JPS62144326A - Production unit for semiconductor device - Google Patents

Production unit for semiconductor device

Info

Publication number
JPS62144326A
JPS62144326A JP60286367A JP28636785A JPS62144326A JP S62144326 A JPS62144326 A JP S62144326A JP 60286367 A JP60286367 A JP 60286367A JP 28636785 A JP28636785 A JP 28636785A JP S62144326 A JPS62144326 A JP S62144326A
Authority
JP
Japan
Prior art keywords
reticle
base
horizontal plane
height adjusting
attitude
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60286367A
Other languages
Japanese (ja)
Inventor
Tomio Yamamoto
山本 冨男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60286367A priority Critical patent/JPS62144326A/en
Publication of JPS62144326A publication Critical patent/JPS62144326A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To correct the inclination of a reticle setting base to a horizontal attitude by mounting a plurality of height adjusting mechanisms supporting a base plate for a reticle by at least three-point support. CONSTITUTION:A reticle 1 is placed on a base 2, positioning in the front and rear and left and right and rotational directions is conducted, and the reticle 1 is fixed onto the base 2 by a vacuum chuck. A semiconductor substrate 6 for a test on a stage 7 on which a photo-resist is applied is test-exposed by beams passed through a reduction projection lens 5 through the reticle 1, and a mounting attitude to the horizontal plane of the reticle 1 is investigated. The reticle setting base is corrected by using a height adjusting mechanism 4 on the basis of the measured value. Accordingly, the height adjusting mechanism 4 is driven separately on the basis of drive controlled variables corresponding to inclinations to the horizontal plane of the reticle by a control section 8, the positions of the height of each support point of the base 2 are regulated, the movements of the support points are measured by sensors 3 for measuring distances, and attitudes to the horizontal plane of the reticle are corrected, controlling the drive of the height adjusting mechanism 4 by the measured values.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置の製造装置に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to a semiconductor device manufacturing apparatus.

〔従来の技術〕[Conventional technology]

従来、半導体装置の製造装置、特に光の照射によりレチ
クルのパターンを該レチクルの真下位置の半導体基板上
に投影露光する縮小投影露光装置において、レチクルを
セットする台は本体にネジで固定されており、台の傾き
を修正して該台を水平姿勢に調整するには、ネジの締め
付けによる高さ位置を調整するか又は台の上面を削り直
して水平度出しを行うなどの方法にておこなわれていた
Conventionally, in semiconductor device manufacturing equipment, particularly reduction projection exposure equipment that projects and exposes a reticle pattern onto a semiconductor substrate directly below the reticle by irradiating light, the stand on which the reticle is set is fixed to the main body with screws. To correct the inclination of the table and adjust it to a horizontal position, you can adjust the height position by tightening the screws, or re-scrape the top surface of the table to make it level. was.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

縮小投影露光装置において、レチ′クルをセントする台
が傾いていると、像画傾斜が発生する。また、台の傾き
の調整が完全であっても、レチクルと台との間に異物等
が入ったまま、レチクルが固定されてしまうと、台が頌
いていることと同様の状態となり、像画傾斜が発生する
。この状態はレチクルの交換ごとに生ずる可能性があり
、かつ傾きの方向も一定ではない。したがって、台の傾
きの調整はレチクルの交換ごとに1 しがもレチクルセ
ットの後におこなう必要がある。
In a reduction projection exposure apparatus, if the table on which the reticle is centered is tilted, image tilt occurs. Furthermore, even if the tilt of the stand is perfectly adjusted, if the reticle is fixed with a foreign object between the reticle and the stand, the situation will be similar to that of the stand being tilted, and the image will be A slope occurs. This condition may occur every time the reticle is replaced, and the direction of the tilt is not constant. Therefore, the tilt of the stand must be adjusted every time the reticle is replaced, but only after the reticle is set.

微細パターンを形成する念めには、縮小投影露光装置の
レンズの開口数を大きくする必要があるが、レンズの開
口数が大きくなると、フォーカスマージンが小さくなり
、1象画傾斜の影響は増大する。
In order to form fine patterns, it is necessary to increase the numerical aperture of the lens of the reduction projection exposure device, but as the numerical aperture of the lens increases, the focus margin becomes smaller and the influence of single-elevation tilt increases. .

上述した従来の縮小投影露光装置のレチクルをセットす
る台では傾きの調整に長い時間がかかること、及びレチ
クルをセットした状態では調整が困難なことからレチク
ルの水平面妃対するずれを完全になくすることはできな
いという欠点があった。
Since it takes a long time to adjust the inclination of the table on which the reticle is set in the conventional reduction projection exposure apparatus mentioned above, and it is difficult to adjust the tilt with the reticle set, it is desirable to completely eliminate the misalignment of the reticle with respect to the horizontal plane. The drawback was that it was not possible.

本発明はレチクルをセットする台の傾きを水平姿勢に矯
正できる半導体装置の製造装置を提供するものである。
The present invention provides a semiconductor device manufacturing apparatus that can correct the inclination of a table on which a reticle is set to a horizontal position.

〔問題点を解決するための手段〕[Means for solving problems]

本発明はレチクルに光を透過して該レチクルのパターン
を半導体基板に投影露光する装置において、レチクルの
載置台を少なくとも3点支持により水平姿勢に支持する
複数台の高さ調整機構と、前記各高さ調整機構を個々に
駆動し載置台の各支持点の高さ位置を調整し、載置台上
のレチクルの姿勢を制御する制御部とを有することを特
徴とする半導体装置の製造装置である。
The present invention provides an apparatus for projecting and exposing a pattern of a reticle onto a semiconductor substrate by transmitting light through a reticle, which comprises: a plurality of height adjustment mechanisms for supporting a reticle mounting table in a horizontal position by supporting at least three points; A semiconductor device manufacturing apparatus characterized by having a control unit that individually drives a height adjustment mechanism to adjust the height position of each support point of a mounting table and controls the attitude of a reticle on the mounting table. .

〔実施例〕 以下、本発明の一実施例を図により説明する。〔Example〕 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

第1図において、本発明に係る装置はレチクル1の載置
台2を3台の高さ調整機構4,4.4により3点支持し
てこれを水平姿勢に保ち、かつ各高さ調整機構4の真上
位置に距離測定用センサ3をそれぞれ設置し、さらに載
置台2上のレチクル1の水平面に対する傾き姿勢に応じ
た駆動制御量に基づいて各高さ調整機構4を個々に駆動
し、センサ3からの測定信号を監視しつつ載置台2の各
支持台の高さ位置を調整し、載置台上のレチクルの姿勢
を制御する制御部8を有するものである。
In FIG. 1, the apparatus according to the present invention supports a mounting table 2 for a reticle 1 at three points by three height adjustment mechanisms 4, 4.4 to keep it in a horizontal position, and each height adjustment mechanism 4 A distance measurement sensor 3 is installed directly above the sensor, and each height adjustment mechanism 4 is individually driven based on the drive control amount corresponding to the tilt attitude of the reticle 1 on the mounting table 2 with respect to the horizontal plane. The apparatus has a control section 8 that adjusts the height position of each support of the mounting table 2 while monitoring measurement signals from the mounting table 3, and controls the attitude of the reticle on the mounting table.

実施例において、レチクルの水平面に対する傾き姿勢を
修正するには、まず、製品露光を行う前にテスト用半導
体基板への投影露光を実行し、レチクル1の取り付は姿
勢を把握する。ft、(わち、まず、台2上にレチクル
1を乗せ、前後、左右及び回転方向の位置出しをした後
、真空チャック等でレチクル]を台2上に固定する。次
に、このレチクル1を通して、フォトレジストを塗布し
たステージ7上のテスト用半導体基板6に、縮小投影レ
ンズ5に通した光によってテスト露光を行い、レチクル
1の水平面に対する取り付は姿勢を調べる。その測定値
に基づき高さ調整機構4を使って修正する。この場合、
修正精度を0.5Rn程度以上にするため、距離測定用
センサ3を使用する。すなわち、制御部8によりレチク
ルの水平面に対する傾き姿勢に応じた駆動制御量に基づ
い、て高さ調整機構4を個々に駆動し、台2の各支持点
の高さ位置を調整しその移動量を距離測定用センサ3に
より測定し、その測定値で高さ調整機構4の駆動制御を
行いつつレチクルの水平面に対する姿勢を修正する。
In the embodiment, in order to correct the tilted attitude of the reticle with respect to the horizontal plane, first, before performing product exposure, projection exposure is performed on the test semiconductor substrate, and the attitude of the reticle 1 is grasped. ft, (that is, first, place the reticle 1 on the table 2, and after positioning it in the front-rear, left-right, and rotational directions, fix the reticle with a vacuum chuck or the like) on the table 2.Next, this reticle 1 is fixed on the table 2. A test semiconductor substrate 6 coated with photoresist on a stage 7 is subjected to test exposure using the light passed through the reduction projection lens 5, and the attitude of the reticle 1 relative to the horizontal plane is checked.Based on the measured value, the height Correct using the adjustment mechanism 4. In this case,
A distance measuring sensor 3 is used to increase the correction accuracy to about 0.5Rn or more. That is, the height adjustment mechanism 4 is individually driven by the control unit 8 based on the drive control amount according to the tilt attitude of the reticle with respect to the horizontal plane, and the height position of each support point of the table 2 is adjusted and the amount of movement thereof is adjusted. The distance is measured by the distance measuring sensor 3, and the attitude of the reticle with respect to the horizontal plane is corrected while controlling the drive of the height adjustment mechanism 4 based on the measured value.

以上の様にしてレチクルの水平面に対する姿勢を修正し
た後、製品露光をおこなう。
After correcting the attitude of the reticle with respect to the horizontal plane as described above, product exposure is performed.

尚、レチクルと台との間に異物が入ることによリレチク
ルの水平面に対するずれが生じた場合も同様に操作して
レチクルの水平面に対する姿勢を修正する。
Note that even if the reticle is displaced from the horizontal plane due to a foreign object entering between the reticle and the stand, the attitude of the reticle with respect to the horizontal plane is corrected by performing the same operation.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は製品露光をする前段階で縮
小投影露光装置本体にレチクルをセットする場合の取り
付は姿勢を修正するようにしたので、レチクル上のパタ
ーンを半導体基板上に正確に転写することができる効果
がある。
As explained above, in the present invention, when the reticle is set in the reduction projection exposure apparatus main body before product exposure, the mounting position is corrected, so that the pattern on the reticle can be accurately placed on the semiconductor substrate. It has the effect of being transferable.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の縮小投影露光装置の縦断面図である。 1・・・レチクル     2・・・載置台3・・・距
離測定用センサー 4・・・高さ調整機構5・・・縮小
投影レンズ  6・・・半導体基板7・・・ステージ 
    8・・・制御部特許出願人  日本電気株式会
社 ・′5ご\ 代 理 人   弁理士 菅 野  中11、  亨)
−゛−二J:′
FIG. 1 is a longitudinal sectional view of a reduction projection exposure apparatus according to the present invention. 1... Reticle 2... Mounting table 3... Distance measurement sensor 4... Height adjustment mechanism 5... Reduction projection lens 6... Semiconductor substrate 7... Stage
8... Control unit patent applicant: NEC Co., Ltd. '5 Go\ Agent: Patent attorney: Toru Kanno, 11)
-゛-2J:'

Claims (1)

【特許請求の範囲】[Claims] (1)レチクルに光を透過して該レチクルのパターンを
半導体基板に投影露光する装置において、レチクルの載
置台を少なくとも3点支持により水平姿勢に支持する複
数台の高さ調整機構と、前記各高さ調整機構を個々に駆
動し載置台の各支持点の高さ位置を調整し、載置台上の
レチクルの姿勢を制御する制御部とを有することを特徴
とする半導体装置の製造装置。
(1) An apparatus for projecting and exposing a reticle pattern onto a semiconductor substrate by transmitting light through a reticle, including a plurality of height adjustment mechanisms for supporting a reticle mounting table in a horizontal position by supporting at least three points; 1. A semiconductor device manufacturing apparatus, comprising: a control unit that individually drives a height adjustment mechanism to adjust the height position of each support point of a mounting table, and controls the attitude of a reticle on the mounting table.
JP60286367A 1985-12-19 1985-12-19 Production unit for semiconductor device Pending JPS62144326A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60286367A JPS62144326A (en) 1985-12-19 1985-12-19 Production unit for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60286367A JPS62144326A (en) 1985-12-19 1985-12-19 Production unit for semiconductor device

Publications (1)

Publication Number Publication Date
JPS62144326A true JPS62144326A (en) 1987-06-27

Family

ID=17703465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60286367A Pending JPS62144326A (en) 1985-12-19 1985-12-19 Production unit for semiconductor device

Country Status (1)

Country Link
JP (1) JPS62144326A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63255916A (en) * 1987-04-13 1988-10-24 Nikon Corp Projection optical equipment
EP0948059A1 (en) * 1998-02-05 1999-10-06 Asulab S.A. Positioning means in a microelectronic device and imaging device using the same
WO2006068288A1 (en) * 2004-12-22 2006-06-29 Nikon Corporation Method for measuring position of mask surface in height direction, exposure apparatus and exposure method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63255916A (en) * 1987-04-13 1988-10-24 Nikon Corp Projection optical equipment
EP0948059A1 (en) * 1998-02-05 1999-10-06 Asulab S.A. Positioning means in a microelectronic device and imaging device using the same
WO2006068288A1 (en) * 2004-12-22 2006-06-29 Nikon Corporation Method for measuring position of mask surface in height direction, exposure apparatus and exposure method
JPWO2006068288A1 (en) * 2004-12-22 2008-06-12 株式会社ニコン Method for measuring height direction position of mask surface, exposure apparatus and exposure method
JP4556954B2 (en) * 2004-12-22 2010-10-06 株式会社ニコン Method for measuring height direction position of mask surface, exposure apparatus and exposure method

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