JPS62135448U - - Google Patents
Info
- Publication number
- JPS62135448U JPS62135448U JP2396386U JP2396386U JPS62135448U JP S62135448 U JPS62135448 U JP S62135448U JP 2396386 U JP2396386 U JP 2396386U JP 2396386 U JP2396386 U JP 2396386U JP S62135448 U JPS62135448 U JP S62135448U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- view
- sectional
- terminals
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2396386U JPS62135448U (US20020125480A1-20020912-P00900.png) | 1986-02-21 | 1986-02-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2396386U JPS62135448U (US20020125480A1-20020912-P00900.png) | 1986-02-21 | 1986-02-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62135448U true JPS62135448U (US20020125480A1-20020912-P00900.png) | 1987-08-26 |
Family
ID=30822757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2396386U Pending JPS62135448U (US20020125480A1-20020912-P00900.png) | 1986-02-21 | 1986-02-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62135448U (US20020125480A1-20020912-P00900.png) |
-
1986
- 1986-02-21 JP JP2396386U patent/JPS62135448U/ja active Pending