JPS62133099A - 非導電性物質の表面に導電性金属層を電気メツキする方法 - Google Patents

非導電性物質の表面に導電性金属層を電気メツキする方法

Info

Publication number
JPS62133099A
JPS62133099A JP61081249A JP8124986A JPS62133099A JP S62133099 A JPS62133099 A JP S62133099A JP 61081249 A JP61081249 A JP 61081249A JP 8124986 A JP8124986 A JP 8124986A JP S62133099 A JPS62133099 A JP S62133099A
Authority
JP
Japan
Prior art keywords
dispersion
carbon black
conductive
hydroxide
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61081249A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0314914B2 (enExample
Inventor
カール・レナード・ミンテン
ガリーナ・ピスメンナヤ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philip A Hunt Chemical Corp
Original Assignee
Philip A Hunt Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philip A Hunt Chemical Corp filed Critical Philip A Hunt Chemical Corp
Publication of JPS62133099A publication Critical patent/JPS62133099A/ja
Publication of JPH0314914B2 publication Critical patent/JPH0314914B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP61081249A 1985-04-11 1986-04-10 非導電性物質の表面に導電性金属層を電気メツキする方法 Granted JPS62133099A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US72196485A 1985-04-11 1985-04-11
US721964 1985-04-11
US802892 1985-11-29

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2131324A Division JPH0665755B2 (ja) 1985-04-11 1990-05-23 金属メツキを増強するのに適する分散液

Publications (2)

Publication Number Publication Date
JPS62133099A true JPS62133099A (ja) 1987-06-16
JPH0314914B2 JPH0314914B2 (enExample) 1991-02-27

Family

ID=24899982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61081249A Granted JPS62133099A (ja) 1985-04-11 1986-04-10 非導電性物質の表面に導電性金属層を電気メツキする方法

Country Status (1)

Country Link
JP (1) JPS62133099A (enExample)

Also Published As

Publication number Publication date
JPH0314914B2 (enExample) 1991-02-27

Similar Documents

Publication Publication Date Title
EP0200398B1 (en) Process for preparing a non-conductive substrate for electroplating
US4684560A (en) Printed wiring board having carbon black-coated through holes
US4724005A (en) Liquid carbon black dispersion
EP0244535B1 (en) Improved electroless plating process
US4622108A (en) Process for preparing the through hole walls of a printed wiring board for electroplating
US5139642A (en) Process for preparing a nonconductive substrate for electroplating
US4622107A (en) Process for preparing the through hole walls of a printed wiring board for electroplating
US4897164A (en) Process for preparing the through hole walls of a printed wiring board for electroplating
US5015339A (en) Process for preparing nonconductive substrates
US4718993A (en) Process for preparing the through hole walls of a printed wiring board for electroplating
US4874477A (en) Process for preparing the through hole walls of a printed wiring board for electroplating
US5536386A (en) Process for preparing a non-conductive substrate for electroplating
US4964959A (en) Process for preparing a nonconductive substrate for electroplating
US5110355A (en) Process for preparing nonconductive substrates
US5106537A (en) Liquid dispersion for enhancing the electroplating of a non-conductive surface
US4994153A (en) Process for preparing nonconductive substrates
US5759378A (en) Process for preparing a non-conductive substrate for electroplating
US5674372A (en) Process for preparing a non-conductive substrate for electroplating
JPS62133099A (ja) 非導電性物質の表面に導電性金属層を電気メツキする方法
JPH03207890A (ja) 金属メツキを増強するのに適する分散液

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term