JPS62139900A - Electrolytic plating device - Google Patents

Abstract

PURPOSE:To enable good plating operation by circulating an electrolytic plating liquid between a main plating cell and pseudo plating cell having a pseudo cathode and connecting the electrodes to a DC power source in such a manner that the respective cathode current densities vary, thereby removing impurity metallic ions. CONSTITUTION:The same plating liquid 2 is filled in the main plating cell 1 set with an anode 4 consisting of Ni, etc. and a metallic 5 to be plated which is a cathode and the pseudo plating cell 8 having an anode 10 consisting of Ni, etc., and the pseudo cathode 11 which is a corrugated sheet made of a steel. The cells are connected by pipings 15, 27 having plating liquid circulators 13, 16. The anode 4 and cathode 5 are connected to the DC power source 18 and the material 5 is subjected to plating of Ni, etc. On the other hand, another DC power source 18 is connected to the anode 10 and the pseudo cathode 11 and the impurity metallic ions in the plating liquid 18 are deposited on the cathode 11 at the cathode current density difference from the cathode current density of the cathode 5 and are thereby removed. The plating liquid 2 is circulated between the two calls by the circulators 13, 16 and further the undissolved metals or dissolved impurity org. materials are preferably removed by a filter 14. The normal plating is thus deposited on the material 5.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an improvement in a plating apparatus, particularly an electrolytic plating apparatus used in an electroforming method.

(Prior art) Plating can coat the surface of inexpensive metals with other metals to give them superior properties, and it also allows for precise shape reproduction by covering the surface of articles closely. decoration,
Corrosion Prevention 1 It is used for surface hardening, electroforming, and many other purposes, but in order for plating to be successful and high-quality metal to be deposited on the surface of the article, good management of the plating solution at the plating work site is an important factor. becomes.

In other words, if impure metal ions other than the desired metal are mixed into the plating solution, roughness, pinholes, uneven gloss, etc. will occur on the plating surface, and phenomena such as embrittlement of the deposited metal will occur, resulting in poor quality of the plated product. cannot be obtained.

Therefore, field workers pay sufficient attention to the management of plating, but impure metal ions enter from all routes and it is extremely difficult to completely prevent this.

Therefore, in reality, plating work is stopped at regular intervals or whenever a defect occurs, and a conductive flat plate or corrugated plate is installed in the plating tank to remove the problematic metal ions from the original plating process. Electrolytic deposition and removal work was carried out at a current density lower or higher than the current density used in the conventional method.

However, this work requires time and effort to switch and remove the plated object and the conductive plate, etc.
This is a very difficult task, especially when one plating operation requires a long period of 3 to 30 days, such as electroforming.

(Problems to be Solved by the Invention) The present invention has focused on this actual situation, and removes impure metal ions from the plating solution during plating work or during work breaks, thereby making it easier to manage the plating solution and always keeping it at the highest level. An object of the present invention is to provide electrolytic plating 'AM' which enables plating work to be performed in the above conditions and which enables plating of good quality.

(Means for Solving the Problems) Therefore, the feature of the present invention, which is compatible with the above-mentioned object and solves the problems, is that the first invention is characterized in that the same electrolytic plating solution is used. The primary plating tank includes a main plating tank and at least one pseudo plating tank, which are connected to each other by piping, as well as at least one DC power supply and a plating solution circulation device. ,
An anode plate and a pseudo cathode plate are each immersed in a pseudo plating tank, and a DC power supply is applied to each tank's anode plate, the object to be plated as a cathode, and the pseudo cathode plate. The second invention is a simpler device in which at least one anode plate is connected in a plating bath filled with an electrolytic plating solution, and
The object to be plated as a cathode and a pseudo cathode plate are immersed, and a DC power supply is connected to the anode plate and the cathode plate in the tank so that the cathode current densities of the two are different.

Here, the difference in cathode current density means that there are high and low densities, and which one is higher or lower depends on the combination of the plating solution and impure metal, and is not necessarily specified. .

(Function) In each of the devices of the present invention as described above, electrodes other than those used for the original plating are immersed in a plating bath, and weak electrolysis or strong electrolysis is performed at different cathode current densities, respectively, to form a plating solution. It removes impure metal ions in
The first invention provides a pseudo plating tank separate from the plating tank, and deposits plating on the object to be plated while circulating the plating solution for both plating calibrations in a plating solution circulation device. Impure metals in the plating solution are continuously removed by performing weak or strong electrolysis in a bath.

On the other hand, the second invention performs the same action by directly immersing the electrode in the plating bath.

(Examples) Specific examples of the present invention will be further described below, but it goes without saying that the present invention is not limited to the numerical values and materials in the following examples.

FIG. 1 shows the first aspect of the present invention, which is applied to bright nickel plating using a Watt bath. In FIG. 1, (1) is a plating tank made of rubber-lined steel plate, and has the following composition, for example: nickel sulfate 350 g/(1 nickel chloride 7 Q g/i2 boric acid)
The titanium basket (3) is filled with a nickel plating solution (2) having a composition (Watt bath) consisting of 30 g/II brightener 2 g/i2 bit inhibitor 0.1 g/β. The plated nickel anode (4) is immersed therein, and the cathode to be plated (5) is suspended and held by a hook (6), and a heater (7) is inserted to maintain the temperature of the liquid. There is.

On the other hand, (8) is a pseudo plating tank made of rubber-lined steel plate, filled with a plating solution having the same composition as the above, and the plating solution (2) contains a polypropylene anode bathog (9
) inserted into a nickel anode (l[I+ and bending angle 90
A steel corrugated plate (11) with a wave length of 100 *v is suspended and immersed in a steel hook (12).

The main plating tank (11) and the pseudo-plating tank (8) have a feed pipe (15) having a plating solution circulation device (13) such as a pump and a filter (14) in the middle, and a plating solution circulation device such as a pump in the middle. Return pipe (27) with device (16)
) are connected to each other so that the plating solution can be exchanged.

Therefore, in the above configuration, both the plating baths are provided with DC currents m (17) and (18), respectively.
The anode and cathode of the main plating tank (11 side direct/N, electric tx (17)) are the nickel anode (1) of the ball plating tank (1), respectively.
4) and the cathode to be plated (5) has a cathode current density of 2.
．． On the other hand, the anode and cathode of the DC power supply (18) on the side of the pseudo plating tank (8) are connected to the nickel anode QOI of the pseudo plating tank (8) and the corrugated plate (11). The cathode current density is adjusted and connected to a value different from the current density of the cathode to be plated (5) on the side of the main plating tank (1), for example, 0.2 A to 0.3 A/dm2.

Therefore, in plating H as described above, the temperature of the solution is kept approximately constant using the heater (7), and the plating solution circulation device (13) (
16) and circulating the plating solution between both tanks (11 (81), the anode (4) 0Ω and cathode (51 (11) of the main plating tank (1) and pseudo plating tank (8) are energized. Impure metal ions can be removed in the other pseudo plating tank (8) while normal plating is deposited on the object to be plated (5), which is one of the cathodes.
) can also remove undissolved metal, allowing for better plating work.

Particularly in this case, if an activated carbon filter is used as the filter, dissolved impurity organic matter can also be removed, which is more effective.

Further, depending on the condition of the plating solution, only the plating work or only the removal work of impure metal ions can be performed.

The cathode current density of the pseudo plating tank (8) in the present invention is selected depending on the plating solution and the type of impure metal, but in this example, the impure metal is mainly copper or metal cadmium. The one that fits the case is used.

Other than this, for example, in the case of iron, zinc, etc., it is 0.2A to 0.
Approximately 5 A/dm2 is suitable.

Further, depending on the combination of plating solution and impure metal, the cathode current density of the pseudo plating bath may have to be higher than the cathode current density of the object to be plated.

Note that the number of pseudo-plating tanks is not limited to one, but it is also possible to install several tanks and set different cathode current densities to successively remove several types of impure metals.

In addition, in the above embodiment, the royal plating tank +11 and the pseudo plating tank (
8) Two plating solution circulation devices (13) (16)
If the conditions of the installation location of this equipment permit, the main plating tank and the pseudo plating tank should be installed at different heights to create a gravity difference and use the pulp operation to circulate the plating solution. Alternatively, it is also possible to circulate the plating solution using an overflow pipe and omit one of the plating solution circulation devices.

Furthermore, by connecting one pseudo plating tank in parallel to multiple main plating tanks and switching the piping, one pseudo plating tank can cover the work of removing impure metals. pump.

It is also industrially advantageous to make the filter and piping into a unit and make it portable so that it can accommodate a large number of main plating tanks.

FIG. 2 shows an example of electrolytic plating HK according to the second aspect of the present invention in contrast to the above embodiment.

In the figure, (19) is an electrolytic plating tank made of rubber-lined steel plate, and has the same composition as in the previous example. &,
(20) is filled, a large number of titanium baskets (21A) (21B)... are inserted into the /& (20), and Nisokel anodes (22A) (22B)... and the object to be plated as a cathode are filled. (23) and a steel corrugated plate (2
4) are respectively immersed using hanging fittings (not shown).

Then, the anode and cathode of the DC power supply (25) are applied to the nickel anode (22A) and cathode to be plated (23) in the plating tank (19), respectively, at a cathode current density of 2.5A to 5A/2.
d m2 and also the anode of the DC power supply (26).

The cathode is a nickel anode (21B) and a corrugated plate (21B) as a cathode, respectively.
24), the cathode current density was adjusted to O, LA/dm''.

By supplying electricity to both of these electrodes, plating is deposited on the object to be plated (23), and the corrugated plate (23) serving as a pseudo cathode is deposited.
In 4), the fact that impure metals are deposited is the same as that described in the previous example.

(Effects of the Invention) The electrolytic plating apparatus of the present invention has the above-mentioned configuration, and the pseudo cathode is immersed in the plating solution, and plating can be performed not only during suspension of plating work but also during plating work while continuing plating work. Impure metal ions in the plating solution can be precipitated and removed, making it easy to manage impure metal ions in the plating solution.
Moreover, it has the effect of making it possible to perform plating work quickly and always with a good plating solution, and producing high-quality plating by precipitation.

In particular, in the case of electroforming, the plating operation cannot be stopped even for a moment for a long period of time, so the effect of using the electrolytic plating of the present invention is extremely large.

Moreover, the first invention is divided into a main plating tank and a pseudo-plating tank, and the plating deposit part and the impure metal deposit part are completely separated, so workability is high, and the anode of the pseudo-plating tank is When operating the pseudo cathode, it has the advantage of not having any adverse effects on the object to be plated, and furthermore, by using a filter, it is possible to remove insoluble metals etc. from the plating solution at the same time. In addition, if an activated carbon filter is used, it is possible to remove impurities.

Furthermore, by using parallel piping or unitizing the pseudo plating tanks, it is possible to manage the plating solution for a large number of main plating tanks.

Furthermore, the plating apparatus of the second invention has a particularly simple structure and is extremely useful industrially.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of an electrolytic plating apparatus according to a first aspect of the present invention, and FIG. 2 is a schematic plan view of an electrolytic plating apparatus according to a second aspect of the present invention. (1)... King plating tank, (2)... Plating solution. (4) (10) ...Nickel anode. (5)...An object to be plated as a cathode. (8)...pseudo plating tank, (11)...pseudo cathode. (13) (16)...Plating solution circulation device. (14)...Filter, (15)...Piping. (17) (1B)...DC power supply, (19)
...Plating tank. (20)...7 nights of plating, (228) (22B)
···nickel. (23)...An object to be plated as a cathode. (24)...pseudo cathode, (25) (26)
...DC power supply.

Claims (1)

[Claims] 1. A main plating tank and at least one pseudo plating tank filled with the same electrolytic plating solution and connected to each other by piping, and a plating tank disposed between at least one DC power supply and both of the plating tanks. It consists of a liquid circulation device, and inside the main plating tank,
On the other hand, the anode plate and the pseudo-cathode plate are respectively immersed and held in a pseudo plating tank, and the DC power supply is connected to the anode plate and the cathode of the respective tank, An electrolytic plating apparatus characterized in that a main plating tank and a pseudo plating tank are connected to a pseudo cathode plate so that cathode current densities of the main plating tank and the pseudo plating tank are different. 2. The electrolytic plating apparatus according to claim 1, wherein the plating solution circulation device has a filter in the middle. 3. Claim 1 or 2 in which the cathode plate is a corrugated plate
The electrolytic plating apparatus described in Section 1. 4. At least one anode plate, the object to be plated as a cathode, and a pseudo cathode plate are immersed and held in a plating tank filled with an electrolytic plating solution, and the anode plate, the object to be plated as a cathode, and the pseudo cathode plate are held in the tank. An electrolytic plating apparatus characterized in that a DC power source is connected to the plate so that the cathode current densities of the two plates are different. 5. The electrolytic plating apparatus according to claim 4, wherein the pseudo cathode plate is a corrugated plate.