JPS62134255U - - Google Patents

Info

Publication number
JPS62134255U
JPS62134255U JP1986021361U JP2136186U JPS62134255U JP S62134255 U JPS62134255 U JP S62134255U JP 1986021361 U JP1986021361 U JP 1986021361U JP 2136186 U JP2136186 U JP 2136186U JP S62134255 U JPS62134255 U JP S62134255U
Authority
JP
Japan
Prior art keywords
semiconductor circuit
terminals
power supply
lead
mounting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986021361U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986021361U priority Critical patent/JPS62134255U/ja
Priority to KR1019860700725A priority patent/KR940006585B1/ko
Priority to PCT/JP1986/000106 priority patent/WO1986005322A1/ja
Priority to DE8686901518T priority patent/DE3680265D1/de
Priority to EP86901518A priority patent/EP0214307B1/de
Publication of JPS62134255U publication Critical patent/JPS62134255U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1986021361U 1985-02-28 1986-02-17 Pending JPS62134255U (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1986021361U JPS62134255U (de) 1986-02-17 1986-02-17
KR1019860700725A KR940006585B1 (ko) 1985-02-28 1986-02-28 반도체 회로장치
PCT/JP1986/000106 WO1986005322A1 (en) 1985-02-28 1986-02-28 Semiconducteur circuit device
DE8686901518T DE3680265D1 (de) 1985-02-28 1986-02-28 Halbleiterschaltungsanordnung.
EP86901518A EP0214307B1 (de) 1985-02-28 1986-02-28 Halbleiterschaltungsanordnung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986021361U JPS62134255U (de) 1986-02-17 1986-02-17

Publications (1)

Publication Number Publication Date
JPS62134255U true JPS62134255U (de) 1987-08-24

Family

ID=30817735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986021361U Pending JPS62134255U (de) 1985-02-28 1986-02-17

Country Status (1)

Country Link
JP (1) JPS62134255U (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01295429A (ja) * 1988-05-24 1989-11-29 Toshiba Corp 半導体集積回路

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571030A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Mounting system for semiconductor device
JPS6018944A (ja) * 1983-07-12 1985-01-31 Nec Ic Microcomput Syst Ltd 半導体集積回路装置のリ−ドフレ−ム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571030A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Mounting system for semiconductor device
JPS6018944A (ja) * 1983-07-12 1985-01-31 Nec Ic Microcomput Syst Ltd 半導体集積回路装置のリ−ドフレ−ム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01295429A (ja) * 1988-05-24 1989-11-29 Toshiba Corp 半導体集積回路

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