JPS62142851U - - Google Patents
Info
- Publication number
- JPS62142851U JPS62142851U JP1986031765U JP3176586U JPS62142851U JP S62142851 U JPS62142851 U JP S62142851U JP 1986031765 U JP1986031765 U JP 1986031765U JP 3176586 U JP3176586 U JP 3176586U JP S62142851 U JPS62142851 U JP S62142851U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- pad
- wiring
- surround
- come
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第1図は本考案の一実施例を示す平面図である
。
1…半導体ペレツト、2,2′,2″,2…
ボンデイングパツド、3,3′,3″,3…内
部配線、4,4′,4″…本考案による配線、5
,5′,5″,5…ボンデイングワイヤー。
FIG. 1 is a plan view showing an embodiment of the present invention. 1... Semiconductor pellet, 2, 2', 2'', 2...
Bonding pad, 3, 3', 3'', 3...internal wiring, 4, 4', 4''...wiring according to the present invention, 5
, 5', 5'', 5...bonding wire.
Claims (1)
囲を内部配線と接触しないように取り囲むように
配置された配線の一端が、他のボンデイングパツ
ドに接続されていることを特徴とする半導体装置
。 A semiconductor device characterized in that one end of a wiring arranged close to a bonding pad so as to surround the pad so as not to come into contact with internal wiring is connected to another bonding pad.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986031765U JPS62142851U (en) | 1986-03-04 | 1986-03-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986031765U JPS62142851U (en) | 1986-03-04 | 1986-03-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62142851U true JPS62142851U (en) | 1987-09-09 |
Family
ID=30837801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986031765U Pending JPS62142851U (en) | 1986-03-04 | 1986-03-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62142851U (en) |
-
1986
- 1986-03-04 JP JP1986031765U patent/JPS62142851U/ja active Pending