JPS62124816U - - Google Patents
Info
- Publication number
- JPS62124816U JPS62124816U JP1085386U JP1085386U JPS62124816U JP S62124816 U JPS62124816 U JP S62124816U JP 1085386 U JP1085386 U JP 1085386U JP 1085386 U JP1085386 U JP 1085386U JP S62124816 U JPS62124816 U JP S62124816U
- Authority
- JP
- Japan
- Prior art keywords
- board
- electrode
- coil
- conductor
- buried conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Description
第１図及び第２図はそれぞれ本考案に係るチツ
プ型コイルの構成例を示す断面図である。
符号１は基板、２は電極、３は埋込み導体、４
，４′は予備半田、５は台板、６はコイル、７は
ボビン、８はキヤツプコア。
FIG. 1 and FIG. 2 are sectional views each showing an example of the structure of a chip-type coil according to the present invention. Code 1 is the substrate, 2 is the electrode, 3 is the embedded conductor, 4
, 4' is preliminary solder, 5 is a base plate, 6 is a coil, 7 is a bobbin, and 8 is a cap core.
Claims (1)
極領域に、該基板及び電極を貫通する埋込み導体
を有し、この埋込み導体の端面と電極面とに亘つ
て予備半田が付着され、基板の上側に設置された
コイルのリード線が基板の上面において前記埋込
み導体に接続されているチツプ型コイル。 A board having electrodes printed on at least its lower surface has a buried conductor penetrating the board and the electrode in the electrode area, preliminary solder is attached to the end face of the buried conductor and the electrode surface, and is placed on the upper side of the board. A chip-type coil in which a lead wire of the coil is connected to the embedded conductor on the upper surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1085386U JPS62124816U (en) | 1986-01-28 | 1986-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1085386U JPS62124816U (en) | 1986-01-28 | 1986-01-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62124816U true JPS62124816U (en) | 1987-08-08 |
Family
ID=30797535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1085386U Pending JPS62124816U (en) | 1986-01-28 | 1986-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62124816U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324490A (en) * | 2005-05-19 | 2006-11-30 | Matsushita Electric Ind Co Ltd | Electronic component and manufacturing method thereof |
-
1986
- 1986-01-28 JP JP1085386U patent/JPS62124816U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324490A (en) * | 2005-05-19 | 2006-11-30 | Matsushita Electric Ind Co Ltd | Electronic component and manufacturing method thereof |