JPS62142397A - Printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] (a) Production! FIELD OF APPLICATION This invention relates to a printed circuit board, and more particularly to an improvement in a printed wiring board having a plurality of conductive pattern layers.

<Ron's Conventional Techniques j Conventionally, printed wiring boards with multiple conductive pattern layers have conductive pattern layers formed on both the upper and lower surfaces of the board, and the conductivity of the conductive pattern layers is connected to a through hole in a predetermined area. It is electrically connected to the

(c) Problems to be Solved by the Invention However, the above printed circuit board 1 has a problem in that forming through balls is extremely time consuming.

That is, when forming the conductive portion of the inner wall of the through hole with copper plating, the through hole is drilled in a predetermined portion of the board in advance, but this operation is complicated and requires a lot of time.

Moreover, when the board is paper-based, corner cracks may occur in the through ball due to the heat during soldering, and moisture that has been absorbed by the paper base material will crumble and create blowholes, resulting in poor conductivity. There was a problem that the electrical connection between the parts could be broken. The present invention has been made in view of the above-mentioned disadvantages, and provides a wiring root 1 through which electrical connection between conductive pattern layers can be easily and reliably performed.

(d) Means for solving the problem In this invention, predetermined portions of each of conductive pattern layers laminated via an insulating adhesive layer are connected via a conductive Jf adhesive. .

The detailed structure is such that a conductive pattern material of a predetermined shape is formed on one side of the substrate, and a conductive pattern layer is further laminated and fixed at a predetermined location on the conductive pattern layer via an insulating adhesive layer. This is a printed wiring board in which a 4' adhesive layer is interposed between predetermined portions of each of the two conductive pattern layers.

(e) Function 1.1 The conductive pattern layer located on one side of the temporary surface is electrically connected at a predetermined portion connected via a conductive adhesive.

Embodiments This invention will be described in detail with reference to embodiments shown in FIGS. 1 to 7, but the invention is not limited thereby.

The printed wiring board (100) is a paper base material (1) with a substrate C.
A conductive pattern layer (2) of copper foil having a predetermined shape is formed on one side of the conductive layer. A second conductive pattern layer (4) of copper foil is fixed to a predetermined position on the conductive pattern layer (2) via an insulating adhesive layer (3) as a vX layer. Furthermore, a conductive adhesive layer (5) is interposed between predetermined portions of both conductive patterns (2) (41) to be electrically connected.

Note that (6) is a solder resist that covers the upper surfaces of the second conductive pattern layer (4) and the insulating adhesive layer (3).

The method for manufacturing this printed wiring board (1oo) will be explained below.

Using material (1), a tit J with copper iC2Ql bonded to one side is pulled (see Figure 2).

Copper on paper base material (1)
(See Figure 3).

The conductive pattern layer (2) and the side on which the conductive pattern layer (2) is formed, except for a predetermined portion of the first conductive pattern layer (2) that should be connected to the second conductive pattern layer (4). An insulating adhesive layer (3) is formed on the surface of the paper base material (1) by printing and coating (see FIG. 4).

Iζ without forming the insulating adhesive layer (3) in the above process
A conductive pattern layer (2), that is, a predetermined portion of the first conductive pattern to be connected to the second conductive pattern layer (4), is coated with a conductive adhesive layer (5) by printing and coating.
) (see Figure 5).

Insulating layer 1, adhesive layer t3) a3 and conductive adhesive layer (5
) Laminate copper foil on top (see Figure 6).

By removing unnecessary portions from the steel foil piece by etching, a conductive pattern layer (4) of a predetermined shape is formed (see FIG. 7).

No<1 electric pattern (4113 and insulating adhesive layer (3
19).) By applying a tungsten resist (6) on the top of the wiring board (<100), apply a layer of 19.

H of ξ, light cylinder wiring board (100) does not close the through holes, and the conductive pattern layer +21 (4) is electrically connected to each other at a predetermined location? A 1″U electrical connection is made via the 1-layer (5).

11, in the above example, rttLl material (1; I provisional)
Two 4th pattern layers are laminated on one side of the paper, but conductive patterns 1st and 1st are layered on both sides of the paper (i, board). Further, the conductive pattern layer may be laminated to a thickness of 3 Pfi or more, if desired.

(g) Effects of the Invention The present invention provides a printed wiring board in which the electrical connection between conductive pattern layers is simple and reliable.

[Brief explanation of drawings]

FIG. 1 is a configuration explanatory diagram showing one embodiment of the present invention, and FIG.
``Figure 7 is a configuration explanatory diagram without showing the manufacturing process. (100)...Printed wiring board, (1)...
...paper material (substrate), +2) conductive pattern layer,
(3)...Insulating adhesive layer, (4)...
- Conductive pattern sound, (5)... Conductive adhesive layer, (6)... Tsulter resist. Figure 2 Figure 5 Figure 6

Claims (1)

[Claims] 1. A conductive pattern layer with a predetermined shape is formed on one side of the substrate, and a conductive pattern layer is further laminated and fixed at a predetermined portion on the conductive pattern layer via an insulating adhesive layer,
The printed wiring board further comprises a conductive adhesive layer interposed between predetermined portions of each of the conductive pattern layers.