JPS62147345U - - Google Patents
Info
- Publication number
- JPS62147345U JPS62147345U JP3588286U JP3588286U JPS62147345U JP S62147345 U JPS62147345 U JP S62147345U JP 3588286 U JP3588286 U JP 3588286U JP 3588286 U JP3588286 U JP 3588286U JP S62147345 U JPS62147345 U JP S62147345U
- Authority
- JP
- Japan
- Prior art keywords
- beam lead
- type semiconductor
- semiconductor element
- lead type
- bonding tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3588286U JPS62147345U (fr) | 1986-03-12 | 1986-03-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3588286U JPS62147345U (fr) | 1986-03-12 | 1986-03-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62147345U true JPS62147345U (fr) | 1987-09-17 |
Family
ID=30845774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3588286U Pending JPS62147345U (fr) | 1986-03-12 | 1986-03-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62147345U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010251374A (ja) * | 2009-04-10 | 2010-11-04 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
-
1986
- 1986-03-12 JP JP3588286U patent/JPS62147345U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010251374A (ja) * | 2009-04-10 | 2010-11-04 | Renesas Electronics Corp | 半導体装置およびその製造方法 |