JPS62124093A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPS62124093A JPS62124093A JP60261171A JP26117185A JPS62124093A JP S62124093 A JPS62124093 A JP S62124093A JP 60261171 A JP60261171 A JP 60261171A JP 26117185 A JP26117185 A JP 26117185A JP S62124093 A JPS62124093 A JP S62124093A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- gas
- laser beam
- sub
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はレーザ加工装置に係り、特に非平行なうツバ状
の切断面を得るに好適なレーザ加工装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a laser processing device, and more particularly to a laser processing device suitable for obtaining a non-parallel, ridge-shaped cut surface.
レーザ切断方法として、例えば特開昭58−12539
1号公報に示されるように、加工ヘッドを固定垂直のま
まで傾斜面にレーザ光をあてて、別の噴出ノズルのガス
で、その傾斜面に直角な切断面を得ることが知られてい
る。この方法は被加工材の直角方向からレーザ光線を照
射したのと同じ効果を得られるものであるが、被切断面
の形状をテーパー状(ハの字形)に加工するには何らの
効果もなく、平行な切断面が得られるのみであった。As a laser cutting method, for example, Japanese Patent Application Laid-Open No. 58-12539
As shown in Publication No. 1, it is known to shine a laser beam onto an inclined surface while the processing head remains fixed and vertical, and obtain a cut surface perpendicular to the inclined surface using gas from another jet nozzle. . This method can achieve the same effect as irradiating the workpiece with a laser beam from the right angle direction, but it has no effect on processing the shape of the cut surface into a tapered shape. , only parallel cut surfaces were obtained.
本発明の目的は、1個の加工ヘッドによりテーパー状(
ハの字形)切断面の得られるレーザ加工装置を提供する
ことにある。The object of the present invention is to form a tapered (
An object of the present invention is to provide a laser processing device that can obtain a cut surface (in the shape of a square).
一般の切断ではレーザビームと同軸で酸素などのアシス
トガスを細い柱状の流れとして吹きつけ、レーザビーム
のパワーと酸素の反応熱とによって溶断している6本発
明は、これらの現象に鑑み、細い柱状のアシストガスの
流れを均等に分流させれば、その流れにそって溶融、切
断が可能と考えレーザビームと同軸でアシストガスを吹
きつけ、裏面から弱い力のサブガスを吹きつけて板の表
面下でアシストガスが分流する工夫をした。その分流に
よってアシストガスによる熱(酸化反応熱)を受ける区
域幅が裏面のサブノズルに近くなるほど切断幅は広くな
り、テーパー状の切断ができることを特徴とする。In general cutting, an assist gas such as oxygen is blown in a thin columnar flow coaxially with the laser beam, and the power of the laser beam and the reaction heat of oxygen cause the cutting to occur. We believe that if we divide the flow of columnar assist gas evenly, it will be possible to melt and cut along the flow.The assist gas is blown coaxially with the laser beam, and the sub-gas with a weak force is blown from the back side of the plate. We devised a way to split the assist gas at the bottom. The cutting width becomes wider as the width of the area receiving heat (heat of oxidation reaction) due to the assist gas due to the branch flow approaches the sub-nozzle on the back side, and a tapered cut can be made.
以下、本発明の一実施例を第1図により説明する。第1
図はレーザ切断近傍の概略断面図である。An embodiment of the present invention will be described below with reference to FIG. 1st
The figure is a schematic cross-sectional view of the vicinity of laser cutting.
レーザ加工装置はレーザ発振器からのレーザビーム3を
反射1lt8で被加工材6側へ反射させ、加工ヘッド1
の集光レンズ2で加工点へ集光照射し、レーザビーム3
と同軸でアシストガスA(酸素)を吹きつけ、さらに、
裏面からもサブガスB(酸素)を吹きつける構成となっ
ている。この時、加工ヘッドは被加工材6の表面に対し
切断進行方向に逆の10度の角度、すなわち、レーザビ
ーム3及びアシストガスAは10度の角度を有し、サブ
ガスノズルBは5度の角度を有している。これらのガス
は切断部で混合される構造となり、切断進行方向でみた
ガスの流れは第2図の形態が得られる。メインのアシス
トガスAはレーザビーム3に重じようして矢印aからレ
ーザビーム3の照射点に吹きつけられ、穴があく (ピ
アシング)と裏面にまっすぐに吹き出す6しかし、裏面
から弱い力(アシストガスAの1/3〜1/2の力)で
吹きつけているサブガスのために、アシストガスは中央
より分流し、あたかも噴水の水の流れの様になる。この
様な状態で切断が実施されると、レーザビームによって
溶融している溶融スラグ部7は切断ガスの酸化反応熱も
加わって、一般の切断面でみられる平行な柱状溶融から
、テーパー状(ハの字形またはラッパ状)の溶融となり
、そのままのテーパー状切断部が得られる。また、アシ
ストガスの進行方向の前方への流れはサブガスの分流作
用のため1弱められ、切断前方の壁とのぶつかりによる
干渉のため、スムースな上から下への流れとなって良好
な切断面が得られる。本実施例によれば、レーザ切断面
(一般に切断幅と称されている部分)はレーザの照射側
は狭く、裏面は広くテーパー状の切断部を得る効果があ
る。The laser processing device reflects the laser beam 3 from the laser oscillator to the workpiece 6 side by reflection 1lt8, and the processing head 1
The laser beam 3 is focused and irradiated onto the processing point using the condenser lens 2 of the laser beam 3.
Blowing assist gas A (oxygen) coaxially with the
The structure is such that subgas B (oxygen) is also blown from the back side. At this time, the processing head has an angle of 10 degrees opposite to the cutting direction with respect to the surface of the workpiece 6, that is, the laser beam 3 and assist gas A have an angle of 10 degrees, and the subgas nozzle B has an angle of 5 degrees. It has an angle. The structure is such that these gases are mixed at the cutting section, and the gas flow as seen in the direction of cutting progress is obtained as shown in FIG. The main assist gas A is blown from the arrow a to the irradiation point of the laser beam 3, superimposing it on the laser beam 3, and when a hole is made (piercing), it blows out straight to the back surface.6 However, a weak force from the back surface (assist gas Because the sub-gas is blown at 1/3 to 1/2 the force of gas A, the assist gas is separated from the center, resembling the flow of water from a fountain. When cutting is carried out under such conditions, the molten slag part 7 melted by the laser beam is also affected by the heat of the oxidation reaction of the cutting gas, and changes from the parallel columnar melting seen on a typical cut surface to a tapered shape ( This results in a V-shaped or trumpet-shaped melting, resulting in a tapered cut portion as it is. In addition, the forward flow of the assist gas in the advancing direction is weakened by 1 due to the diversion effect of the subgas, and due to interference due to collision with the wall in front of the cutting, the flow becomes smooth from top to bottom, resulting in a good cutting surface. is obtained. According to this embodiment, the laser cut surface (generally referred to as the cutting width) is narrow on the laser irradiation side and wide on the back surface, resulting in a tapered cut portion.
さらに、サブノズル形状を変えて、流量、口径吹き付は
圧力を変えることによっても、テーパー状から半球状や
すりばち状など容易に異なった形状が得られる効果があ
るす
【発明の効果〕
本発明によればレーザ切断時の切断ガス(アシストガス
)の形状を裏面のガスの吹きつけ量によって切断形状を
変えることができる。すなわち、サブノズルの口径を細
くして1強い圧力で吹きつけるとテーパー状のものとな
り、圧力が弱いと鋭角1強いと鈍角になる。また、ノズ
ル口径を太くすると半球状のものが得られ、圧力が強い
と溝形となり、弱いと半球状が得られるので切断幅形状
を任意に形成できる効果がある。Furthermore, by changing the shape of the sub-nozzle and changing the flow rate and pressure of the aperture spray, it is possible to easily obtain different shapes, such as from a tapered shape to a hemispherical shape or a dome shape. According to this method, the shape of the cutting gas (assist gas) during laser cutting can be changed depending on the amount of gas blown onto the back surface. That is, if the diameter of the sub-nozzle is made thinner and the spray is applied with a pressure of 1 degree, the shape will become tapered, and if the pressure is weak, it will become acute; if the pressure is less than 1 degree, it will become obtuse. Further, if the nozzle diameter is increased, a hemispherical shape can be obtained, if the pressure is strong, a groove shape is obtained, and if the pressure is weak, a hemispherical shape is obtained, so there is an effect that the shape of the cutting width can be formed arbitrarily.
第1図は本発明の一実施例の切断部近傍の装置構成を示
す断面図、□第2図は同じく切断ガスの流れを示す概念
図である。
1・・・加工ヘッド、2・・・集光レンズ、3・・・レ
ーザビーム、4・・・ノズル、5・・・サブノズル、6
・・・被加工材、7・・・溶融スラグ部、8・・・反射
鏡。FIG. 1 is a cross-sectional view showing the configuration of an apparatus near a cutting section according to an embodiment of the present invention, and FIG. 2 is a conceptual diagram similarly showing the flow of cutting gas. 1... Processing head, 2... Condensing lens, 3... Laser beam, 4... Nozzle, 5... Sub-nozzle, 6
. . . Workpiece material, 7. Molten slag portion, 8. Reflector.
Claims (1)
置において、レーザビームを集光照射するとともに切断
ガスを吹きつける加工ヘッドと被加工物の裏面から切断
部をはさんで切断ガスのみを吹きつけるサブノズルを配
列し、加工ヘッドとサブノズルから同時に切断ガスを吹
き付けた切断することを特徴としたレーザ加工装置。1. In a processing device that cuts a workpiece by irradiating a laser beam, there is a processing head that irradiates the laser beam in a focused manner and blows a cutting gas, and a processing head that irradiates the workpiece with a focused laser beam and blows a cutting gas, and a cutting part is sandwiched between the back side of the workpiece and only the cutting gas is emitted. A laser processing device characterized by arranging spraying sub-nozzles and performing cutting by simultaneously spraying cutting gas from the processing head and the sub-nozzles.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60261171A JPS62124093A (en) | 1985-11-22 | 1985-11-22 | Laser beam machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60261171A JPS62124093A (en) | 1985-11-22 | 1985-11-22 | Laser beam machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62124093A true JPS62124093A (en) | 1987-06-05 |
Family
ID=17358108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60261171A Pending JPS62124093A (en) | 1985-11-22 | 1985-11-22 | Laser beam machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62124093A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104043904A (en) * | 2014-06-09 | 2014-09-17 | 江苏大学 | Back side-blown gas-assisted laser cutting method and device |
JP2016068132A (en) * | 2014-09-30 | 2016-05-09 | 三菱重工業株式会社 | Laser cutting method |
-
1985
- 1985-11-22 JP JP60261171A patent/JPS62124093A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104043904A (en) * | 2014-06-09 | 2014-09-17 | 江苏大学 | Back side-blown gas-assisted laser cutting method and device |
JP2016068132A (en) * | 2014-09-30 | 2016-05-09 | 三菱重工業株式会社 | Laser cutting method |
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