JPS6214725U - - Google Patents
Info
- Publication number
- JPS6214725U JPS6214725U JP10586085U JP10586085U JPS6214725U JP S6214725 U JPS6214725 U JP S6214725U JP 10586085 U JP10586085 U JP 10586085U JP 10586085 U JP10586085 U JP 10586085U JP S6214725 U JPS6214725 U JP S6214725U
- Authority
- JP
- Japan
- Prior art keywords
- land portion
- leads
- semiconductor pellet
- view
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10586085U JPS6214725U (enFirst) | 1985-07-11 | 1985-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10586085U JPS6214725U (enFirst) | 1985-07-11 | 1985-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214725U true JPS6214725U (enFirst) | 1987-01-29 |
Family
ID=30980685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10586085U Pending JPS6214725U (enFirst) | 1985-07-11 | 1985-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214725U (enFirst) |
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1985
- 1985-07-11 JP JP10586085U patent/JPS6214725U/ja active Pending