JPS62131453U - - Google Patents
Info
- Publication number
- JPS62131453U JPS62131453U JP1986016824U JP1682486U JPS62131453U JP S62131453 U JPS62131453 U JP S62131453U JP 1986016824 U JP1986016824 U JP 1986016824U JP 1682486 U JP1682486 U JP 1682486U JP S62131453 U JPS62131453 U JP S62131453U
- Authority
- JP
- Japan
- Prior art keywords
- pedestal
- silicon
- pressure sensor
- fixed
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986016824U JPS62131453U (no) | 1986-02-10 | 1986-02-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986016824U JPS62131453U (no) | 1986-02-10 | 1986-02-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62131453U true JPS62131453U (no) | 1987-08-19 |
Family
ID=30809026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986016824U Pending JPS62131453U (no) | 1986-02-10 | 1986-02-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62131453U (no) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000506261A (ja) * | 1996-02-27 | 2000-05-23 | ニフォテク・アーエス | 圧力センサ |
JP2007253323A (ja) * | 2006-03-24 | 2007-10-04 | Infineon Technologies Sensonor As | Mems構造用の一体化した台座マウント |
-
1986
- 1986-02-10 JP JP1986016824U patent/JPS62131453U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000506261A (ja) * | 1996-02-27 | 2000-05-23 | ニフォテク・アーエス | 圧力センサ |
JP2007253323A (ja) * | 2006-03-24 | 2007-10-04 | Infineon Technologies Sensonor As | Mems構造用の一体化した台座マウント |