * | 1983-10-17 | 1985-05-14 | Hitachi Ltd | リ−ドフレ−ム |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01321665A (ja) * | 1988-06-24 | 1989-12-27 | Toshiba Corp | 樹脂封止型半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0319229Y2 (enrdf_load_stackoverflow) | 1991-04-23 |