JPS62147358U - - Google Patents

Info

Publication number
JPS62147358U
JPS62147358U JP3593686U JP3593686U JPS62147358U JP S62147358 U JPS62147358 U JP S62147358U JP 3593686 U JP3593686 U JP 3593686U JP 3593686 U JP3593686 U JP 3593686U JP S62147358 U JPS62147358 U JP S62147358U
Authority
JP
Japan
Prior art keywords
tie bar
resin sealing
lead frame
electronic components
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3593686U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0319229Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986035936U priority Critical patent/JPH0319229Y2/ja
Publication of JPS62147358U publication Critical patent/JPS62147358U/ja
Application granted granted Critical
Publication of JPH0319229Y2 publication Critical patent/JPH0319229Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986035936U 1986-03-12 1986-03-12 Expired JPH0319229Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986035936U JPH0319229Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-03-12 1986-03-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986035936U JPH0319229Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-03-12 1986-03-12

Publications (2)

Publication Number Publication Date
JPS62147358U true JPS62147358U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-09-17
JPH0319229Y2 JPH0319229Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-04-23

Family

ID=30845883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986035936U Expired JPH0319229Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-03-12 1986-03-12

Country Status (1)

Country Link
JP (1) JPH0319229Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01321665A (ja) * 1988-06-24 1989-12-27 Toshiba Corp 樹脂封止型半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58124255A (ja) * 1982-01-21 1983-07-23 Toshiba Corp 半導体装置のリ−ドフレ−ム
JPS5936955A (ja) * 1982-08-25 1984-02-29 Shinko Electric Ind Co Ltd リ−ドフレ−ム
JPS6084850A (ja) * 1983-10-17 1985-05-14 Hitachi Ltd リ−ドフレ−ム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58124255A (ja) * 1982-01-21 1983-07-23 Toshiba Corp 半導体装置のリ−ドフレ−ム
JPS5936955A (ja) * 1982-08-25 1984-02-29 Shinko Electric Ind Co Ltd リ−ドフレ−ム
JPS6084850A (ja) * 1983-10-17 1985-05-14 Hitachi Ltd リ−ドフレ−ム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01321665A (ja) * 1988-06-24 1989-12-27 Toshiba Corp 樹脂封止型半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0319229Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-04-23

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