JPS62145362U - - Google Patents
Info
- Publication number
- JPS62145362U JPS62145362U JP3264486U JP3264486U JPS62145362U JP S62145362 U JPS62145362 U JP S62145362U JP 3264486 U JP3264486 U JP 3264486U JP 3264486 U JP3264486 U JP 3264486U JP S62145362 U JPS62145362 U JP S62145362U
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- dimensionally
- meandering
- sides
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3264486U JPS62145362U (bs) | 1986-03-07 | 1986-03-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3264486U JPS62145362U (bs) | 1986-03-07 | 1986-03-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62145362U true JPS62145362U (bs) | 1987-09-12 |
Family
ID=30839519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3264486U Pending JPS62145362U (bs) | 1986-03-07 | 1986-03-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62145362U (bs) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006156911A (ja) * | 2004-12-01 | 2006-06-15 | Ricoh Co Ltd | プリント配線基板 |
WO2008050706A1 (fr) * | 2006-10-24 | 2008-05-02 | Panasonic Corporation | Tableau de connexions imprimé, procédé de fabrication d'un tableau de connexions imprimé et dispositif électrique |
JP2009170884A (ja) * | 2008-01-18 | 2009-07-30 | Samsung Electronics Co Ltd | 回路基板及びこれを含む表示装置 |
JP2012114217A (ja) * | 2010-11-24 | 2012-06-14 | Nitto Denko Corp | 配線回路基板の製造方法 |
-
1986
- 1986-03-07 JP JP3264486U patent/JPS62145362U/ja active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006156911A (ja) * | 2004-12-01 | 2006-06-15 | Ricoh Co Ltd | プリント配線基板 |
JP4562504B2 (ja) * | 2004-12-01 | 2010-10-13 | 株式会社リコー | プリント配線基板 |
WO2008050706A1 (fr) * | 2006-10-24 | 2008-05-02 | Panasonic Corporation | Tableau de connexions imprimé, procédé de fabrication d'un tableau de connexions imprimé et dispositif électrique |
JP5106411B2 (ja) * | 2006-10-24 | 2012-12-26 | パナソニック株式会社 | プリント配線板およびプリント配線板の製造方法 |
JP2009170884A (ja) * | 2008-01-18 | 2009-07-30 | Samsung Electronics Co Ltd | 回路基板及びこれを含む表示装置 |
JP2012114217A (ja) * | 2010-11-24 | 2012-06-14 | Nitto Denko Corp | 配線回路基板の製造方法 |
US8869391B2 (en) | 2010-11-24 | 2014-10-28 | Nitto Denko Corporation | Producing method of wired circuit board |