JPH01118455U - - Google Patents

Info

Publication number
JPH01118455U
JPH01118455U JP1988014299U JP1429988U JPH01118455U JP H01118455 U JPH01118455 U JP H01118455U JP 1988014299 U JP1988014299 U JP 1988014299U JP 1429988 U JP1429988 U JP 1429988U JP H01118455 U JPH01118455 U JP H01118455U
Authority
JP
Japan
Prior art keywords
width
outer lead
package
root
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988014299U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988014299U priority Critical patent/JPH01118455U/ja
Publication of JPH01118455U publication Critical patent/JPH01118455U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図はそれぞれ本考案の第1及び
第2の実施例の側面図、第3図は従来のパツケー
ジの一例の側面図である。 A……ケース、B,B′,B″……リード。
1 and 2 are side views of the first and second embodiments of the present invention, respectively, and FIG. 3 is a side view of an example of a conventional package. A...Case, B, B', B''...Lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チツプ封入用のケースに固定されたリー
ドのアウターリードの先端部と根元近傍部との幅
が異なる半導体装置用のパツケージにおいて、前
記アウターリードの幅が前記先端部から前記根元
近傍部へ連線的に変化していることを特徴とする
パツケージ。
In a package for a semiconductor device, in which the width of the outer lead of a lead fixed to a case for encapsulating a semiconductor chip is different from the width of the tip of the outer lead to the portion near the root, the width of the outer lead is a continuous line from the tip to the portion near the root. A package that is characterized by its unique changes.
JP1988014299U 1988-02-04 1988-02-04 Pending JPH01118455U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988014299U JPH01118455U (en) 1988-02-04 1988-02-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988014299U JPH01118455U (en) 1988-02-04 1988-02-04

Publications (1)

Publication Number Publication Date
JPH01118455U true JPH01118455U (en) 1989-08-10

Family

ID=31225375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988014299U Pending JPH01118455U (en) 1988-02-04 1988-02-04

Country Status (1)

Country Link
JP (1) JPH01118455U (en)

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