JPS62140746U - - Google Patents

Info

Publication number

JPS62140746U

JPS62140746U JP2771086U JP2771086U JPS62140746U JP S62140746 U JPS62140746 U JP S62140746U JP 2771086 U JP2771086 U JP 2771086U JP 2771086 U JP2771086 U JP 2771086U JP S62140746 U JPS62140746 U JP S62140746U

Authority

JP

Japan

Prior art keywords

resin

sealed

portions

sealing resin

integrated circuit

Prior art date

1986-02-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229920005989 resin Polymers 0.000 claims description 4
• 239000011347 resin Substances 0.000 claims description 4
• 239000004065 semiconductor Substances 0.000 claims description 4
• 238000007789 sealing Methods 0.000 claims 2
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 230000008646 thermal stress Effects 0.000 description 1