JPS62143812A - Purification of silicon tetrafluoride - Google Patents

Purification of silicon tetrafluoride

Info

Publication number
JPS62143812A
JPS62143812A JP28438285A JP28438285A JPS62143812A JP S62143812 A JPS62143812 A JP S62143812A JP 28438285 A JP28438285 A JP 28438285A JP 28438285 A JP28438285 A JP 28438285A JP S62143812 A JPS62143812 A JP S62143812A
Authority
JP
Japan
Prior art keywords
silicon tetrafluoride
silica gel
gas
siloxanes
sif4
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28438285A
Other languages
Japanese (ja)
Other versions
JPH0481523B2 (en
Inventor
Isao Harada
功 原田
Hiroyuki Momotake
宏之 百武
Nobuhiko Koto
信彦 古藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP28438285A priority Critical patent/JPS62143812A/en
Publication of JPS62143812A publication Critical patent/JPS62143812A/en
Publication of JPH0481523B2 publication Critical patent/JPH0481523B2/ja
Granted legal-status Critical Current

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Abstract

PURPOSE:An SiF4 gas is passed through the silica gel layers which have been dehydrated, under specific conditions to remove siloxanes included in the product as contaminants through simple procedures whereby high-efficient purification of SiF4 can be done. CONSTITUTION:An SiF4 gas is passed through silica gel layers which has been preliminarily dehydrated, preferably at about 150-300 deg.C under substantially water-free conditions in a temperature range from -10 to -95 deg.C. Inexpensive silica gel is used as an adsorbent to remove siloxanes completely through simple operations whereby high-purity SiF4 can be supplied for amorphous silicon film and dry etching.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は四弗化ケイ素の精製方法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a method for purifying silicon tetrafluoride.

更に詳しくは、四弗化ケイ素ガス中のシロキサン類の除
去法に関する。四弗化ケイ素ガスは、アモルファスシリ
コン薄膜半導体用の原料やドライエツチング剤として近
年注目されて来ているが、これらの用途としての四弗化
ケイ素ガスは高純度のものが要求されている。
More specifically, the present invention relates to a method for removing siloxanes from silicon tetrafluoride gas. Silicon tetrafluoride gas has recently attracted attention as a raw material for amorphous silicon thin film semiconductors and as a dry etching agent, but silicon tetrafluoride gas for these uses is required to be of high purity.

(従来技術及びその問題点) 四弗化ケイ素ガスは種々の方法で製造されるが、殆んど
の場合シロキサイを不純物として含有している。
(Prior art and its problems) Silicon tetrafluoride gas is produced by various methods, but in most cases it contains siloxane as an impurity.

四弗化ケイ素ガスの製造法としては、例えばケイ弗酸や
ケイ弗化化合物の酸分解法、ケイ弗化化合物の熱分解法
、弗化水素と二酸化ケイ素との反応による合成法などが
知られている。
Known methods for producing silicon tetrafluoride gas include, for example, an acid decomposition method of silicofluoric acid and silicofluoride compounds, a thermal decomposition method of silicofluoride compounds, and a synthesis method by reacting hydrogen fluoride with silicon dioxide. ing.

しかしながらこれらの製造方法により得られた四弗化ケ
イ素ガス中には、数千ppmにも及ぶ量のシロキサン類
を含有している場合もあるのでこれを除去する必要があ
る。
However, the silicon tetrafluoride gas obtained by these production methods may contain siloxanes in an amount of several thousand ppm, which must be removed.

特にアモルファスシリコン薄膜の原料として使用する場
合には、シロキサン類の存在は生成したシリコン薄膜中
に多量の酸素が混入し、半導体特性に悪影響を及ぼすの
でこれらは充分に除去しなければならない。
In particular, when used as a raw material for amorphous silicon thin films, the presence of siloxanes causes a large amount of oxygen to be mixed into the produced silicon thin film, which adversely affects semiconductor properties, so these must be thoroughly removed.

シロキサン類は四弗化ケイ素製造過程において、例えば
原料中に含1れる水分と、生成した四弗化ケイ素との反
応により生成すると考えられるが、四弗化ケイ素の製造
過程で水分を完全に除きシロキサン類の生成を防止する
ことは、非常に難しく事実上不可能である。
Siloxanes are thought to be produced during the silicon tetrafluoride manufacturing process, for example, by the reaction between water contained in raw materials and the silicon tetrafluoride produced, but the water is completely removed during the silicon tetrafluoride manufacturing process. Preventing the formation of siloxanes is extremely difficult and virtually impossible.

従って生成した四弗化ケイ素ガス中のシロキサン類を分
離除去することになるが、四弗化ケイ素の臨界圧は非常
に高い(36,66atm)ので蒸留による分離も困難
である。
Therefore, the siloxanes in the generated silicon tetrafluoride gas must be separated and removed, but the critical pressure of silicon tetrafluoride is extremely high (36.66 atm), so separation by distillation is difficult.

シロキサン類の除去に関しては、活性炭を使用する吸着
除去法(特公昭59−4126 )及び活性アルミナを
使用する吸着除去法(特開昭59−162122 )等
が知られている。
Regarding the removal of siloxanes, adsorption removal methods using activated carbon (Japanese Patent Publication No. 59-4126) and adsorption removal methods using activated alumina (Japanese Patent Application Laid-open No. 59-162122) are known.

これらの吸着除去法は、通常活性炭や活性アルミナを充
填したカラムに四弗化ケイ素ガスを通気する方法によっ
て実施されるが、本発明者らがこれらの吸着能の経時変
化を個々にサンプリングして詳細に追跡したところ、こ
れらの方法はove rallとしての四弗化ケイ素ガ
ス中のシロキサン類の除去にはもちろん効果があるもの
の、驚ろくべさことに通気初期においてその吸着能力が
異常に低いため、この初期の流出ガスはシロキサン類を
大量に含みそのためアモルファスシリコン薄膜製造用な
どの高純度を要求される用途には不充分であることがわ
かった。
These adsorption removal methods are usually carried out by bubbling silicon tetrafluoride gas through a column packed with activated carbon or activated alumina, but the present inventors individually sampled changes in their adsorption capacity over time. A detailed investigation revealed that these methods are of course effective in removing siloxanes from silicon tetrafluoride gas as an over-rall, but surprisingly, their adsorption capacity is abnormally low in the early stages of ventilation. It was found that this initial effluent gas contained a large amount of siloxanes and was therefore insufficient for applications requiring high purity, such as the production of amorphous silicon thin films.

(問題点を解決するための手段) 本発明者等は、四弗化ケイ素ガス中のシロキサン類の吸
着除去、特に吸着塔への四弗化ケイ素ガス通気初期にお
けるシロキサン類の吸着効果を改善する目的で、種々の
吸着剤及び通気条件について鋭意検討を重ねた結果、吸
着剤として所定の前処理を行なったシリカゲルを使用し
かつ特定の条件で当初から通気させることにより、四弗
化ケイ素ガス中のシロキサン類を極めて効率良く除去で
きることを見出し、本発明を完成するに至ったものであ
る。
(Means for Solving the Problems) The present inventors have attempted to adsorb and remove siloxanes from silicon tetrafluoride gas, particularly improving the adsorption effect of siloxanes at the initial stage of silicon tetrafluoride gas ventilation into an adsorption tower. As a result of intensive studies on various adsorbents and aeration conditions, we found that by using silica gel that had been pretreated as an adsorbent and aerating it under specific conditions from the beginning, it was possible to absorb silicon tetrafluoride gas. The inventors have discovered that siloxanes can be removed extremely efficiently, and have completed the present invention.

即ち本発明の四弗化ケイ素の精製法は、予め加熱による
脱水処理したシリカゲル層に、実質的に水分の混入しな
い状態で温度−10〜−95℃の範囲において四弗化ケ
イ素ガスを通気させることを特徴とするものである。
That is, the method for purifying silicon tetrafluoride of the present invention involves passing silicon tetrafluoride gas through a silica gel layer that has been dehydrated by heating in advance at a temperature in the range of -10 to -95°C in a state where substantially no moisture is mixed. It is characterized by this.

本発明に於いて使用するシリカゲルは、特に限定はなく
通常市販のものが何れも使用可能であるが粒状高表面積
のものがより好ましい。
The silica gel used in the present invention is not particularly limited, and any commercially available silica gel can be used, but granular silica gel with a high surface area is more preferable.

シリカゲルの加熱による脱水処理は好ましくは150〜
300℃、さらに好ましくは180〜200℃の温度で
実施される。
The dehydration treatment by heating silica gel is preferably performed at a temperature of 150 to
It is carried out at a temperature of 300°C, more preferably 180-200°C.

シリカゲルの加熱による脱水処理温度が150℃未満で
は、シリカゲル中に水分がかなりの量残存する。
When the dehydration temperature of silica gel by heating is less than 150° C., a considerable amount of water remains in the silica gel.

この様なシリカゲルでは、四弗化ケイ素ガスを通気した
際、この残存した水分と四弗化ケイ素が反応しシロキサ
ン類を生成するので好IL<fi<、また同時に弗化水
素も生成するため、この弗化水素による例えばカラムな
ど装置の腐食が発生するので好壕しくない。逆に加熱処
理温度が300 ’Cを越える場合は、エネルギーの損
失であるばかりでなくたとえば650℃で加熱処理した
場合はシリカゲルの吸着能力を犬さく低下させるので好
ましくない。
In such silica gel, when silicon tetrafluoride gas is aerated, the remaining moisture reacts with silicon tetrafluoride to produce siloxanes, so it is good for IL<fi<, and hydrogen fluoride is also produced at the same time. This hydrogen fluoride causes corrosion of equipment such as columns, which is not desirable. On the other hand, if the heat treatment temperature exceeds 300'C, this is not preferable because not only is there a loss of energy, but also the adsorption ability of the silica gel is significantly reduced if the heat treatment is carried out at, for example, 650C.

加熱によるシリカゲルの脱水処理時の雰囲気は通常の空
気中で行なっても良いがシリカゲル中に含有する水分を
加熱により気化逸散させる必要があるので、例えば乾燥
窒素ガスの様に水分を含有しないガスの気流中で行なう
のが良く、またガスを吸引し乍ら減圧下で行なうことも
好葦しい。
The atmosphere for dehydrating silica gel by heating may be normal air, but since it is necessary to vaporize and dissipate the moisture contained in the silica gel by heating, use a gas that does not contain moisture, such as dry nitrogen gas. It is preferable to carry out this process in an air stream, and it is also preferable to carry out this process under reduced pressure while sucking gas.

脱水処理時間は上記の加熱温度及び雰囲□気において通
常1〜2時間必要である。脱水処理後、シリカゲルは放
冷または強制冷却によって常温以下に冷却されるが、こ
の場合水分の混入を回避しなければならない。
The dehydration treatment usually requires 1 to 2 hours at the above heating temperature and atmosphere. After the dehydration treatment, the silica gel is cooled down to room temperature or below by cooling or forced cooling, but in this case it is necessary to avoid contamination with moisture.

四弗化ケイ素ガスの精製はカラム等に充填されたシリカ
ゲル層に通気する方法で実施されるが、この際の通気温
度は重要で一10℃以下の温度でなければならない。
Purification of silicon tetrafluoride gas is carried out by venting through a silica gel layer packed in a column or the like, but the venting temperature is important and must be below -10°C.

通気温度が低い程シロキサン類の除去率が高いが、四弗
化ケイ素の昇華温度は一95℃であるので、この温度以
下では操作が事実上困難である。従って通気温度は本発
明では、−10〜−95℃の範囲で実施される。通気時
の四弗化ケイ素の圧力はこれ寸た特に限定はなく、例え
ば1 ’rorr程度の真空から10気圧程度の加圧の
範囲で実施可能である。
The lower the ventilation temperature, the higher the removal rate of siloxanes, but since the sublimation temperature of silicon tetrafluoride is -95°C, it is practically difficult to operate below this temperature. Therefore, in the present invention, the ventilation temperature is set in the range of -10 to -95°C. The pressure of silicon tetrafluoride during ventilation is not particularly limited, and can be carried out within the range of, for example, a vacuum of about 1'rorr to an increased pressure of about 10 atm.

四弗化ケイ素ガス中のシロキサン類の給体的な混入量は
、シロキサン類の適当な定量法がないため算出がなかな
か困難であるが、精製の程度を検討するためには、カラ
ムへの通気の前後において、サンプルを100朋長さの
気体セルに採取して赤外吸収スペクトルを測定し、四弗
化ケイ素の5i−F振動に由来する2057cm”  
の吸収とシロキサン類の一種であるヘキサフルオロシロ
キサンの5i−F振動に由来する839Cm−’の吸収
比(R)を(1)式により求めることによって、精製の
程度を推し計ることで十分である。
Calculating the amount of siloxanes mixed into silicon tetrafluoride gas as a feedstock is difficult because there is no suitable quantitative method for siloxanes, but in order to examine the degree of purification, it is necessary to Before and after the sample was taken into a 100 mm long gas cell, the infrared absorption spectrum was measured, and the 2057 cm'' was derived from the 5i-F vibration of silicon tetrafluoride.
It is sufficient to estimate the degree of purification by calculating the absorption ratio (R) of 839Cm-' derived from the absorption of .

吸収1!dR)= l og (To/T□) 839
cm−1/log (To/T、) 2[157cm−
1・・・・(1) (発明の効果) 本発明はこの様に四弗化ケイ素中のシロキサン類を吸着
除去する方法において、吸着剤として安価なシリカゲル
を予め加熱により脱水処理した後、これに四弗化ケイ素
ガスを特定の条件下で通気すると言う極めて簡単な方法
で、シロキサン類を通気の当初から実質的に完全に除去
することを可能にしたものであり、アモルファスシリコ
ン薄膜やドライエツチング剤の原料となる高純度の四弗
化ケイ素の提供を可能としたものである。
Absorption 1! dR)=l og (To/T□) 839
cm-1/log (To/T,) 2[157cm-
1...(1) (Effects of the invention) The present invention provides a method for adsorbing and removing siloxanes from silicon tetrafluoride as described above. This is an extremely simple method in which silicon tetrafluoride gas is aerated under specific conditions, making it possible to virtually completely remove siloxanes from the beginning of aeration. This makes it possible to provide highly pure silicon tetrafluoride, which is the raw material for the agent.

もちろん初期吸着能は劣るが吸着容量の高い他の公知の
吸着剤と組み合わせ、本発明のシリカゲル層を第1層、
活性炭もしくは活性アルミナを第2層として直列に結合
してもよい。
Of course, the silica gel layer of the present invention is combined with other known adsorbents that have inferior initial adsorption capacity but high adsorption capacity, and the silica gel layer of the present invention is used as the first layer.
Activated carbon or activated alumina may be bonded in series as a second layer.

(実施例及び比較例) 以下実施例、比較例により本発明を具体的に説明する。(Example and comparative example) The present invention will be specifically explained below using Examples and Comparative Examples.

実施例1〜4 内径15m+mのステンレス製カラムに平均粒径2朋の
粒状シリカゲルを充填(充填高さ4Qcm)l。
Examples 1 to 4 A stainless steel column with an inner diameter of 15 m+m was filled with granular silica gel having an average particle size of 2 mm (packing height: 4 Q cm).

た後、シリカゲルの加熱による脱水処理と四弗化ケイ素
ガスの通気吸着処理を第1表に示す条件で行なった。通
気吸着処理前後の赤外吸収スペクトルの吸収比(旬は第
1表及び第2表に示す通り、通気の当初つ1す0.2 
t / meの流出ガスより高純度の四弗化ケイ素ガス
が得られることがわかる。またこの効果は少くとも4 
t / rrrlは持続することがわかる。
After that, dehydration treatment by heating the silica gel and aeration adsorption treatment of silicon tetrafluoride gas were performed under the conditions shown in Table 1. Absorption ratio of infrared absorption spectra before and after aeration adsorption treatment (as shown in Tables 1 and 2, the initial value of aeration is 0.2
It can be seen that silicon tetrafluoride gas of high purity can be obtained from the effluent gas of t/me. Moreover, this effect is at least 4
It can be seen that t/rrrl persists.

第1表 第2表 比較例1〜3 実施例と同一のシリカゲルを充填したカラムを使用し、
第6表に示す条件でシリカゲルの加熱による脱水処理と
四弗化ケイ素ガスの通気吸着処理を行った。結果を第6
表及び第4表に示すが、本発明で特定する条件で処理を
しなければシロキサン類の除去効果はその初期から不十
分であることが明らかである。
Table 1 Table 2 Comparative Examples 1 to 3 Using the same column packed with silica gel as in the example,
Dehydration treatment by heating silica gel and aeration and adsorption treatment of silicon tetrafluoride gas were performed under the conditions shown in Table 6. 6th result
As shown in Table and Table 4, it is clear that the removal effect of siloxanes is insufficient from the initial stage unless the treatment is carried out under the conditions specified in the present invention.

第6表 第4表 比較例4〜7 実施例と比較例1〜3に用いたシリカゲルに代え、第5
表に示す各吸着剤を充填したカラムを用い四弗化ケイ素
ガスの精製を試みた。カラムの形状、原料四弗化ケイ素
ガスは実施例と同じものを使用]−た。その結果は第6
表に示す通りであり、四弗化ケイ素ガス中のシロキサン
除去は通気初期(0,2t〜4t/ml)においていず
れも全く劣ることがわかった。
Table 6 Table 4 Comparative Examples 4 to 7 In place of the silica gel used in Examples and Comparative Examples 1 to 3,
An attempt was made to purify silicon tetrafluoride gas using columns packed with each adsorbent shown in the table. The shape of the column and the raw material silicon tetrafluoride gas were the same as in the examples. The result is the 6th
As shown in the table, it was found that the removal of siloxane from silicon tetrafluoride gas was completely inferior in all cases at the initial stage of aeration (0.2t to 4t/ml).

第6表Table 6

Claims (2)

【特許請求の範囲】[Claims] (1)予め加熱により脱水処理したシリカゲル層に、実
質的に水分の混入しない状態で温度−10℃〜−95℃
の範囲において四弗化ケイ素ガスを通気させることを特
徴とする四弗化ケイ素の精製法。
(1) A silica gel layer that has been dehydrated by heating in advance is heated at a temperature of -10°C to -95°C in a state where substantially no moisture is mixed.
1. A method for purifying silicon tetrafluoride, which comprises aerating silicon tetrafluoride gas in the range of .
(2)シリカゲルの加熱温度が150〜300℃である
ことを特徴とする特許請求の範囲第1項記載の方法。
(2) The method according to claim 1, wherein the heating temperature of the silica gel is 150 to 300°C.
JP28438285A 1985-12-19 1985-12-19 Purification of silicon tetrafluoride Granted JPS62143812A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28438285A JPS62143812A (en) 1985-12-19 1985-12-19 Purification of silicon tetrafluoride

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28438285A JPS62143812A (en) 1985-12-19 1985-12-19 Purification of silicon tetrafluoride

Publications (2)

Publication Number Publication Date
JPS62143812A true JPS62143812A (en) 1987-06-27
JPH0481523B2 JPH0481523B2 (en) 1992-12-24

Family

ID=17677859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28438285A Granted JPS62143812A (en) 1985-12-19 1985-12-19 Purification of silicon tetrafluoride

Country Status (1)

Country Link
JP (1) JPS62143812A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7666379B2 (en) 2001-07-16 2010-02-23 Voltaix, Inc. Process and apparatus for removing Bronsted acid impurities in binary halides

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7666379B2 (en) 2001-07-16 2010-02-23 Voltaix, Inc. Process and apparatus for removing Bronsted acid impurities in binary halides

Also Published As

Publication number Publication date
JPH0481523B2 (en) 1992-12-24

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