JPS6214726U - - Google Patents
Info
- Publication number
- JPS6214726U JPS6214726U JP1985105862U JP10586285U JPS6214726U JP S6214726 U JPS6214726 U JP S6214726U JP 1985105862 U JP1985105862 U JP 1985105862U JP 10586285 U JP10586285 U JP 10586285U JP S6214726 U JPS6214726 U JP S6214726U
- Authority
- JP
- Japan
- Prior art keywords
- notch
- lead
- semiconductor device
- land portion
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985105862U JPS6214726U (enFirst) | 1985-07-11 | 1985-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985105862U JPS6214726U (enFirst) | 1985-07-11 | 1985-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214726U true JPS6214726U (enFirst) | 1987-01-29 |
Family
ID=30980689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985105862U Pending JPS6214726U (enFirst) | 1985-07-11 | 1985-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214726U (enFirst) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253681A (ja) * | 2005-03-07 | 2006-09-21 | Agere Systems Inc | 集積回路パッケージ |
-
1985
- 1985-07-11 JP JP1985105862U patent/JPS6214726U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253681A (ja) * | 2005-03-07 | 2006-09-21 | Agere Systems Inc | 集積回路パッケージ |