JPS62140758U - - Google Patents

Info

Publication number
JPS62140758U
JPS62140758U JP1986028668U JP2866886U JPS62140758U JP S62140758 U JPS62140758 U JP S62140758U JP 1986028668 U JP1986028668 U JP 1986028668U JP 2866886 U JP2866886 U JP 2866886U JP S62140758 U JPS62140758 U JP S62140758U
Authority
JP
Japan
Prior art keywords
synthetic resin
emitting diode
light emitting
hole
lead part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986028668U
Other languages
English (en)
Other versions
JPH0429580Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986028668U priority Critical patent/JPH0429580Y2/ja
Publication of JPS62140758U publication Critical patent/JPS62140758U/ja
Application granted granted Critical
Publication of JPH0429580Y2 publication Critical patent/JPH0429580Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の発光ダイオードの実施例を
示す水平断面図、第２図は第１図に示した発光ダ
イオードの―線断面図、第３図は従来の発光
ダイオードの実施例を示す水平断面図、第４図は
第３図に示した発光ダイオードの―線断面図
、第５図は第３図に示した発光ダイオードにホー
ミング加工した最終的な製品に生じた欠陥を表わ
す断面図である。 ２，４…リード部、１２…外装、１６，１８，
２０，２２…貫通孔。

Claims (1)

    【実用新案登録請求の範囲】
  1. 透光性を持つ合成樹脂によつて外装を施す発光
    ダイオードにおいて、リード部の前記合成樹脂内
    に埋め込まれる部分に貫通孔を形成し、この貫通
    孔を通してリード部の表裏面間に前記合成樹脂を
    短絡させてなることを特徴とする発光ダイオード
    。
JP1986028668U 1986-02-28 1986-02-28 Expired JPH0429580Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986028668U JPH0429580Y2 (ja) 1986-02-28 1986-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986028668U JPH0429580Y2 (ja) 1986-02-28 1986-02-28

Publications (2)

Publication Number Publication Date
JPS62140758U true JPS62140758U (ja) 1987-09-05
JPH0429580Y2 JPH0429580Y2 (ja) 1992-07-17

Family

ID=30831851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986028668U Expired JPH0429580Y2 (ja) 1986-02-28 1986-02-28

Country Status (1)

Country Link
JP (1) JPH0429580Y2 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374005A (ja) * 2001-04-10 2002-12-26 Toshiba Corp 光半導体装置
JP2004014857A (ja) * 2002-06-07 2004-01-15 Stanley Electric Co Ltd チップタイプ光半導体素子
JP2010171060A (ja) * 2009-01-20 2010-08-05 Fuji Electric Fa Components & Systems Co Ltd 樹脂封止形デバイスのリードフレーム
JP2011505689A (ja) * 2007-12-03 2011-02-24 ソウル セミコンダクター カンパニー リミテッド スリム型ｌｅｄパッケージ
JP2011060801A (ja) * 2009-09-07 2011-03-24 Nichia Corp 発光装置及びその製造方法
JP2011138849A (ja) * 2009-12-28 2011-07-14 Nichia Corp 発光装置およびその製造方法
WO2014030530A1 (ja) * 2012-08-23 2014-02-27 三菱樹脂株式会社 発光装置用パッケージ及び発光装置
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
EP1399978B1 (de) * 2001-06-29 2015-06-24 OSRAM Opto Semiconductors GmbH Oberflächenmontierbares strahlungsemittierendes bauelement
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374005A (ja) * 2001-04-10 2002-12-26 Toshiba Corp 光半導体装置
EP1399978B1 (de) * 2001-06-29 2015-06-24 OSRAM Opto Semiconductors GmbH Oberflächenmontierbares strahlungsemittierendes bauelement
JP2004014857A (ja) * 2002-06-07 2004-01-15 Stanley Electric Co Ltd チップタイプ光半導体素子
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
JP2011505689A (ja) * 2007-12-03 2011-02-24 ソウル セミコンダクター カンパニー リミテッド スリム型ｌｅｄパッケージ
JP2010171060A (ja) * 2009-01-20 2010-08-05 Fuji Electric Fa Components & Systems Co Ltd 樹脂封止形デバイスのリードフレーム
JP2011060801A (ja) * 2009-09-07 2011-03-24 Nichia Corp 発光装置及びその製造方法
JP2011138849A (ja) * 2009-12-28 2011-07-14 Nichia Corp 発光装置およびその製造方法
WO2014030530A1 (ja) * 2012-08-23 2014-02-27 三菱樹脂株式会社 発光装置用パッケージ及び発光装置
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate

Also Published As

Publication number Publication date
JPH0429580Y2 (ja) 1992-07-17

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