JPS62124842A - Machine tool of table tilt correction type - Google Patents
Machine tool of table tilt correction typeInfo
- Publication number
- JPS62124842A JPS62124842A JP26505585A JP26505585A JPS62124842A JP S62124842 A JPS62124842 A JP S62124842A JP 26505585 A JP26505585 A JP 26505585A JP 26505585 A JP26505585 A JP 26505585A JP S62124842 A JPS62124842 A JP S62124842A
- Authority
- JP
- Japan
- Prior art keywords
- inclination
- machine tool
- workpiece
- reference plane
- correction type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012937 correction Methods 0.000 title claims description 7
- 238000005259 measurement Methods 0.000 claims abstract description 15
- 238000006073 displacement reaction Methods 0.000 claims abstract description 6
- 238000012545 processing Methods 0.000 claims description 13
- 238000003754 machining Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 1
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- YTAHJIFKAKIKAV-XNMGPUDCSA-N [(1R)-3-morpholin-4-yl-1-phenylpropyl] N-[(3S)-2-oxo-5-phenyl-1,3-dihydro-1,4-benzodiazepin-3-yl]carbamate Chemical compound O=C1[C@H](N=C(C2=C(N1)C=CC=C2)C1=CC=CC=C1)NC(O[C@H](CCN1CCOCC1)C1=CC=CC=C1)=O YTAHJIFKAKIKAV-XNMGPUDCSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
- B23Q1/34—Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は１例えばシリコンダイオード上に構成された微
小電極の面を基板と平行に加工する場合などのように、
基準面を有する被加工物を該基準面と平行に加工する工
作機械に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to 1, for example, when processing the surface of a microelectrode formed on a silicon diode parallel to a substrate.
The present invention relates to a machine tool that processes a workpiece having a reference surface parallel to the reference surface.
従来、被加工物の微小部分を、該被加工物の基準面と平
行に加工する工作機械において、上記の平行度を向上さ
せるには、基準面の精度を上げることと、加工面の精度
を上げることとの両面において、それぞれ個別に工夫さ
れていた。Conventionally, in machine tools that machine minute parts of the workpiece parallel to the reference plane of the workpiece, in order to improve the above-mentioned parallelism, it is necessary to increase the precision of the reference plane and the precision of the machined surface. Each of them was individually devised in terms of both raising and raising the bar.
基準面の精度と加工面の精度とを極限的に向上させても
誤差を完全に零とすることは現段階の技術では不可能で
ある。Even if the precision of the reference surface and the precision of the machined surface are improved to the utmost, it is impossible to completely eliminate the error with the current state of technology.
而して、［基準面に対する加工面の平行度」という観点
から見れば、基準面誤差と加工面誤差とが相加されて現
われることになる。上記の相加とはベクトル和の意味で
あるから、偶然に打ち消されることもあり、重なり合っ
て大きくなることもある。しかし１品質管理の面からこ
れを見るとき、偶然に打ち消し合うことは期待できず、
最悪に重なり合う場合を想定して対処しなければならな
い。Therefore, from the viewpoint of [parallelism of the processed surface with respect to the reference surface], the reference surface error and the processed surface error appear as an addition. Since the above addition means vector sum, they may cancel by chance, or they may overlap and become larger. However, when looking at this from the perspective of quality control, we cannot expect that they will cancel each other out by chance.
We must deal with the worst case scenario.
本発明は上述の事情に鑑みて為されたもので。The present invention has been made in view of the above-mentioned circumstances.
被加工物の表面に実際の基準面が有る場合、工作機械の
カッタを支承する主軸の軸心を、テーブルに対してでは
なく被加工物の基準面に対して所定の姿勢（一般には垂
直）ならしめ、基準面誤差の相加を防止し得る補正機能
を備えた工作機械を提供しようとするものである。上記
の「表面に実際の基準面が有る場合」の実際の基準面と
は、設計図面上で想定した基準面ではなく、実在する部
材の表面であって、加工上の基準とされる面の意である
。ただし、本発明の装置を適用すると、前記実際の基準
面を設計上の基準面に一致させるように制御することも
可能となる。If there is an actual reference plane on the surface of the workpiece, the axis of the main shaft that supports the cutter of the machine tool should be in a predetermined attitude (generally perpendicular) with respect to the reference plane of the workpiece, rather than with respect to the table. It is an object of the present invention to provide a machine tool equipped with a correction function that can prevent addition of standard surface errors. The actual reference surface in the case where the surface has an actual reference surface is not the reference surface assumed on the design drawing, but the surface of the actual member, and is the surface that is used as the reference for processing. I mean it. However, when the device of the present invention is applied, it is also possible to control the actual reference plane to match the designed reference plane.
上記の目的を達成するため、本発明の工作機械は、テー
ブル上に固定されている被加工物の基準面の傾斜を測定
する手段を設けると共に、上記テーブルの傾斜を調節す
る手段を設け、前記加工用機械による加工面と、前記被
加工物の基準面とが平行となるようにテーブルの傾斜を
調節し得る構造としたことを特徴とする。上記の加工面
とは切削工具の軌跡によって定まる面をいう。In order to achieve the above object, the machine tool of the present invention is provided with a means for measuring the inclination of a reference plane of a workpiece fixed on a table, a means for adjusting the inclination of the table, and a machine tool according to the present invention. The present invention is characterized by a structure in which the inclination of the table can be adjusted so that the surface to be processed by the processing machine and the reference surface of the workpiece are parallel to each other. The above-mentioned machined surface refers to a surface determined by the locus of the cutting tool.
上記のようにして、テーブルの傾斜を調節して基準面を
加工面と平行ならしめることにより、加工精度に関する
平行度に、実際の基準面の誤差が混入しなくなる。By adjusting the inclination of the table to make the reference surface parallel to the processing surface as described above, errors in the actual reference surface will not be included in the parallelism related to processing accuracy.
第１図は本発明を適用してテーブルの傾斜を補正できる
ように構成した工作機械の一例の正面図、第２図は第１
図に示した■部付近の部分破断詳細図である。Fig. 1 is a front view of an example of a machine tool configured to correct table inclination by applying the present invention, and Fig. 2 is a front view of an example of a machine tool configured to correct table inclination.
It is a partially broken detailed view of the vicinity of the ■ part shown in the figure.
本図に示した実施例において、左半部は加工部であり、
右半部は計測部である。ただし、テーブル８、及びテー
ブルベース７は矢印Ａ、Ｂの如くベッド１の案内面１２
上を駆動され、加工部と計測部との間を往復移動する。In the embodiment shown in this figure, the left half is the processing section,
The right half is the measurement section. However, the table 8 and table base 7 are connected to the guide surface 12 of the bed 1 as shown by arrows A and B.
It is driven on the top and moves back and forth between the processing section and the measurement section.
実線で描いた８は加工部におけるテーブル位置、鎖線で
描いた８′は計測部におけるテーブル位置を表わしてい
る。8 drawn with a solid line represents the table position in the processing section, and 8' drawn with a chain line represents the table position in the measurement section.
ベッド１上に加工部のコラム２を設置し、案内面１６を
介して主軸頭３を支承する。主軸４は主軸モータ６によ
って回転駆動される構造であって、その先端にカッタ５
を取り付けである。A column 2 of a processing section is installed on a bed 1 and supports a spindle head 3 via a guide surface 16. The main shaft 4 has a structure that is rotationally driven by a main shaft motor 6, and has a cutter 5 at its tip.
It is installed.
本実施例において主軸４は垂直に配設してあり、カッタ
５の刃先は水平面内で回転する。この水平面が本例にお
ける加工面であって、主軸頭３の上下動に伴って上下に
平行移動する。９は、テーブル８上に固着した被加工物
である。In this embodiment, the main shaft 4 is arranged vertically, and the cutting edge of the cutter 5 rotates within a horizontal plane. This horizontal plane is the machining surface in this example, and moves vertically in parallel as the spindle head 3 moves up and down. 9 is a workpiece fixed on the table 8.
一方、ベッド１上に計測用のコラム１１を設置し。On the other hand, a column 11 for measurement is installed on the bed 1.
計測ヘッド１０を支承する。この計測ヘッド１０に、３
個の微小変位計測センサ１３を設ける。Supports the measurement head 10. In this measurement head 10, 3
micro displacement measurement sensors 13 are provided.
本発明を実施する場合、少なくとも３個の微小変位計測
センサを設けて、テーブル８′上の被加工物９′表面の
基準面の傾斜を測定することができる。When carrying out the present invention, at least three minute displacement measuring sensors can be provided to measure the inclination of the reference plane of the surface of the workpiece 9' on the table 8'.
本実施例においては、３個の微小変位計測センサ１３に
より、基準面の法線のベクトルを測定するように構成し
である。In this embodiment, three minute displacement measurement sensors 13 are configured to measure the vector of the normal to the reference plane.
第２図に示すごとく、テーブルベース７とテーブル８と
の間にピエゾアクチュエータ１４を介してボルト１５で
緊定しである。上記のピエゾアクチュエータ１４に電圧
を印加すると、該ピエゾアクチュエータ１４は上下方向
に伸縮し、ボルト１５を弾性的に伸縮させる。このよう
なピエゾアクチュエータ１４を複数個介装設置すること
により、テーブルベース７に対するテーブル８の傾斜を
（傾斜方向および傾斜角）を任意に制御できる。本例に
おいては３個のピエゾアクチュエータ１４を設けである
。As shown in FIG. 2, the table base 7 and the table 8 are tightened with bolts 15 via a piezo actuator 14. When a voltage is applied to the piezo actuator 14, the piezo actuator 14 expands and contracts in the vertical direction, causing the bolt 15 to elastically expand and contract. By intervening and installing a plurality of such piezo actuators 14, the inclination (inclination direction and inclination angle) of the table 8 with respect to the table base 7 can be arbitrarily controlled. In this example, three piezo actuators 14 are provided.
本発明を実施する際、計測センサ１３とピエゾアクチュ
エータ１４とを同数とし、互いに相似関係をなすように
配設すると制御が容易である。When implementing the present invention, control is facilitated if the number of measurement sensors 13 and piezo actuators 14 are the same and are arranged in a similar relationship to each other.
また、ピエゾアクチュエータ１４に代えて、楔部材と、
これを駆動するＤＣモータ及び伝動用部材を設けて、テ
ーブル８の傾斜を制御するように構成することもできる
。Also, instead of the piezo actuator 14, a wedge member,
It is also possible to provide a DC motor for driving this and a transmission member to control the inclination of the table 8.
以上のように構成した本例の工作機械によってワーク（
被加工物９）の表面の大部分を形成している面を基準と
して特定の微小部分（例えば電極面）を、前記の基準面
と平行に、カッタ５で切削する一例のフロー図を第３図
に示す。The workpiece (
The third flowchart shows an example of cutting a specific minute part (for example, an electrode surface) using the cutter 5 in parallel to the reference plane based on a plane that forms most of the surface of the workpiece 9). As shown in the figure.
ステップａで加工を開始すると、まず、テーブル８にワ
ーク（被加工物９）をセットする（ステップｂ）。上記
のテーブル８を矢印Ｂの如く計測部に移動させて８′位
置としくステップＣ）、ワーク表面の法線ベクトルを測
定する（ステップｄ）即ち、ワーク表面の大部分を占め
ている基準面の傾斜方向と傾斜角とを測定する。When machining is started in step a, a workpiece (workpiece 9) is first set on the table 8 (step b). Move the above-mentioned table 8 to the measuring section as indicated by arrow B and set it at the 8' position. Step C). Measure the normal vector of the work surface (Step d). In other words, the reference plane that occupies most of the work surface. The direction and angle of inclination are measured.
次いでテーブル８を矢印Ａの如く加工部に移動させ（ス
テップｅ）、先ず荒加工を行う（ステップｆ）。Next, the table 8 is moved to the machining section as indicated by arrow A (step e), and first rough machining is performed (step f).
荒加工の後、再びテーブル８わ計測部へ移して（ステッ
プｇ）、精度チェックを行い（ステップｈ）、ここで検
査基準に合格した場合を除き基準面の法線ベクトルを測
定して（ステップｉ）、ピエゾアクチュエータ１４（第
２図）を作動せしめてテーブル８′の傾斜を修正しくス
テップｊ）、該テーブルを加工部へ移動させて（ステッ
プｋ）、仕上加工を行う（ステップＱ）。After the rough machining, the table 8 is transferred to the measurement section again (step g), where the accuracy is checked (step h), and the normal vector of the reference surface is measured (step i) The piezo actuator 14 (FIG. 2) is operated to correct the inclination of the table 8' (step j), the table is moved to the processing section (step k), and finishing processing is performed (step Q).
以上説明したように、本発明を適用すると、被加工物の
表面に実際の基準面が有る場合、工作機械のカッタを支
承する主軸の軸心を、テーブルに対してではなく被加工
物の基準面に対して所定の姿勢（一般には垂直）ならし
め、基準面誤差の相加を防止し得るという優れた実用的
効果を奏する。As explained above, when the present invention is applied, when there is an actual reference plane on the surface of the workpiece, the axis of the main spindle that supports the cutter of the machine tool is aligned not with respect to the table but with the reference plane of the workpiece. It has an excellent practical effect of being able to maintain a predetermined attitude (generally perpendicular) to the plane and preventing addition of reference plane errors.
【図面の簡単な説明】
第１図は本発明を適用してテーブルの傾斜を補正できる
ように構成した工作機械の一例の正面図、第２図は第１
図に示した■部付近の部分破断詳細図である。第３図は
上記実施例の使用例を示すフロー図である。
７・・テーブルベース、８・・・テーブル、９・・・被
加工物、１３・・微小変位計測センサ。[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 is a front view of an example of a machine tool configured to correct the inclination of a table by applying the present invention, and Fig.
It is a partially broken detailed view of the vicinity of the ■ part shown in the figure. FIG. 3 is a flow diagram showing an example of use of the above embodiment. 7...Table base, 8...Table, 9...Workpiece, 13...Minute displacement measurement sensor.
Claims (5)
準面の傾斜を測定する手段を設けると共に、上記テーブ
ルの傾斜を調節する手段を設け、前記加工用機械による
加工面と、前記被加工物の基準面とが平行となるように
テーブルの傾斜を調節し得る構造としたことを特徴とす
る、テーブルの傾斜補正型工作機械。(1) A means for measuring the inclination of a reference plane of a workpiece fixed on a table of a machine tool is provided, and a means for adjusting the inclination of the table is provided, so that the machined surface by the processing machine and the workpiece are A table tilt correction type machine tool, characterized by having a structure in which the tilt of the table can be adjusted so that the table is parallel to a reference plane of a workpiece.
ーションと別体に構成して、加工ステーション用の工作
機械ベッド上に設置したものであり、かつ、被加工物を
固定するテーブルは加工ステーションに正対する位置と
、基準面傾斜測定手段に正対する位置との間を相対的に
移動せしめ得る構造であることを特徴とする、特許請求
の範囲第１項に記載のテーブルの傾斜補正型工作機械。(2) The means for measuring the inclination of the reference plane is constructed separately from the machining station and installed on the machine tool bed for the machining station, and the table for fixing the workpiece is Inclination correction of a table according to claim 1, characterized in that the table has a structure that can be relatively moved between a position directly facing the processing station and a position directly facing the reference plane inclination measuring means. Mold machine tool.
の微小変位計測センサを設けたものであることを特徴と
する、特許請求の範囲第２項に記載のテーブルの傾斜補
正型工作機械。(3) The table inclination correction type machine tool according to claim 2, wherein the reference plane inclination measurement means is provided with at least three minute displacement measurement sensors. .
ルとテーブルベースとの間に複数個のピエゾアクチュエ
ータを介装したものであることを特徴とする特許請求の
範囲第１項乃至第３項の内の何れか一つに記載のテーブ
ルの傾斜補正型工作機械。(4) Claims 1 to 3, characterized in that the means for adjusting the inclination of the table includes a plurality of piezo actuators interposed between the table and the table base. An inclination correction type machine tool for the table described in any one of the above.
ルとテーブルベースとの間に複数個の楔部材を介装する
と共に、上記の楔部材を駆動するＤＣモータを設けたも
のであることを特徴とする、特許請求の範囲第２項に記
載のテーブルの傾斜補正型工作機械。(5) The means for adjusting the inclination of the table includes a plurality of wedge members interposed between the table and the table base, and a DC motor for driving the wedge members. A table tilt correction type machine tool according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26505585A JPS62124842A (en) | 1985-11-27 | 1985-11-27 | Machine tool of table tilt correction type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26505585A JPS62124842A (en) | 1985-11-27 | 1985-11-27 | Machine tool of table tilt correction type |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62124842A true JPS62124842A (en) | 1987-06-06 |
| JPH0329535B2 JPH0329535B2 (en) | 1991-04-24 |
Family
ID=17411951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26505585A Granted JPS62124842A (en) | 1985-11-27 | 1985-11-27 | Machine tool of table tilt correction type |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62124842A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07122524A (en) * | 1993-10-21 | 1995-05-12 | Wacker Chemitronic Ges Elektron Grundstoffe Mbh | Work holder for rotary grinder for grinding of semiconductor wafer and method for positioning of said work holder |
| EP1008419A2 (en) * | 1998-12-10 | 2000-06-14 | Fanuc Ltd | Vertical axis translation mechanism |
| EP1043117A2 (en) * | 1999-04-07 | 2000-10-11 | Fuji Seiko Co. Ltd. | Work position adjusting apparatus and adjusting method |
| JP2001328065A (en) * | 2000-05-24 | 2001-11-27 | Hiroshi Eda | Precision machining device |
| JP2005288550A (en) * | 2004-03-31 | 2005-10-20 | Tamura Seisakusho Co Ltd | Precision grinding device and precision grinding method |
| JP2012066381A (en) * | 2011-11-08 | 2012-04-05 | Sumitomo Heavy Ind Ltd | Stage device, gantry type stage device, and method for controlling stage device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61158138A (en) * | 1984-12-28 | 1986-07-17 | Nec Kansai Ltd | Device for removal of protrusino on wafer surface |
-
1985
- 1985-11-27 JP JP26505585A patent/JPS62124842A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61158138A (en) * | 1984-12-28 | 1986-07-17 | Nec Kansai Ltd | Device for removal of protrusino on wafer surface |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07122524A (en) * | 1993-10-21 | 1995-05-12 | Wacker Chemitronic Ges Elektron Grundstoffe Mbh | Work holder for rotary grinder for grinding of semiconductor wafer and method for positioning of said work holder |
| EP1008419A2 (en) * | 1998-12-10 | 2000-06-14 | Fanuc Ltd | Vertical axis translation mechanism |
| EP1008419A3 (en) * | 1998-12-10 | 2002-04-10 | Fanuc Ltd | Vertical axis translation mechanism |
| EP1043117A2 (en) * | 1999-04-07 | 2000-10-11 | Fuji Seiko Co. Ltd. | Work position adjusting apparatus and adjusting method |
| EP1043117A3 (en) * | 1999-04-07 | 2002-05-15 | Fuji Seiki Co.,Ltd. | Work position adjusting apparatus and adjusting method |
| JP2001328065A (en) * | 2000-05-24 | 2001-11-27 | Hiroshi Eda | Precision machining device |
| JP4530479B2 (en) * | 2000-05-24 | 2010-08-25 | 弘 江田 | Precision processing equipment |
| JP2005288550A (en) * | 2004-03-31 | 2005-10-20 | Tamura Seisakusho Co Ltd | Precision grinding device and precision grinding method |
| JP2012066381A (en) * | 2011-11-08 | 2012-04-05 | Sumitomo Heavy Ind Ltd | Stage device, gantry type stage device, and method for controlling stage device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0329535B2 (en) | 1991-04-24 |
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